Stackable semiconductor package with solder on pads on which second semiconductor package is stacked

• US 6,987,314 B1
• Filed: 06/30/2004
• Issued: 01/17/2006
• Est. Priority Date: 06/08/2004
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Yoshida, Akito, Heo, Young Wook
• Primary Examiner(s): Pham, Hoai
• Assistant Examiner(s): Farahani, Dana
• Application Number:
  US10/883,593
• Time in Patent Office: 566 Days
• Field of Search: 257/690, 257/691, 257/692, 257/693, 257/698, 257/700, 257/701, 257/702, 257/730, 257/735, 257/736, 257/737, 257/750, 257/773
• US Class Current: 257/698
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and the first side surface of the substrate inward of the pads. A layer of a solder is fused to each of the pads. A lateral distance between immediately adjacent pads is selected to be greater than a lateral distance between sidewalls of the encapsulant and immediately adjacent pads, and a height of the solder layers relative to the first side surface is selected to be less than a height of the sidewalls of the encapsulant, so that misalignment of a semiconductor package stacked on the solder layers/pads is self-correcting when juxtaposed ones of the solder layers and respective solder balls of the second semiconductor package are reflowed and fused together.

Claims

1. A stackable semiconductor package comprising:

a substrate comprising a first side surface including metal first circuit patterns, and a second side surface opposite the first side surface and including metal second circuit patterns,

wherein each of the first circuit patterns includes a respective one of a plurality of first pads, the first pads are aligned in a plurality of rows, each of the first pads is a lateral distance “

a”

from immediately adjacent ones of said first pads, and at least some of the first circuit patterns are electrically coupled through the substrate to at least some of the second circuit patterns;

a semiconductor die electrically coupled to the first circuit patterns;

an encapsulant covering the semiconductor die and a portion of the first side surface of the substrate,

wherein the encapsulant has substantially vertical sidewalls extending a vertical distance “

d”

from the first side surface of the substrate, all of the first pads are external to the encapsulant, and each of the first pads that is immediately adjacent to one of the sidewalls of the encapsulant is a lateral distance “

b”

from the respective sidewall; and

a plurality of layers of a solder,

wherein each of the layers of the solder is fused to a respective one of the first pads, and has an exposed exterior surface portion that faces in a same direction as the first side surface of the substrate and extends a maximum vertical distance “

c”

from the first side surface of the substrate,

wherein each of the solder layers is adapted to be soldered to a respective solder ball of another semiconductor package that is to be stacked on the stackable semiconductor package over the first side surface of the substrate, and

wherein a>

b and c<

d.

2. The stackable semiconductor package of claim 1, wherein each of the layers of the solder is substantially cylindrical.

3. The stackable semiconductor package of claim 1, wherein the exposed exterior surface portion of each of the layers of the solder is arced.

4. The stackable semiconductor package of claim 1, wherein each of the layers of the solder has the form of a trapezoidal prism.

5. The stackable semiconductor package of claim 1, wherein each of the layers of the solder has a polymer core.

6. The stackable semiconductor package of claim 1, wherein the stackable semiconductor package is one of a ball grid array package and a land grid array package.

7. The stackable semiconductor package of claim 1, wherein the encapsulant has four said sidewalls that are arranged so that the encapsulant has a substantially rectangular lateral perimeter, and at least two of the sidewalls are parallel to and immediately adjacent to respective ones of the rows of the first pads.

8. The stackable semiconductor package of claim 7, wherein each of the four sidewalls of the encapsulant is parallel to and immediately adjacent to a respective one of the rows of the first pads.

9. The stackable semiconductor package of claim 1, further comprising a layer of a hardened insulative material covering the first side surface of the substrate between and around the first pads, wherein the layer of the hardened insulative material covers a portion of each of the solder layers, but the exposed exterior surface of each of the solder layers is outward of the layer of the hardened insulative material.

10. An electronic assembly comprising:

a substrate comprising a first side surface including metal first circuit patterns, wherein each of the first circuit patterns includes a respective one of a plurality of first pads, and the first pads are aligned into at least two parallel rows;

a semiconductor die mounted on the first side surface of the substrate and electrically coupled to the first circuit patterns;

an enclosure covering the semiconductor die and a portion of the first side surface of the substrate without covering any of the first pads,

wherein the enclosure has opposed parallel substantially vertical first and second sidewalls, wherein each of the first and second sidewalls is immediately adjacent to and parallel to a respective one of the rows of the first pads;

a plurality of layers of a solder,

wherein each of the layers of the solder is fused to a respective one of the first pads and has an exposed exterior surface portion that faces in a same direction as the first side surface of the substrate, the layers of the solder each being adapted to form an electrical connection with a respective solder ball of a semiconductor package to be stacked thereon, and

wherein a lateral distance “

a”

between immediately adjacent ones of the first pads, a lateral distance “

b”

between each of the first and second sidewalls and the first pads of the row immediately adjacent to the respective sidewall, a vertical distance “

c”

between the first side surface and an uppermost portion of the exterior surface portion of each of the layers of the solder, and a vertical distance “

d”

between the first side surface and an uppermost edge of each of the first and second sidewalls of the enclosure are selected so that a>

b and d<

d.

11. The electronic assembly of claim 10, wherein each of the layers of the solder is substantially cylindrical.

12. The electronic assembly of claim 10, wherein the exposed exterior surface portion of each of the layers of the solder is arced.

13. The electronic assembly of claim 10, wherein each of the layers of the solder has the form of a trapezoidal prism.

14. The electronic assembly of claim 10, wherein each of the layers of the solder has a polymer core.

15. The electronic assembly of claim 10, wherein the substrate further comprises a second side surface opposite the first side surface and including second circuit patterns, wherein at least some of the first circuit patterns are electrically coupled through the substrate to at least some of the second circuit patterns so that the semiconductor die is electrically coupled to the second circuit patterns.

16. The electronic assembly of claim 10, wherein at least two parallel rows of the first pads are between the first sidewall of the enclosure and a nearest parallel edge of the first side surface of the substrate.

17. The electronic assembly of claim 10, wherein the enclosure has four of said sidewalls, each of which is parallel to and immediately adjacent to a respective one of said rows of first pads.

18. The electronic assembly of claim 10, wherein the enclosure is selected from the group of a plastic encapsulant and a hollow cap.

19. An electronic assembly comprising:

a substrate comprising a first side surface including metal first circuit patterns, wherein each of the first circuit patterns includes a respective one of a plurality of first pads, and the first pads are aligned into at least two parallel rows;

a semiconductor die mounted on the first side surface of the substrate and electrically coupled to the first circuit patterns in a flip chip connection,

wherein the semiconductor die has a rectangular perimeter formed by four substantially vertical sidewalls, and at least two of the sidewalls are immediately adjacent to, and parallel to, a respective one of the rows of first pads;

a plurality of layers of a solder,

wherein each of the layers of the solder is fused to a respective one of the first pads and has an exposed exterior surface portion that faces in a same direction as the first side surface of the substrate, the layers of the solder each being adapted to form an electrical connection with a solder ball of a semiconductor package to be stacked thereon, and

wherein a lateral distance “

a”

between immediately adjacent ones of the first pads, a lateral distance “

b”

between each of the first and second sidewalls of the semiconductor die and the first pads of the row immediately adjacent to the respective sidewall, a vertical distance “

c”

between the first side surface and an uppermost portion of the exterior surface portion of each of the layers of the solder, and a vertical distance “

d”

between the first side surface of the substrate and an uppermost edge of each of the sidewalls of the semiconductor die are selected so that a>

b and c<

d.

20. The electronic assembly of claim 19, wherein each of the layers of the solder is substantially cylindrical.

21. The electronic assembly of claim 19, wherein the exposed exterior surface portion of each of the layers of the solder is arced.

22. The electronic assembly of claim 19, wherein each of the layers of the solder has the form of a trapezoidal prism.

23. The electronic assembly of claim 19, wherein the substrate further comprises a second side surface opposite the first side surface, the second side surface including second circuit patterns, wherein at least some of the first circuit patterns are electrically coupled through the substrate to at least some of the second circuit pattern so the semiconductor die is electrically coupled to the second circuit patterns.

24. The electronic assembly of claim 19, further comprising a layer of a hardened insulative material between the semiconductor die and the first side surface of the substrate and covering the first side surface of the substrate between and around the first pads, wherein the layer of the hardened insulative material covers a portion of each of the solder layers, but the exposed exterior surface of each of the solder layers is outward of the layer of the hardened insulative material.