Miniaturized high-density multichannel electrode array for long-term neuronal recordings

• US 6,993,392 B2
• Filed: 03/14/2002
• Issued: 01/31/2006
• Est. Priority Date: 03/14/2002
• Status: Active Grant

• Current Assignee: Duke University
• Original Assignee: Duke University
• Inventors: Lehew, Gary C., Krupa, David J., Nicolelis, Miguel A. L.
• Primary Examiner(s): Pezzuto, Robert E.
• Assistant Examiner(s): Oropeza, Frances P.
• Application Number:
  US10/097,312
• Publication Number:
  US 20030176905A1
• Time in Patent Office: 1,419 Days
• Field of Search: 600/373, 600/378, 600/393, 600/544, 600/545, 607/45, 607/46, 607/116
• US Class Current: 607/45
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/36082 Cognitive or psychiatric applications, e.g. dementia or Alzheimer's disease

Abstract

A high-density multichannel microwire electrode array is disclosed. The array can comprise a variable number of electrodes. A method of assembling the array is further disclosed. Additionally, a plurality of devices employing the array are disclosed, including an intelligent brain pacemaker and a closed loop brain machine interface.

Claims

1. A real time closed loop brain-machine interface comprising:

(a) a multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons comprising;

(i) a plurality of microwire electrodes;

(ii) one or more printed circuit boards in electrical connection with the microwire electrodes comprising;

(1) a plurality of conductive traces spaced apart about 0.015 inches (center to center) or less; and

(2) a plurality of conductive pads in electrical connection with the one or more conductive traces; and

(iii) one or more connectors in communication with conductive pads and having contacts spaced apart about 0.030 inches (center to center) or less;

(b) a signal processing mechanism adapted to communicate with the multichannel microwire electrode array and adapted to form extracted motor commands from the extracellular electrical signals; and

(c) an actuator adapted to communicate with the signal processing mechanism and to respond to the extracted motor commands by effecting a movement, and to provide sensory feedback to the subject.

2. The real time closed loop brain-machine interface of claim 1, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

3. The real time closed loop brain-machine interface of claim 1, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-lsonel, polymers, plastics and non-conductive materials.

4. The real time closed loop brain-machine interface of claim 1, wherein the one or more printed circuit boards are flexible and about 0.01 inch thick.

5. The real time closed loop brain-machine interface of claim 1, wherein the one or more printed circuit boards are substantially rigid and about 0.08 inches thick.

6. The real time closed loop brain-machine interface of claim 1, wherein the one or more printed circuit boards comprise a plurality of the circuit boards secured together in a superimposed stacked relationship.

7. The real time closed loop brain-machine interface of claim 1, wherein the one or more printed circuit boards each comprise one or more removable support tabs.

8. The real time closed loop brain-machine interface of claim 1, wherein the conductive traces are substantially insulated.

9. The real time closed loop brain-machine interface of claim 1, wherein the one or more connectors are zero insertion force (ZIF) connectors.

10. The real time closed loop brain-machine interface of claim 1, wherein the one or more connectors are low insertion force (LIF) connectors.

11. The real time closed loop brain-machine interface of claim 1, wherein the one or more connectors comprise a plurality of connectors soldered to the plurality of conductive pads.