Method of measuring the probability of failure caused only by defects, method of measuring defect limited yield, and system using the same
First Claim
1. A method of calculating a probability of failures (KR) caused only by defects in blocks in a wafer chip comprising:
- inspecting said blocks to detect defects in said blocks and in blocks located around said inspected blocks;
measuring the number of said inspected blocks having failures caused by a reason other than said defects in said inspected blocks located around said inspected blocks having said defects (n1);
measuring the number of said inspected blocks having no failures in said inspected blocks located around said inspected blocks having said defects (n2);
measuring the number of inspected blocks having failures caused by said defects in said inspected blocks having said defects (n3);
measuring the number of inspected blocks having no failures in said inspected blocks having said defects (n4); and
substituting data (n1) through (n4) in formula 1a
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Accused Products
Abstract
A method of calculating a probability of failures caused only by defects, a method of calculating a defect limited yield using the classification of pattern parameters extracted only from the defects, and a system for calculating the probability of failure and the defect limited yield are provided. In one exemplary embodiment for calculating a probability of failures caused only by defects, defects are detected in inspected blocks that have defects and in blocks located around the inspected blocks to measure the number of inspected blocks that have failures caused by reasons other than the defects in the blocks located around the inspected blocks having defects (n1), the number of inspected blocks having no failures in the blocks located around the inspected blocks having the defects (n2), the number of inspected blocks having failures caused by defects in the inspected blocks having defects (n3), and the number of inspected blocks having no failures in the inspected blocks having defects (n4). The data (n1) through (n4) is then substituted in the following formula:
where
and
35 Citations
19 Claims
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1. A method of calculating a probability of failures (KR) caused only by defects in blocks in a wafer chip comprising:
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inspecting said blocks to detect defects in said blocks and in blocks located around said inspected blocks; measuring the number of said inspected blocks having failures caused by a reason other than said defects in said inspected blocks located around said inspected blocks having said defects (n1); measuring the number of said inspected blocks having no failures in said inspected blocks located around said inspected blocks having said defects (n2); measuring the number of inspected blocks having failures caused by said defects in said inspected blocks having said defects (n3); measuring the number of inspected blocks having no failures in said inspected blocks having said defects (n4); and substituting data (n1) through (n4) in formula 1a - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of calculating a probability of failures caused only by defects in each chip of a wafer comprising the steps of:
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determining the total number of wafer chips (m1); detecting defects in each said wafer chip; determining the total number of chips having said defects (m2); determining the total number of chips which fail due to a reason other than said defects (m3); classifying said wafer chips having defects using probable parameters in consideration of area, size, and number of said defects; determining the total number of wafer chips (m4) and the total number of wafer chips which fail (m5) when said wafer chips are classified according to each said probable parameter; and calculating a probability (KR) that said wafer chips fail only due to said defects by substituting the data m1, m2, m3, m4, and m5 in the formula;
- View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of calculating a defect limited yield (DLY) comprising:
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inspecting said blocks to detect defects in said blocks and in blocks located around said inspected blocks; measuring the number of said inspected blocks having failures caused by a reason other than said defects in said inspected blocks located around said inspected blocks having said defects (n1); measuring the number of said inspected blocks having no failures in said inspected blocks located around said inspected blocks having said defects (n2); measuring the number of inspected blocks having failures caused by said defects in said inspected blocks having said defects (n3); measuring the number of inspected blocks having no failures in said inspected blocks having said defects (n4); substituting data (n1) through (n4) in formula 1a substituting KR into formula;
wherein i is 1 to k; wherein k is the total number of wafer chips; and wherein KR is the probability that wafer chips fail.
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15. A method of calculating a defect limited yield (DLY) comprising:
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determining the total number of wafer chips (m1); detecting defects in each said wafer chip; determining the total number of chips having said defects (m2); determining the total number of chips which fail due to a reason other than said defects (m3); classifying said wafer chips having defects using probable parameters in consideration of area, size, and number of said defects; determining the total number of wafer chips (m4) and the total number of wafer chips which fail (m5) when said wafer chips are classified according to each said probable parameter; calculating a probability (KR) that said wafer chips fail only due to said defects by substituting the data m1, m2, m3, m4, and m5 in the formula;
substituting KR into formula;
wherein i is 1 to k; wherein k is the total number of wafer chips; and wherein KR is the probability that wafer chips fail.
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16. A system of calculating a probability of failures (KR) caused only by defects in blocks in a wafer chip comprising:
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a defect detector for inspecting said blocks to detect defects in said blocks and in blocks located around said inspected blocks; and a controller for measuring; the number of said inspected blocks having failures caused by a reason other than said defects in said inspected blocks located around said inspected blocks having said defects (n1); the number of said inspected blocks having no failures in said inspected blocks located around said inspected blocks having said defects (n2); the number of inspected blocks having failures caused by said defects in said inspected blocks having said defects (n3); and the number of inspected blocks having no failures in said inspected blocks having said defects (n4); and
substituting data (n1) through (n4) in formula 1a
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17. A system of calculating a probability of failures caused only by defects in each chip of a wafer comprising:
a controller for determining the total number of wafer chips (m1); detecting defects in each said wafer chip; determining the total number of chips having said defects (m2); determining the total number of chips which fail due to a reason other than said defects (m3); classifying said wafer chips having defects using probable parameters in consideration of area, size, and number of said defects; determining the total number of wafer chips (m4) and the total number of wafer chips which fail (m5) when said wafer chips are classified according to each said probable parameter; and calculating a probability (KR) that said wafer chips fail only due to said defects by substituting the data m1, m2, m3, m4, and m5 in the formula;
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18. A system of calculating a defect limited yield (DLY) comprising:
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a defect detector for inspecting said blocks to detect defects in said blocks and in blocks located around said inspected blocks; and a controller for measuring; the number of said inspected blocks having failures caused by a reason other than said defects in said inspected blocks located around said inspected blocks having said defects (n1); the number of said inspected blocks having no failures in said inspected blocks located around said inspected blocks having said defects (n2); the number of inspected blocks having failures caused by said defects in said inspected blocks having said defects (n3); and the number of inspected blocks having no failures in said inspected blocks having said defects (n4); substituting data (n1) through (n4) in formula 1a substituting KR into formula;
wherein i is 1 to k; wherein k is the total number of wafer chips; and wherein KR is the probability that wafer chips fail.
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19. A system of calculating a defect limited yield (DLY) comprising:
a controller for determining the total number of wafer chips (m1); detecting defects in each said wafer chip; determining the total number of chips having said defects (m2); determining the total number of chips which fail due to a reason other than said defects (m3); classifying said wafer chips having defects using probable parameters in consideration of area, size, and number of said defects; determining the total number of wafer chips (m4) and the total number of wafer chips which fail (m5) when said wafer chips are classified according to each said probable parameter; calculating a probability (KR) that said wafer chips fail only due to said defects by substituting the data m1, m2, m3, m4, and m5 in the formula;
substituting KR into formula;
wherein i is 1 to k; wherein k is the total number of wafer chips; and wherein KR is the probability that wafer chips fail.
Specification