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Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers

  • US 6,989,607 B2
  • Filed: 07/29/2003
  • Issued: 01/24/2006
  • Est. Priority Date: 03/20/2002
  • Status: Expired due to Fees
First Claim
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1. An electronic structure, comprising:

  • a substrate, wherein the substrate is selected from the group consisting of a ceramic chip carrier, an organic chip carrier, and a printed circuit board; and

    a semiconductor device electrically coupled to the substrate, wherein the semiconductor device is divided into a plurality of segments, wherein at least one segment of the plurality of segments is not congruent with respect to a remaining segment of the plurality segments, wherein the substrate comprises a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of the semiconductor device, and wherein said at least one segment of the plurality of segments is a circular segment.

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