Micropump with integrated pressure sensor

• US 6,986,649 B2
• Filed: 04/09/2003
• Issued: 01/17/2006
• Est. Priority Date: 04/09/2003
• Status: Active Grant

• Current Assignee: Waters Technologies Corporation (Waters Corporation)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Dai, Xunhu, Xie, Chenggang
• Primary Examiner(s): Thorpe, Timothy S.
• Assistant Examiner(s): GILLAN, RYAN P
• Application Number:
  US10/411,031
• Publication Number:
  US 20040202548A1
• Time in Patent Office: 1,014 Days
• Field of Search: 417/413.2, 417/413.3, 417/559, 417/566
• US Class Current: 417/413.2
• CPC Class Codes: A61M 2205/0294 Piezoelectric materials
• CPC Class Codes: A61M 5/14224 Diaphragm type
• CPC Class Codes: F04B 15/08 the liquids having low boiling points
• CPC Class Codes: F04B 43/043 Micropumps

Abstract

An exemplary system and method for manufacturing micropump systems having integrated piezoresistive sensors is disclosed as including inter alia: a substrate, an inlet channel, an outlet channel, a pumping cavity, a first valve for permitting fluid flow from the inlet channel to the pumping cavity and restricting backflow of purged fluid from the pumping cavity to the inlet channel; a second valve for permitting fluid flow from the pumping cavity to an outlet channel and restricting backflow of purged fluid from the outlet channel to the pumping cavity; a pump actuator element; a pressure sensing cavity surface capable of at least partial mechanical deformation; a plurality of piezoresistors disposed within the sensing cavity; a plurality of contact pads; a plurality of conductive pathways connecting the piezoresistors and the contact pads; and a substantially monolithic device package, wherein the sensing cavity is substantially contained within the micropump device package. Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve micropump operation in any microfluidic application. Exemplary embodiments of the present invention representatively provide for piezoresistive pressure sensors that may be readily integrated with existing portable ceramic technologies for the improvement of device package form factors, weights and other manufacturing and/or device performance metrics.

Claims

1. A method for making a micropump device, comprising:

providing a substrate, said substrate comprising a first surface and fluidic channels;

said fluidic channels comprising an inlet channel, an outlet channel and a pumping cavity;

said inlet channel suitably adapted to receive fluid for transport through said micropump device;

said outlet channel suitably adapted to purge fluid from said micropump device;

providing a first valve for effectively permitting flow of fluid from said inlet channel to said pumping cavity, said first valve effectively restricting backflow of purged fluid from said pumping cavity to said inlet, and said first valve deposited through a first opening on said first surface of said substrate;

providing a second valve for effectively permitting flow of fluid from said pumping cavity to said outlet channel, said second valve effectively restricting backflow of purged fluid from said outlet channel to said pumping cavity, and said second valve deposited through a second opening on said first surface of said substrate;

effectively disposing a pump actuator over said first opening;

effectively disposing a cover over said second opening;

providing a sensing cavity having at least one surface;

providing a sensing area disposed on at least a portion of at least one sensing cavity surface, wherein said sensing area is capable of at least partial mechanical deformation;

providing a plurality of piezoresistors disposed within said sensing cavity;

providing a plurality of contact pads;

providing a plurality of conductive pathways communicably connecting said piezoresistors and said contact pads;

providing a substantially monolithic device package, wherein said sensing cavity is substantially internally disposed within said micropump device package; and

disposing said sensing area substantially near said pump chamber such that mechanical deformation of said sensing area at least partially corresponds to fluid pressure in the region of said pump chamber;

disposing at least one sensing piezoresistor near said sensing area of said sensing cavity such that mechanical deformation of said sensing area effectively actuates the resistance of said sensing piezoresistor; and

disposing at least one reference piezoresistor effectively removed from said sensing area of said sensing cavity such that mechanical deformation of said sensing area does not substantially actuate the resistance of said reference piezoresistor.

2. The method of claim 1, wherein said first opening and said second opening comprise the same opening and said pump actuator comprises the cover.

3. The method of claim 1, wherein said first valve and said second valve comprise at least one of a passive valve, a check valve, a passive check valve, a duck-bill valve and a flapper valve.

4. The method of claim 3, wherein said first valve and said second valve comprise at least one of silicone, silicone-based rubber, rubber, metal, metal alloy and polymer.

5. The method of claim 1, wherein said pump actuator comprises a piezoelectric membrane element.

6. The method of claim 1, further comprising the step of aligning said plurality of piezoresistors as substantially orthogonal pairs.

7. The method of claim 1, further comprising the step of sealing said sensing cavity in order to provide a substantially hermetic seal.

8. The method of claim 1, further comprising the step of disposing said contact pads on a substantially exterior surface of said monolithic device package.

9. The method of claim 1, wherein said ceramic monolithic device package is built up from a plurality of ceramic tape layers.

10. The method of claim 9, wherein the resulting multilayer ceramic structure comprises a low temperature cofired ceramic (LTCC).

11. The method of claim 1, further comprising the step of providing a Wheatstone bridge configuration of conductive connection between said piezoresistors and said contact pads.

12. A microfluidic pumping device manufactured in accordance with the method of claim 1, wherein said pump actuator comprises a piezoelectric actuator.

13. The microfluidic pumping device of claim 12, further comprising means for retaining at least one of said first valve and said second valve within a microfluidic channel.

14. The microfluidic pumping device of claim 13, wherein said retaining means comprises at least one of a substantially annular retaining ring, a valve anchor and a seal.

15. The microfluidic pumping device of claim 12, wherein said piezoelectric actuator comprises at least one of a unimorphic piezoelectric membrane element and a bimorphic piezoelectric membrane element.

16. The device of claim 12, wherein the device package comprises at least one of ceramic, glass, a polymer material, metal and a metal alloy.

17. The device of claim 12, further comprising at least one of ceramic tape and DuPont 951 GreenTape.

18. A microfluidic pumping system comprising a plurality of micropump devices manufactured in accordance with the method of claim 1, wherein said plurality of micropumps are in common fluidic communication.

19. The microfluidic pumping system of claim 18, wherein said common fluidic communication of said micropumps comprises at least one of a series configuration and a parallel configuration.

20. A method for making a micropump device, comprising:

providing a substrate, said substrate comprising a first surface and fluidic channels;

said fluidic channels comprising an inlet channel, an outlet channel and a pumping cavity;

said inlet channel suitably adapted to receive fluid for transport through said micropump device;

said outlet channel suitably adapted to purge fluid from said micropump device;

providing a first valve for effectively permitting flow of fluid from said inlet channel to said pumping cavity, said first valve effectively restricting backflow of purged fluid from said pumping cavity to said inlet, and said first valve deposited through a first opening on said first surface of said substrate;

providing a second valve for effectively permitting flow of fluid from said pumping cavity to said outlet channel, said second valve effectively restricting backflow of purged fluid from said outlet channel to said pumping cavity, and said second valve deposited through a second opening on said first surface of said substrate;

effectively disposing a pump actuator over said first opening;

effectively disposing a cover over said second opening;

providing a sensing cavity having at least one surface;

providing a sensing area disposed on at least a portion of at least one sensing cavity surface, wherein said sensing area is capable of at least partial mechanical deformation;

providing a plurality of piezoresistors disposed within said sensing cavity;

providing a plurality of contact pads;

providing a plurality of conductive pathways communicably connecting said piezoresistors and said contact pads;

providing a substantially monolithic device package, wherein said sensing cavity is substantially internally disposed within said micropump device package; and

enclosing said sensing cavity with a layer of ceramic tape.

21. The method of claim 20, further comprising the step of providing means for retaining at least one of said first valve and said second valve within a microfluidic channel.

22. The method of claim 21, wherein said retaining means comprises at least one of a substantially annular retaining ring, a valve anchor and a seal.

23. The method of claim 20, wherein at least one of said pump actuator and said cover are soldered to said first surface of said substrate.