Scanning exposure apparatus
First Claim
1. A management apparatus for managing a line width of a pattern formed by an exposure process in a shot area on a substrate, the apparatus comprising:
- a storage device for storing a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate; and
a prediction device for predicting a line width condition of a pattern to be formed on the substrate at a plurality of positions in the shot area on the basis of the stored relationship and information of the coincidence condition detected in the exposure process.
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Accused Products
Abstract
A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.
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Citations
32 Claims
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1. A management apparatus for managing a line width of a pattern formed by an exposure process in a shot area on a substrate, the apparatus comprising:
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a storage device for storing a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate; and
a prediction device for predicting a line width condition of a pattern to be formed on the substrate at a plurality of positions in the shot area on the basis of the stored relationship and information of the coincidence condition detected in the exposure process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An exposure apparatus for forming a pattern in a shot area on a substrate by exposing the substrate using a mask on which a circuit pattern is formed, the exposure apparatus comprising:
a management apparatus for managing a line width of the pattern formed in the shot area, the management apparatus including;
a storage device for storing a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate; and
a prediction device for predicting a line width condition of a pattern to be formed on the substrate at a plurality of portions in the shot area on the basis of the stored relationship and information of the coincidence condition detected in the exposure process.
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11. A managing method for managing a line width of a pattern formed by an exposure process in a shot area on a substrate, the method comprising:
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previously obtaining a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate; and
predicting a line width condition of a pattern to be formed on the substrate at a plurality of portions in the shot area on the basis of the stored relationship and information of the coincidence condition detected in the exposure process.
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12. A method for manufacturing a semiconductor device, comprising:
forming a pattern in a shot area on a substrate by an exposure process, wherein the forming includes;
previously obtaining a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate; and
predicting a line width condition of a pattern to be formed on the substrate at a plurality of portions in the shot area on the basis of the stored relationship and information of the coincidence condition detected in the exposure process on the substrate.
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13. A management apparatus for managing a line width of a pattern formed by an exposure process in a shot area on a substrate on the substrate, the apparatus comprising:
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a storage device which stores a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate; and
a prediction device which predicts a line width condition of a pattern to be formed on the substrate at a plurality of positions in the shot area on the basis of the stored relationship and information of the coincidence condition detected in the exposure process.
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14. A management apparatus for managing a line width of a pattern formed on a substrate using an exposure apparatus, the apparatus comprising:
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a processor coupled to a detector, wherein the detector detects a coincidence condition of a surface of the substrate relative to a target position, and wherein the processor acquires information of the coincidence condition from the detector;
a storage device coupled to the processor, for storing a relationship between the coincidence condition of the surface of the substrate relative to the target position and a line width condition of the pattern formed on the substrate; and
a prediction device coupled to the processor, for predicting a line width condition of a pattern to be formed on the substrate on the basis of the information of the coincidence condition acquired by the processor and the relationship stored in the storage device. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. An exposure apparatus for transferring a pattern on a substrate by using an exposure apparatus, the exposure apparatus comprising:
a management apparatus for managing a line width of the pattern, the management apparatus including;
a processor coupled to a detector, wherein the detector detects a coincidence condition of a surface of the substrate relative to a target position, and wherein the processor acquires information of the coincidence condition from the detector;
a storage device coupled to the processor, for storing a relationship between the coincidence condition of the surface of the substrate relative to the target position and a line width condition of the pattern formed on the substrate; and
a prediction device coupled to the processor, for predicting a line width condition of a pattern to be formed on the substrate on the basis of the information of the coincidence condition acquired by the processor and the relationship stored in the storage device.
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25. A managing method for managing a line width of a pattern formed on a substrate using an exposure apparatus, the method comprising:
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storing a relationship between a coincidence condition of a surface of the substrate relative to a target position and a line width condition of the pattern formed on the substrate;
acquiring information of the coincidence condition of the surface of the substrate relative to the target position; and
predicting a line width condition of a pattern to be formed on the substrate on the basis of the stored relationship and acquired information of the coincidence condition. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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Specification