Method for fabricating a reflective plate of a reflective or transflective LCD with improved angular reflectivity

• US 6,985,205 B2
• Filed: 06/27/2003
• Issued: 01/10/2006
• Est. Priority Date: 08/12/2002
• Status: Expired due to Term

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Jin, Hyun Suk, Chol, Su Seok
• Primary Examiner(s): Chowdhury, Tarifur R.
• Application Number:
  US10/607,240
• Publication Number:
  US 20040027517A1
• Time in Patent Office: 928 Days
• Field of Search: 349/113, 349/187, 430/321, 430/325
• US Class Current: 349/187
• CPC Class Codes: G02F 1/133553 Reflecting elements associated to illuminating devices G02F1/133605

Abstract

Disclosed is a reflective plate of an LCD including a reflective surface, and a plurality of reflective bumps arranged the reflective surface, wherein each of the plurality of bumps forms a part of a sphere, wherein the bumps have a radius and a height, and wherein a ratio of the radius to the height for each of the bumps is a fixed value.

Claims

1. A method for fabricating a reflective plate of an LCD, the method comprising the steps of:

depositing a first photosensitive organic insulating layer on an entire surface of an insulating substrate on which a switching device including a source electrode, a drain electrode and a gate electrode is formed, at a predetermined thickness;

exposing and etching the first organic insulating layer by using a mask having a light transmitting region to form a plurality of first bumps each having a partial sphere shape;

coating a second organic insulating layer on the first organic insulating layer to form a plurality of second bumps, a second bump within the plurality having an infection point, wherein the second bump has a first height (Ha) from the inflection point to the top of the bump and a second height (Hb) from the inflection point to the bottom of the bump, and wherein the ratio (Ha+Hb) to Ha ranges from 2;

1 to 1;

1; and

depositing a reflective metal on the second organic insulating layer having the plurality of second bumps.

2. The method according to claim 1, wherein the radius of the second bump ranges from 3 μ

m to 20 μ

m.

3. The method according to claim 1, wherein a ratio of the radius to the height of the second bump ranges from 20:

1 to 7;

1.

4. The method according to claim 1, wherein a ratio of the radius to the height of the second bump is about 10:

1.

5. The method according to claim 1, wherein the first photosensitive organic insulating layer includes one of BCB, Acryl, Aerogel, and microfoam.