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Micropump with integrated pressure sensor

  • US 6,986,649 B2
  • Filed: 04/09/2003
  • Issued: 01/17/2006
  • Est. Priority Date: 04/09/2003
  • Status: Active Grant
First Claim
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1. A method for making a micropump device, comprising:

  • providing a substrate, said substrate comprising a first surface and fluidic channels;

    said fluidic channels comprising an inlet channel, an outlet channel and a pumping cavity;

    said inlet channel suitably adapted to receive fluid for transport through said micropump device;

    said outlet channel suitably adapted to purge fluid from said micropump device;

    providing a first valve for effectively permitting flow of fluid from said inlet channel to said pumping cavity, said first valve effectively restricting backflow of purged fluid from said pumping cavity to said inlet, and said first valve deposited through a first opening on said first surface of said substrate;

    providing a second valve for effectively permitting flow of fluid from said pumping cavity to said outlet channel, said second valve effectively restricting backflow of purged fluid from said outlet channel to said pumping cavity, and said second valve deposited through a second opening on said first surface of said substrate;

    effectively disposing a pump actuator over said first opening;

    effectively disposing a cover over said second opening;

    providing a sensing cavity having at least one surface;

    providing a sensing area disposed on at least a portion of at least one sensing cavity surface, wherein said sensing area is capable of at least partial mechanical deformation;

    providing a plurality of piezoresistors disposed within said sensing cavity;

    providing a plurality of contact pads;

    providing a plurality of conductive pathways communicably connecting said piezoresistors and said contact pads;

    providing a substantially monolithic device package, wherein said sensing cavity is substantially internally disposed within said micropump device package; and

    disposing said sensing area substantially near said pump chamber such that mechanical deformation of said sensing area at least partially corresponds to fluid pressure in the region of said pump chamber;

    disposing at least one sensing piezoresistor near said sensing area of said sensing cavity such that mechanical deformation of said sensing area effectively actuates the resistance of said sensing piezoresistor; and

    disposing at least one reference piezoresistor effectively removed from said sensing area of said sensing cavity such that mechanical deformation of said sensing area does not substantially actuate the resistance of said reference piezoresistor.

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