Methods for shielding one or more circuit of a printed circuit board
First Claim
1. A method for shielding one or more circuits of a printed circuit board, comprising the steps of:
- depositing a first layer of metal on a substrate of the printed circuit board;
depositing a first layer of dielectric material on the first layer of metal;
printing more than one circuit on the first dielectric layer;
depositing a second dielectric layer over the first dielectric layer and over the more than one printed circuit thereon;
forming a trench opening in the two layers of dielectric material such that the trench opening surrounds the more than one printed circuit, and the metal of the first layer is exposed by the trench opening;
depositing a second layer of metal over the second layer of dielectric material such that the second layer of metal plates the trench opening and makes electrical contact with the first metal layer; and
providing one or more gaps in the metal deposited in the trench opening and routing a circuit trace therethrough.
3 Assignments
0 Petitions
Accused Products
Abstract
Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21′) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21′), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21′) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).
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Citations
5 Claims
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1. A method for shielding one or more circuits of a printed circuit board, comprising the steps of:
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depositing a first layer of metal on a substrate of the printed circuit board; depositing a first layer of dielectric material on the first layer of metal; printing more than one circuit on the first dielectric layer; depositing a second dielectric layer over the first dielectric layer and over the more than one printed circuit thereon; forming a trench opening in the two layers of dielectric material such that the trench opening surrounds the more than one printed circuit, and the metal of the first layer is exposed by the trench opening; depositing a second layer of metal over the second layer of dielectric material such that the second layer of metal plates the trench opening and makes electrical contact with the first metal layer; and
providing one or more gaps in the metal deposited in the trench opening and routing a circuit trace therethrough. - View Dependent Claims (2, 3, 4, 5)
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Specification