Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components

• US 6,990,750 B2
• Filed: 07/25/2003
• Issued: 01/31/2006
• Est. Priority Date: 03/31/2000
• Status: Expired due to Fees

• Current Assignee: Air Liquide Industrial US LP (Air Liquide SA)
• Original Assignee: Air Liquide America LP (Mitsubishi Chemical Group Corp.)
• Inventors: Boyce, Kristen, Theriault, Martin, Rabia, Stephane
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): NGUYEN, CAMTU TRAN
• Application Number:
  US10/627,320
• Publication Number:
  US 20040143989A1
• Time in Patent Office: 921 Days
• Field of Search: 343/80, 343/89, 34444-446, 344/67, 34474-477, 344/93, 344/94, 341/92, 341/95, 341/97, 342/01, 342/02, 342/11, 342/12, 342/18, 62/78, 165/47.T, 312 31- 3103
• US Class Current: 34/380
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67769 Storage means

Abstract

The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Claims

1. A method eliminating moisture from electronic components, the method comprising:

storing electronic components in a storage area;

maintaining a warm and dry atmosphere in the storage area by enclosing the storage area and injecting a warm and dry gas into the storage area at a flow rate and temperature which are controlled to eliminate moisture from the components in the storage area, wherein the resulting moisture level in the components accounts for 0.1% or less of the weight of the electronic components.

2. The method of claim 1, wherein the component storage area is a feeder cart for storing the components.

3. The method of claim 1, wherein the component storage area is a cabinet receiving at least one feeder cart for storing the components.

4. The method of claim 1, wherein the component storage area is a storage cabinet for storing the components.

5. The method of claim 1, wherein the temperature control system controls the temperature of the dry gas to about 10°

C. to about 60 °

C.

6. The method of claim 1, wherein the temperature control system controls the temperature of the dry gas to about 20°

C. to about 50°

C.

7. The method of claim 1, wherein a flow rate of the dry gas delivered to the storage area is controlled by a control system including a humidity sensor within the component storage area.