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Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

  • US 6,986,382 B2
  • Filed: 05/16/2003
  • Issued: 01/17/2006
  • Est. Priority Date: 11/01/2002
  • Status: Expired due to Term
First Claim
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1. A heat exchanger comprising:

  • a. an interface layer for cooling a heat source, wherein the interface layer is configured to pass fluid therethrough, further wherein the interface layer includes a micro-porous structure disposed thereon; and

    b. a manifold layer for circulating fluid to and from the interface layer, the manifold layer having a first set fingers and a second set of fingers, wherein the first set of fingers are disposed in parallel with the second set of fingers and arranged to reduce pressure drop within the heat exchanger by reducing a length traveled by the fluid along the interface layer.

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