Micro-chimney and thermosiphon die-level cooling
First Claim
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1. A method for dissipating heat from a localized area within a semiconductor die, the method comprising:
- providing a semiconductor die constructed and arranged to include at least one conduit portion within the die, at least a portion of the conduit portion being proximate to the localized area, the conduit portion being at least partially filled with a heat-dissipating material;
absorbing, by the conduit portion, heat from the localized area; and
dissipating, by the conduit portion, at least a portion of the heat away from the localized area.
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Accused Products
Abstract
A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.
17 Citations
27 Claims
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1. A method for dissipating heat from a localized area within a semiconductor die, the method comprising:
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providing a semiconductor die constructed and arranged to include at least one conduit portion within the die, at least a portion of the conduit portion being proximate to the localized area, the conduit portion being at least partially filled with a heat-dissipating material; absorbing, by the conduit portion, heat from the localized area; and dissipating, by the conduit portion, at least a portion of the heat away from the localized area. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor die comprising;
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at least one conduit disposed within the die a first portion of the conduit being proximate to a localized area, and a second portion of the conduit having an end portion at a face of the die; and a heat-dissipating material at least partially filling the conduit, wherein the conduit is constructed and arranged to absorb heat from the localized area and to dissipate at least a portion of the heat away from the localized area. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor die comprising;
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a microprocessor circuit; at least one conduit disposed within the die, a first portion of the conduit being proximate to the microprocessor circuit, and a second portion of the conduit having an end portion at a face of the die; and a heat-dissipating material at least partially filling the conduit, wherein the conduit is constructed and arranged to absorb heat from the microprocessor circuit and to dissipate at least a portion of the heat away from the microprocessor circuit. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification