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Electroosmotic microchannel cooling system

  • US 6,991,024 B2
  • Filed: 06/27/2003
  • Issued: 01/31/2006
  • Est. Priority Date: 09/28/2001
  • Status: Expired due to Fees
First Claim
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1. A cooling system for a hear emitting device, the cooling system operating using a fluid having a liquid phase, the cooling system comprising:

  • a substrate including at least a portion of microchannel disposed therein, the substrate adapted to physically connect to the heat emitting device, thereby providing for the transfer of thermal energy from the heat emitting device to the substrate, and the further transfer of thermal energy from the to the fluid disposed within the microchannel, the microchannel configured to provide flow of the fluid therethrough;

    a heat exchanger configured to provide flow of the fluid therethrough and the transfer of thermal energy out of the fluid, a high flow rate electroosmotic pump the electroosmotic pump creating the flow of the fluid and managing a plurality of generated gases; and

    wherein the substrate, the heat exchanger, and the electroosmotic pump are configured to operate together to create a closed loop fluid flow.

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