Curing light

• US 6,988,890 B2
• Filed: 02/06/2002
• Issued: 01/24/2006
• Est. Priority Date: 09/24/1999
• Status: Expired due to Term

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US10/071,847
• Publication Number:
  US 20020172912A1
• Time in Patent Office: 1,448 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/119, 362/800, 362/804
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/0608 in the same heat affected zone [HAZ] B23K26/0613, B23K26/0619 take precedence
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0643 comprising mirrors
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14

Abstract

A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A curing light comprising:

a housing for housing components of a curing light,

air space within said housing,

at least one vent located on said housing,

a secondary heat sink located within said housing, said heat sink having a proximal and a distal side,

a thermoelectric cooler to assist in heat dissipation located on said secondary heat sink proximal side,

a fan located within said housing, said fan being capable of causing air to move past said thermoelectric cooler in order to improve heat dissipation,

an elongate light transport device for transporting a focused light beam to a remote location for use in curing, said light transport device having a longitudinal axis,

a plurality of light emitting semiconductor modules located on said heat sink, each of said semiconductor modules including

a primary heat sink,

a well in said primary heat sink,

said well having a light-reflective wall,

a semiconductor chip which emits light of a wavelength useful for curing light curable composite materials, said chip being affixed to said primary heat sink in said well,

a cover serving to protect said chip,

said light-reflective wall serving to reflect at least some light emitted by said chip in a direction that is generally orthogonal to said light transport device longitudinal axis,

at least some of said light emitting semiconductor modules emitting light in a direction that is generally orthogonal to said light transport device longitudinal axis as a result of being reflected from light-reflective walls of said wells,

a reflective light collecting device which collects light emitted by said light emitting semiconductor modules traveling generally orthogonal to said light transport device longitudinal axis and reflects it in a new direction as an unfocused light beam traveling generally in the direction of said light transport device longitudinal axis so that it may strike a focusing lens, and

a focusing lens which serves to receive an unfocused light beam from said reflective light collecting device and focus said unfocused light beam toward a light transport device as a focused light beam.

2. A curing light as recited in claim 1 wherein said light transport device is selected from the group consisting of a plastic stack, a fiber bundle and a light guide.

3. A curing light as recited in claim 1 wherein said light transport device is a barrel with a proximal end and a distal end, said barrel having a mirror located at its distal end for receiving a focused light beam from said focusing lens and reflecting said focused light beam toward a dental surface.

4. A curing light as recited in claim 1 wherein said semiconductor chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip arrays, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

5. A curing light comprising:

an elongate light transport device for transporting a focused light beam to a remote location for use in curing, said light transport device having a longitudinal axis,

a heat sink,

a well in said heat sink,

a light-reflective wall on said well,

a plurality of light emitting semiconductor chips located on said heat sink, each in a well,

at least some of the light emitted by said chips striking said light reflective wall and being reflected in a direction that is generally orthogonal to said light transport device longitudinal axis,

at least one of said light emitting semiconductor devices emitting light in a direction that is generally orthogonal to said light transport device longitudinal axis,

a light reflector which reflects light emitted generally orthogonal to said light transport device longitudinal axis and reflects it onto a focusing lens, and

a focusing lens which serves to receive an unfocused light beam from said light reflector and focus said unfocused light beam into a focused light beam.