Forming an optical element on the surface of a light emitting device for improved light extraction
First Claim
1. A method of forming a light emitting device, said method comprising:
- forming at least one of Fresnel lens and holographic diffuser on at least one surface of a semiconductor light emitter to affect light emitted by said semiconductor light emitter;
wherein the at least one surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy.
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Accused Products
Abstract
Provided is a light emitting device including a Fresnel lens and/or a holographic diffuser formed on a surface of a semiconductor light emitter for improved light extraction, and a method for forming such light emitting device. Also provided is a light emitting device including an optical element stamped on a surface for improved light extraction and the stamping method used to form such device. An optical element formed on the surface of a semiconductor light emitter reduces reflective loss and loss due to total internal reflection, thereby improving light extraction efficiency. A Fresnel lens or a holographic diffuser may be formed on a surface by wet chemical etching or dry etching techniques, such as plasma etching, reactive ion etching, and chemically-assisted ion beam etching, optionally in conjunction with a lithographic technique. In addition, a Fresnel lens or a holographic diffuser may be milled, scribed, or ablated into the surface. Stamping, an alternative method for forming an optical element, can also be used to form a Fresnel lens or a holographic diffuser on the surface of a semiconductor light emitter. Stamping includes pressing a stamping block against the surface of a light emitting diode. The stamping block has a shape and pattern that are the inverse of the desired optical element. Optionally, stamping can be done before, after, or concurrently with wafer-bonding. Alternatively, a material can be stamped and later bonded to the semiconductor light emitter.
228 Citations
53 Claims
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1. A method of forming a light emitting device, said method comprising:
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forming at least one of Fresnel lens and holographic diffuser on at least one surface of a semiconductor light emitter to affect light emitted by said semiconductor light emitter;
wherein the at least one surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a light emitting device, said method comprising:
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forming at least one of Fresnel lens and holographic diffuser on at least one surface of a semiconductor light emitter to affect light emitted by said semiconductor light emitter;
wherein said forming comprises at least one method selected from ablation, machining, scribing, and electron discharge machining; and
wherein the at least one surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy.
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12. A light emitting device comprising:
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a semiconductor light emitter; and
a first optical element stamped on at least one surface of said semiconductor light emitter, said first optical element comprising one of Fresnel lens and holographic diffuser;
wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of forming a light emitting device, said method comprising:
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stamping at least one optical element on at least one surface of a semiconductor light emitter to affect the light emitted by said semiconductor light emitter wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35)
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36. A light emitting device comprising:
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a semiconductor light emitter; and
at least one optical element stamped on at least one surface of said semiconductor light emitter, wherein said optical element is a first optical element;
wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43)
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44. A light emitting diode array comprising a plurality of light emitting devices, a light emitting device comprising:
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a semiconductor light emitter; and
one of a Fresnel lens and a holographic diffuser stamped on a surface of said semiconductor light emitter;
wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy.
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45. A light emitting array comprising a plurality of light emitting devices, a light emitting device comprising:
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a semiconductor light emitter; and
an optical element stamped on a surface of said semiconductor light emitter;
wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy.
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46. A display device comprising at least one blue light emitting device, at least one green light emitting device, and at least one red light emitting device, wherein at least one of said blue light emitting device, green light emitting device, and red light emitting device comprises:
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a semiconductor light emitter; and
one of a Fresnel lens and a holographic diffuser stamped on a surface of said semiconductor light emitter;
wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy.
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47. A display device comprising at least one blue light emitting device, at least one green light emitting device, and at least one red light emitting device, wherein at least one of said blue light emitting device, green light emitting device, and red light emitting device comprises:
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a semiconductor light emitter; and
one optical element stamped on a surface of said semiconductor light emitter;
wherein the stamped surface is one of an alloy comprising (AlxGa1-x)yIn1-yP where 0≦
x≦
1 and 0≦
y≦
1 and a III-nitride alloy.
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48. A method for forming a light emitting device, said method comprising:
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stamping an optical element in a material, said material being transparent to light emitted from said light emitting device, said material being one of high index optical glass, III-V semiconductors, II-VI semiconductors, group IV semiconductors, high-index organic semiconductors, high index organic compounds, and mixtures or alloys thereof; and
bonding said material to a semiconductor light emitter, the bond being formed at an interface between the material and a surface of the semiconductor light emitter from which light exits the emitter. - View Dependent Claims (49, 50, 51, 52)
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53. A light emitting device comprising:
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a semiconductor light emitter; and
an optical element stamped on a material transparent to light emitted from said light emitting device, said material being one of high index optical glass, III-V semiconductors, II-VI semiconductors, group IV semiconductors, high-index organic semiconductors, high index organic compounds, and mixtures or alloys thereof;
wherein said material is bonded to said semiconductor light emitter, the bond being formed at an interface between the material and a surface of the semiconductor light emitter from which light exits the emitter.
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Specification