Management system, apparatus, and method, exposure apparatus, and control method therefor
First Claim
1. A management system which manages alignment processing of an exposure apparatus, comprising:
- measurement means for measuring a position of a mark position on a photosensitive substrate;
exposure processing means for calculating an alignment parameter on the basis of a measurement result of said measurement means, executing alignment processing by using the calculated alignment parameter, and exposing the photosensitive substrate;
an inspection apparatus which measures an exposure position on the photosensitive substrate exposed by said exposure processing means; and
optimization means for optimizing the alignment processing on the basis of the exposure position acquired by said inspection apparatus.
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Accused Products
Abstract
An exposure apparatus performs AGA measurement by using a predetermined sample shot group formed on a wafer, and decides an alignment parameter. The exposure apparatus executes wafer alignment processing and exposure processing by using the alignment parameter. The exposure apparatus notifies a central processing unit (4) of AGA measurement results and the alignment parameter. An overlay inspection apparatus measures an actual exposure position on the exposed wafer, and notifies the central processing unit of the measurement result. The central processing unit (4) optimizes alignment processing on the basis of the AGA measurement results, alignment parameter, and actually measured exposure position.
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Citations
29 Claims
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1. A management system which manages alignment processing of an exposure apparatus, comprising:
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measurement means for measuring a position of a mark position on a photosensitive substrate; exposure processing means for calculating an alignment parameter on the basis of a measurement result of said measurement means, executing alignment processing by using the calculated alignment parameter, and exposing the photosensitive substrate; an inspection apparatus which measures an exposure position on the photosensitive substrate exposed by said exposure processing means; and optimization means for optimizing the alignment processing on the basis of the exposure position acquired by said inspection apparatus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A management method of managing alignment processing of an exposure apparatus, comprising:
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a measurement step of measuring a position of a mark on a photosensitive substrate; an exposure processing step of calculating an alignment parameter on the basis of a measurement result in the measurement step, executing alignment processing by using the calculated alignment parameter, and exposing the photosensitive substrate; an inspection step of inspecting an exposure result in the exposure processing step; and an optimization step of optimizing the alignment processing on the basis of an exposure position acquired in the inspection step. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A management apparatus which manages alignment processing of an exposure apparatus, comprising:
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first acquisition means for acquiring a measurement result of a position of a mark on a photosensitive substrate by the exposure apparatus; second acquisition means for acquiring an actual exposure position by an inspection apparatus which inspects an exposure result by the exposure apparatus; and optimization means for optimizing the alignment processing in the exposure apparatus on the basis of the measurement result acquired by said first acquisition means and the exposure position acquired by said second acquisition means. - View Dependent Claims (24, 25)
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26. A management method of managing alignment processing of an exposure apparatus, comprising:
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a first acquisition step of acquiring a measurement result of a position of a mark on a photosensitive substrate by the exposure apparatus; a second acquisition step of acquiring an actual exposure position by an inspection apparatus which inspects an exposure result by the exposure apparatus; and an optimization step of optimizing the alignment processing in the exposure apparatus on the basis of the measurement result acquired in the first acquisition step and the exposure position acquired in the second acquisition step. - View Dependent Claims (27, 28, 29)
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Specification