Lamp housing containing an integrated LED support structure
First Claim
1. A lamp assembly comprising:
- a. a housing having an interior surface and an exterior surface;
b. a conductive lead frame insert molded so that the conductive lead frame is encapsulated in between the interior surface and the exterior surface of the housing, the conductive lead frame having at least one positive connection pad, located at the interior surface of the housing, at least one negative connection pad located substantially adjacent to the at least one positive connection pad at the interior surface of the housing, and a means to electrically communicate the at least one positive connection pad and the at least one negative connection pad to the exterior surface of the housing so that electricity can pass through the lead frame and the at least one positive connection pad and at least one negative connection pad; and
c. at least one light emitting diode light source positioned inside the housing and electrically connected across the at least one negative connection pad and the at least one positive connection pad.
9 Assignments
0 Petitions
Accused Products
Abstract
A lamp assembly with an integrated Light Emitting Diode support frame is described. An electrically conductive lead frame is encapsulated in between the interior and exterior surfaces of a lamp housing. Surface mounted LED light sources and associated drive components are attached to the lead frame, and thus to the housing. A positive terminal and a negative terminal are formed from the lead frame on the inside to the outside of the housing, so that electricity may be transmitted from an external source to the LED light sources on the inside of the housing. The LED light sources are energized by the conductive lead frame formed into or onto the housing, thus eliminating the need for a separate printed circuit board with a conductive lead frame.
43 Citations
12 Claims
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1. A lamp assembly comprising:
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a. a housing having an interior surface and an exterior surface; b. a conductive lead frame insert molded so that the conductive lead frame is encapsulated in between the interior surface and the exterior surface of the housing, the conductive lead frame having at least one positive connection pad, located at the interior surface of the housing, at least one negative connection pad located substantially adjacent to the at least one positive connection pad at the interior surface of the housing, and a means to electrically communicate the at least one positive connection pad and the at least one negative connection pad to the exterior surface of the housing so that electricity can pass through the lead frame and the at least one positive connection pad and at least one negative connection pad; and c. at least one light emitting diode light source positioned inside the housing and electrically connected across the at least one negative connection pad and the at least one positive connection pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 12)
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8. A method for manufacturing a lamp assembly, the method comprising the steps of:
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a. providing a conductive lead frame, the conductive lead frame comprising at least one positive connection pad and at least one negative connection pad; b. inserting the conductive lead frame into a molding cavity; c. molding a housing with an interior surface and an exterior surface around the lead frame in the molding cavity by injecting a plastic resin into the molding cavity, so that the conductive lead frame is encapsulated by the housing and the at least one positive connection pad and at least one negative connection pad extend to the interior surface of the housing; d. removing the housing with the lead frame molded therein from the molding cavity; and e. electrically connecting at least one light emitting diode to the lead frame across said at least one positive connection pad and said at least one negative connection pad inside the housing. - View Dependent Claims (9, 10, 11)
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Specification