IC card and method of manufacturing the same

• US 6,988,668 B2
• Filed: 09/24/2003
• Issued: 01/24/2006
• Est. Priority Date: 10/08/2002
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Hitachi ULSI Systems Company Limited (Hitachi, Ltd.), Renesas Technology Corporation (Renesas Electronics Corporation)
• Inventors: Osawa, Kenji, Higuchi, Akira, Osako, Junichiro, Nishizawa, Hirotaka
• Primary Examiner(s): Stcyr, Daniel
• Assistant Examiner(s): TAYLOR, APRIL ALICIA
• Application Number:
  US10/668,229
• Publication Number:
  US 20040066693A1
• Time in Patent Office: 853 Days
• Field of Search: 235/488, 235/492, 235/487
• US Class Current: 235/492
• CPC Class Codes: B29C 2045/1673 injecting the first layer, then feeding the insert, then injecting the second layer
• CPC Class Codes: B29C 45/14647 Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1657 using means for adhering or bonding the layers or parts to each other mechanical anchoring B29C37/0082
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H05K 1/117 : Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/10159 : Memory
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1572 : Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence

Abstract

An IC body is loaded on a case made of a thermoplastic resin material and sealed to the case with a sealing portion made of thermoplastic resin material, whereby an IC card is manufactured. The IC body includes a wiring substrate formed with an external connection terminal at a back surface thereof, a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via an interconnect, and a sealing portion made of thermoplastic resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. Thus, making it possible to increase the strength of IC cards and, at the same time, to reduce the manufacturing cost and improve the reliability.

Claims

1. An IC card comprising:

a semiconductor device having a semiconductor chip at least partially sealed with a first sealing portion made of a thermosetting resin material and mounted over a front surface of a wiring substrate, and having, over a rear surface of the wiring substrate, an external connection terminal electrically connected to the semiconductor chip;

a case, covering the first sealing portion and the front surface of the wiring substrate, which is made of a thermoplastic resin material and to which the semiconductor device is loaded; and

a second sealing portion which is made of a thermoplastic resin material bonded to the case, the second sealing portion covering the rear surface of the wiring substrate so as to seal the semiconductor device and expose the external connection terminal, thereby integrating the semiconductor device with the case.

2. An IC card according to claim 1, wherein the semiconductor device has a connecting member for electrically connecting an interconnect of the wiring substrate with the semiconductor chip, and the first sealing portion covers the connecting member.

3. An IC card according to claim 1, wherein the second sealing portion is formed to cover a region, other than the external connection terminal, of the rear surface of the wiring substrate.

4. An IC card according to claim 1, wherein the case and the second sealing portion are made of the same material.

5. An IC card according to claim 1, wherein the second sealing portion is welded to an interface portion of the case.

6. An IC card according to claim 1, wherein the rear surface of the wiring substrate has a projecting portion, the external connection terminal is formed over the projecting portion of the rear surface, and the second sealing portion is formed to cover a region, other than the projecting portion, of the rear surface.

7. An IC card according to claim 1, wherein the first sealing portion is made of an epoxy resin containing a silica filler.

8. An IC card according to claim 1,

wherein the semiconductor device further comprises:

a die pad portion, the semiconductor chip being disposed over the die pad portion; and

a lead portion electrically connected to the semiconductor chip; and

wherein the first sealing portion covers the die pad portion, the semiconductor chip and the lead portion and exposes, as the external connection terminal, a part of the lead portion from an outer surface of the first sealing portion.

9. An IC card according to claim 1, wherein the second sealing portion has a portion molded to the case.

10. An IC card according to claim 1, wherein the second sealing portion has a first portion bonded to the case and a second portion bonded to the wiring substrate.

11. An IC card according to claim 10, wherein said first and second portions of the second sealing portion are unitary with each other.

12. An IC card according to claim 11, wherein said second portion of the second sealing portion is bonded to the rear surface of the wiring substrate.

13. An IC card according to claim 11, wherein said second portion of the second sealing portion is bonded to a peripheral edge of the wiring substrate.

14. An IC card according to claim 1, wherein the second sealing portion has a portion molded to the rear surface of the wiring substrate and a portion molded to a peripheral edge of the wiring substrate.

15. An IC card comprising:

a substrate having a front surface and a rear surface;

a semiconductor chip mounted over the front surface of the substrate;

a first sealing portion formed of a thermosetting resin material and covering the semiconductor chip and a portion of the front surface adjacent to the semiconductor chip;

a plurality of external connection terminals arranged over the rear surface of the substrate;

a second sealing portion formed of a thermoplastic resin material and covering the rear surface of the substrate such that the plurality of external connection terminals are exposed; and

a case covering the first sealing portion and formed of a thermoplastic resin to which the second sealing portion adheres.

16. An IC card according to claim 15, wherein the first sealing portion is formed of an epoxy resin, and

wherein each of the second sealing portion and the case is formed with a material selected from the group consisting of a polycarbonate, ABS (acrylonitrile butadiene styrene resin), PBT (polybutylene terephthalate), PPE (polyphenylene ether), nylon, LCP (liquid crystal polymer), PET (polyethylene terephthalate), and mixtures thereof.

17. An IC card according to claim 15, wherein the second sealing portion has a lower content of glass filler than the first sealing portion.

18. An IC card according to claim 15, wherein the case has a lower content of glass filler than the first sealing portion.

19. An IC card according to claim 15, wherein part of the second sealing portion is arranged between the plurality of external connection terminals.

20. An IC card according to claim 15, wherein a rear surface of the case has a recessed portion, and

wherein the first sealing portion and the substrate are disposed in the recessed portion.

21. An IC card according to claim 20, wherein no adhesive is disposed between any of the first sealing portion, the substrate and the recessed portion.

22. An IC card according to claim 15, comprising a plurality of semiconductor chips mounted over the front surface of the substrate.

23. An IC card according to claim 22, wherein the plurality of semiconductor chips includes a flash memory chip and a controller chip for the flash memory chip.

24. An IC card comprising:

an IC body having a front surface and a rear surface, the IC body including a substrate, a semiconductor chip, a plurality of external connection terminals and a first sealing portion formed of a first material and covering the semiconductor chip and a portion of the front surface adjacent to the semiconductor chip;

a second sealing portion covering the rear surface of the IC body such that the plurality of external connection terminals are exposed, the second sealing portion being formed of a second material different from the first material; and

a case receiving the IC body and formed of the second material, and to which the second sealing portion is welded.

25. An IC card according to claim 24, wherein the first material is an epoxy resin, and

wherein the second material is formed with a material selected from the group consisting of a polycarbonate, ABS (acrylonitrile butadiene styrene resin), PBT (polybutylene terephthalate), PPE (polyphenylene ether), nylon, LCP (liquid crystal polymer), PET (polyethylene terephthalate), and mixtures thereof.

26. An IC card according to claim 24, wherein the second material has a lower content of glass filler than the first material.

27. An IC card according to claim 24, wherein part of the second sealing portion is arranged between the plurality of external connection terminals.

28. An IC card according to claim 24, wherein a rear surface of the case has a recessed portion, and

wherein the IC body is disposed in the recessed portion.

29. An IC card according to claim 28, wherein no adhesive exists between the IC body and the recessed portion.

30. An IC card according to claim 24, wherein the IC body includes a plurality of semiconductor chips.

31. An IC card according to claim 30, wherein the plurality of semiconductor chips includes a flash memory chip and a controller chip for the flash memory chip.

32. An IC card comprising:

a substrate having a front surface and a rear surface;

a semiconductor chip mounted over the front surface of the substrate;

a first sealing portion formed of a first material and covering the semiconductor chip and a portion of the front surface adjacent to the semiconductor chip;

a plurality of external connection terminals arranged over the rear surface of the substrate;

a second sealing portion formed of a material different from the first material and having a first portion and a second portion, wherein the first portion covers the rear surface of the substrate such that the plurality of external connection terminals are exposed; and

a case formed of the second material and having a first portion and a second portion, wherein the first portion of the case covers the first sealing portion, and the second portion of the case is formed integrally with the second portion of the second sealing portion.

33. An IC card according to claim 32, wherein the second material has a lower content of glass filler than the first material.

34. An IC card according to claim 32, wherein a part of the second sealing portion is arranged between the plurality of external connection terminals.

35. An IC card according to claim 32, wherein the rear surface of the case has a recessed portion, and

wherein the first sealing portion is disposed in the recessed portion.

36. An IC card according to claim 35, wherein no adhesive exists between the first sealing portion and the recessed portion.

37. An IC card according to claim 32, comprising a plurality of semiconductor chips.

38. An IC card according to claim 37, wherein the plurality of semiconductor chips includes a flash memory chip and a controller chip for the flash memory chip.