Semiconductor device
First Claim
1. A semiconductor device comprising,a package composed of a metal base, an enclosure case having first external lead terminals integrated therewith, and a top cover,a filler filled in the package to seal the same,a power circuit arranged in the package and having power semiconductor elements mounted thereon, said power circuit being disposed on the metal base and electrically connected to the first external lead terminals,a control circuit having a printed circuit board, circuit components mounted on the printed circuit board, and first terminals, said control circuit being mounted in the package above the power circuit,a terminal block formed separately from the top cover and extending between side portions of the enclosure case to be directly fixed to the enclosure case, said terminal block being located above the power circuit adjacent the control circuit in a center area of the closure case and having second external lead terminals integrated therewith and second terminals electrically connected with the first terminals of the control circuit, anda relay terminal block arranged inside the enclosure case between the power circuit and the control circuit for electrically connecting the same, said relay terminal block having third terminals so that the printed circuit board of the control circuit is held and electrically connected between the third terminals of the relay terminal block and the second terminals of the terminal block, said relay terminal block being located in the enclosure case at a side away from the first external lead terminals so that the control circuit is held between the terminal block and the relay terminal block.
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Accused Products
Abstract
A semiconductor device includes a package composed of a metal base, an enclosure case integrated with terminals, and a top cover. A power circuit and a control circuit are arranged inside the package vertically, and a gel-like filler is injected to seal the package after being assembled. In this semiconductor device, externally lead control terminals for the control circuit are insert-molded in a control terminal block constituting an independent component. The control terminal block is fixed to the enclosure case to extend over a center of a top surface thereof. A printed circuit board of the control circuit is disposed and connected between the control terminal block and a relay terminal block disposed inside the case.
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Citations
16 Claims
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1. A semiconductor device comprising,
a package composed of a metal base, an enclosure case having first external lead terminals integrated therewith, and a top cover, a filler filled in the package to seal the same, a power circuit arranged in the package and having power semiconductor elements mounted thereon, said power circuit being disposed on the metal base and electrically connected to the first external lead terminals, a control circuit having a printed circuit board, circuit components mounted on the printed circuit board, and first terminals, said control circuit being mounted in the package above the power circuit, a terminal block formed separately from the top cover and extending between side portions of the enclosure case to be directly fixed to the enclosure case, said terminal block being located above the power circuit adjacent the control circuit in a center area of the closure case and having second external lead terminals integrated therewith and second terminals electrically connected with the first terminals of the control circuit, and a relay terminal block arranged inside the enclosure case between the power circuit and the control circuit for electrically connecting the same, said relay terminal block having third terminals so that the printed circuit board of the control circuit is held and electrically connected between the third terminals of the relay terminal block and the second terminals of the terminal block, said relay terminal block being located in the enclosure case at a side away from the first external lead terminals so that the control circuit is held between the terminal block and the relay terminal block.
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12. A semiconductor device comprising,
a package composed of a metal base, an enclosure case having first external lead terminals integrated therewith, and a top cover, a filler filled in the package to seal the same, a power circuit arranged in the package and having power semiconductor elements mounted thereon, said power circuit being disposed on the metal base and electrically connected to the first external lead terminals, a control circuit having a printed circuit board, circuit components mounted on the printed circuit board, and first terminals, said control circuit being mounted in the package above the power circuit, a terminal block formed separately from the top cover and extending between side portions of the closure case, said terminal block being directly fixed to the enclosure case and having second external lead terminals integrated therewith and second terminals electrically connected with the first terminals of the control circuit, and a relay terminal block arranged inside the enclosure case between the power circuit and the control circuit for electrically connecting the same, said relay terminal block having third terminals so that the printed circuit board of the control circuit is held and electrically connected between the third terminals of the relay terminal block and the second terminals of the terminal block, wherein said first external lead terminals in the enclosure case are arranged on one side of the enclosure case, said terminal block is installed close to a center of a top surface of the enclosure case and arranged parallel to the first external lead terminals, said control circuit is arranged in an area between the terminal block and a side of the enclosure case opposite to the first external lead terminals relative to the terminal block, and said relay terminal block is located at a side away from the first external lead terminals so that the control circuit is held between the terminal block and the relay terminal block.
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13. A semiconductor device comprising,
a package composed of a metal base, an enclosure case having first external lead terminals integrated therewith, and a top cover, a filler filled in the package to seal the same, a power circuit arranged in the package and having power semiconductor elements mounted thereon, said power circuit being disposed on the metal base and electrically connected to the first external lead terminals, a control circuit having a printed circuit board, circuit components mounted on the printed circuit board, and first terminals, said control circuit being mounted in the package above the power circuit, a terminal block formed separately from the top cover and extending between side portions of the enclosure case to be directly fixed to the enclosure case, said terminal block being located above the power circuit adjacent the control circuit in a center area of the closure case and having second external lead terminals integrated therewith and second terminals electrically connected with the first terminals of the control circuit, and a relay terminal block arranged inside the enclosure case between the power circuit and the control circuit for electrically connecting the same, said relay terminal block having third terminals so that the printed circuit board of the control circuit is held and electrically connected between the third terminals of the relay terminal block and the second terminals of the terminal block, wherein said top cover of the package has spacing projections provided on a back surface thereof, said spacing projection facing the printed circuit board of the control circuit.
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15. A semiconductor device comprising,
a package composed of a metal base, an enclosure case having first external lead terminals integrated therewith, and a top cover, a filler filled in the package to seal the same, a power circuit arranged in the package and having power semiconductor elements mounted thereon, said power circuit being disposed on the metal base and electrically connected to the first external lead terminals, a control circuit having a printed circuit board, circuit components mounted on the printed circuit board, and first terminals, said control circuit being mounted in the package above the power circuit, a terminal block fixed to the enclosure case to extend over the same, and having second external lead terminals integrated therewith, second terminals electrically connected with the first terminals of the control circuit, and guide pins for positioning and supporting the printed circuit board of the control circuit, and a relay terminal block arranged inside the enclosure case between the power circuit and the control circuit for electrically connecting the same, said relay terminal block having third terminals so that the printed circuit board of the control circuit is held and electrically connected between the third terminals of the relay terminal block and the second terminals of the terminal block.
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16. A semiconductor device comprising,
a package composed of a metal base, an enclosure case having first external lead terminals integrated therewith, and a top cover, a filler filled in the package to seal the same, a power circuit arranged in the package and having power semiconductor elements mounted thereon, said power circuit being disposed on the metal base and electrically connected to the first external lead terminals, a control circuit having a printed circuit board, circuit components mounted on the printed circuit board, and first terminals, said control circuit being mounted in the package above the power circuit, a terminal block formed separately from the top cover and extending between side portions of the enclosure case to be directly fixed to the enclosure case, said terminal block being located above the power circuit adjacent the control circuit in a center area of the closure case and having second external lead terminals integrated therewith and second terminals electrically connected with the first terminals of the control circuit, and a relay terminal block arranged inside the enclosure case between the power circuit and the control circuit for electrically connecting the same, said relay terminal block having third terminals so that the printed circuit board of the control circuit is held and electrically connected between the third terminals of the relay terminal block and the second terminals of the terminal block, wherein said terminal block has support portions formed at respective ends thereof and having adhesive injection holes opened in top surfaces thereof, and said enclosure case of the package has groove portions formed in an inner surface thereof for receiving the support portions of the terminal block to join thereto with adhesive, said groove portions having adhesive guide channels formed at inner surfaces of the groove portions for guiding the adhesive injected through the adhesive injection holes.
Specification