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Pressure sensor module having stress isolation platform

  • US 6,993,975 B2
  • Filed: 11/03/2003
  • Issued: 02/07/2006
  • Est. Priority Date: 11/03/2003
  • Status: Expired due to Term
First Claim
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1. A pressure sensor module comprising:

  • a base structure; and

    a pressure sensor adhered to the base structure via an adhesive layer, said pressure sensor comprising a pressure sensing element, wherein the adhesive layer adheres only a first portion of the pressure sensor to the base structure to create an isolation gap between a second portion of the sensor and the base structure, wherein the isolation gap forms a cantilever member via the second portion of the sensor that provides stress isolation to the pressure sensing element.

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