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Methods for making copper and other metal interconnections in integrated circuits

  • US 6,984,891 B2
  • Filed: 03/26/2001
  • Issued: 01/10/2006
  • Est. Priority Date: 02/27/1998
  • Status: Expired due to Fees
First Claim
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1. An integrated-circuit assembly comprising:

  • an insulative layer having a trench or hole, the trench or hole having an edge;

    a first diffusion barrier having a portion inside the trench or hole; and

    a second diffusion barrier on the insulative layer and having an edge substantially flush with a least a portion of the edge of the trench or hole, with the second diffusion barrier comprising a zinc oxide material and the first diffusion barrier comprising a material different than the zinc oxide material.

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