Single crystal piezo (SCP) apparatus and method of forming same

• US 6,994,762 B2
• Filed: 02/10/2003
• Issued: 02/07/2006
• Est. Priority Date: 02/10/2003
• Status: Expired due to Term

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Clingman, Dan J., Jacot, A. Dean
• Primary Examiner(s): Aftergut, Jeff H.
• Application Number:
  US10/361,533
• Publication Number:
  US 20040154730A1
• Time in Patent Office: 1,093 Days
• Field of Search: 156/160, 156/272.2, 29/253.5, 294/46, 310/340, 310/311
• US Class Current: 156/160
• CPC Class Codes: B32B 37/144 using layers with different mechanical or chemical conditions or properties, e.g. layers with different thermal shrinkage, layers under tension during bonding constructional features for tensioning B32B38/1825
• CPC Class Codes: B32B 38/1866 conforming the layers or laminate to a convex or concave profile
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/204 using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
• CPC Class Codes: H10N 30/30 with mechanical input and electrical output, e.g. functioning as generators or sensors
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49863 with prestressing of part

Abstract

A single crystal piezo (SCP) apparatus and method of forming same. The apparatus is ideally suited for actuator and energy harvesting applications. The apparatus includes an SCP layer bonded to a surface of a flexible metal layer while the metal layer is held flattened within a press or other tool. Once the bonding process is complete, the metal layer imparts a compressive strain to the SCP layer bonded thereto. A layer of uniaxial graphite may also be bonded to the SCP layer to eliminate the poison'"'"'s ratio tension that would otherwise be created in the SCP layer.

Claims

1. A method for imparting a compressive strain to a single crystal piezo (SCP) material, comprising:

placing a flexible substrate preformed in a curved shape on a support surface;

placing a first player of adhesive on a first surface of said flexible substrate;

placing a layer of single crystal piezo (SCP) material on said adhesive;

aligning a layer of uniaxial graphite over said SCP layer;

placing a second layer of adhesive on one of said SCP layer or said uniaxial graphite layer; and

bonding said SCP layer to said flexible substrate in a manner that causes sandwiching of said uniaxial graphite layer to said SCP layer and said flexible substrate, and that further causes a spring force of said flexible substrate to impart a compressive stress into said SCP material, said uniaxial graphite layer preventing a tensile strain from being created in said SCP material in a direction orthongal to axis along which said compressive stress is imparted.

2. The method of claim 1, wherein said step of placing said flexible substrate comprises placing a curved flexible substrate within a tool suitable for temporarily flattening said flexible substrate.

3. The method of claim 2, wherein said step of bonding comprises bonding said layer of SCP material to said flexible substrate while said flexible substrate is held in a flattened condition.

4. The method of claim 1, wherein said bonding step comprises:

applying a voltage to said SCP material to cause said SCP material to shorten in longitudinal length; and

allowing said adhesive to set before removing said voltage, said flexible substrate operating to impart said compressive stress as said voltage is removed.

5. The method of claim 4, wherein said bonding step comprises holding said SCP layer under pressure against said flexible substrate while said flexible substrate is held against a tool surface.

6. The method of claim 1, wherein said step of placing said flexible substrate against said support surface comprises placing a flat, flexible substrate against said support surface.

7. A method of imparting a compressive strain to a single crystal piezo (SCP) material, comprising:

placing a flexible substrate component having a predetermined curvature on a first surface;

placing a first layer of adhesive on a concave contact surface of said substrate component;

placing a layer of SCP material on said concave contact surface of said substrate component;

aligning a layer of unaxial graphite over said SCP layer;

placing a layer of adhesive onto one of a surface of said SCP material which is opposite to said surface facing said substrate component or to a surface of said uniaxial graphite layer;

placing a layer of unaxial graphite against said surface of said SCP material opposite to said surface facing said substrate component;

applying a force to said SCP material from a side opposite to that which is in contact with said concave contact surface, so as to flatten said substrate component against said first surface with said uniaxial graphite layer held against said SCP material and said substrate component;

maintaining said force applied to said SCP material and said substrate component for a time sufficient to allow said adhesive to bond said SCP material, said uniaxial graphite layer and said substrate component together; and

removing said force to allow said substrate component to flex back to its said predetermined curvature to thus apply a compressive strain to said SCP material, with said uniaxial graphite layer preventing a tensile strain from being generated in said SCP material along an axis orthogonal to an axis along which said compressive stress is generated.

8. The method of claim 7, wherein the step of placing a substrate component on a first surface comprises placing a brass component against said first surface.

9. The method of claim 7, wherein the step of placing a substrate component on a first surface comprises placing a graphite epoxy composite component against said first surface.

10. The method of claim 7, wherein the step of placing a substrate component on a first surface comprises placing a glass epoxy composite component against said first surface.

11. The method of claim 7, wherein the step of maintaining said force applied to said SCP material comprises maintaining said force for a time period of at least about one hour.

12. The method of claim 7, wherein the step of placing a layer of adhesive on a contact surface of said substrate component comprises placing a layer of electrically conductive epoxy on said contact surface.

13. The method of claim 7, wherein the step of placing a flexible substrate comprises placing a flexible steel substrate on said first surface.

14. A method of forming an apparatus having a single crystal piezo (SCP) layer, comprising:

placing a first adhesive layer on a concave side of a flexible component having a predetermined curvature;

placing a layer of single crystal piezo (SCP) material having a first surface and a second surface against said first adhesive layer such that said second surface thereof is in at least partial contact with said first adhesive layer;

placing a second adhesive layer on said first surface of said SCP material;

placing a layer of uniaxial graphite at least partially against said second adhesive layer;

applying a force to said first surface of said SCP material sufficient to at least substantially flatten said flexible component with said uniaxial graphite layer pressed against said second adhesive layer;

maintaining an application of said force for a time sufficient to bond said SCP material to said flexible component with said uniaxial graphite layer bonded to said SCP material; and

removing said application of force to allow said flexible component to flex back into said predetermined curvature, thereby generating a compressive strain in said SCP material, while said uniaxial graphite layer prevents a tensile stress from being generated in said SCP material.

15. The method of claim 14, wherein said step of placing a first adhesive layer on a concave side of a flexible component comprises placing said first adhesive layer on a length of spring steel.

16. The method of claim 14, wherein the step of placing a first adhesive layer on a concave side of a flexible component comprises placing an electrically conductive epoxy on said concave side.

17. The method of claim 14, wherein the step of maintaining said force comprises maintaining said force for a time period of at least about one hour.

18. The method of claim 14, wherein the step of placing a first adhesive layer on a concave side of a flexible component comprises placing an adhesive on a concave side of one of:

a brass component;

a graphite epoxy composite component; and

a glass epoxy composite component.

19. A method for forming an energy harvesting apparatus, comprising:

providing a flexible layer of material having a preformed curvature forming a concave surface;

providing a layer of single crystal piezo (SCP) material;

placing a first layer of adhesive on one of said flexible layer and said layer of SCP material;

aligning a layer of uniaxial graphite over said SCP material;

placing a layer of second adhesive on said SCP material facing said layer of uniaxial graphite;

placing said flexible layer, said SCP material and said uniaxial graphite layer adjacent one another;

applying a force to one of said flexible layer, said SCP material and said uniaxial graphite layer sufficient to flatten said flexible layer and to hold said uniaxial graphite layer against said SCP material;

maintaining an application of said force for a time sufficient to bond said flexible layer to said SCP material; and

removing said force to allow said flexible layer to flex back into said preformed curvature, thus providing a compressive strain to said SCP material, while said uniaxial graphite layer prevents a tensile strain from being developed in said SCP material along a first axis, which is orthogonal to a second axis along which said compressive strain is induced.