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Micro-chimney and thermosiphon die-level cooling

  • US 6,988,531 B2
  • Filed: 01/11/2002
  • Issued: 01/24/2006
  • Est. Priority Date: 01/11/2002
  • Status: Expired due to Term
First Claim
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1. A method for dissipating heat from a localized area within a semiconductor die, the method comprising:

  • providing a semiconductor die constructed and arranged to include at least one conduit portion within the die, at least a portion of the conduit portion being proximate to the localized area, the conduit portion being at least partially filled with a heat-dissipating material;

    absorbing, by the conduit portion, heat from the localized area; and

    dissipating, by the conduit portion, at least a portion of the heat away from the localized area.

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