Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

• US 6,995,510 B2
• Filed: 06/25/2002
• Issued: 02/07/2006
• Est. Priority Date: 12/07/2001
• Status: Expired due to Fees

• Current Assignee: Hitachi Cable Limited (Proterial Ltd.), Stanley Electric Company Limited
• Original Assignee: Hitachi Cable Limited (Proterial Ltd.), Stanley Electric Company Limited
• Inventors: Saito, Tetsuya, Aoki, Dai, Morikawa, Toshiaki, Abe, Tomoaki, Otaka, Atsushi, Murakami, Gen
• Primary Examiner(s): Glick, Edward J.
• Assistant Examiner(s): KEANEY, ELIZABETH MARIE
• Application Number:
  US10/179,608
• Publication Number:
  US 20030107316A1
• Time in Patent Office: 1,323 Days
• Field of Search: 313/512, 313/483, 313/502, 313/113, 257/98, 257/99, 257/100
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A surface mount type light-emitting unit composed of a light-emitting device, a first lead connected electrically with a first electrode of the light-emitting device, a second lead connected electrically with a second electrode of the light-emitting device, and a clear insulator for sealing the light-emitting device, a connecting section of the first electrode of the light-emitting device and the first lead, and a connecting section of the second electrode of the light-emitting device and the second lead wherein connecting terminal sections of the first and second leads for connecting them with external devices, respectively, are placed on a surface of the insulator, comprises an end of the first lead being molded into a cup-shaped portion having a flat bottom; the light-emitting device being bonded to the bottom inside a reflecting section corresponding to the molded cup-shaped portion of the first lead; and a surface opposed to that of the reflecting section on which the light-emitting device has been bonded being exposed to the surface of the insulator.

Claims

1. A light-emitting unit of surface mount type composed of a light-emitting device, a first lead connected electrically with a first electrode of said light-emitting device, a second lead connected electrically with a second electrode of said light-emitting device, and a clear insulator for sealing said light-emitting device, a connecting section of said first electrode of the light-emitting device and said first lead, and a connecting section of said second electrode of the light-emitting device and said second lead wherein connecting terminal sections of said first lead and said second lead for connecting them with external devices, respectively, are placed on a surface of said insulator, comprising:

an end of said first lead being molded into a cup-shaped portion having a flat bottom;

said light-emitting device being bonded to the bottom inside a reflecting section corresponding to said molded cup-shaped portion of said first lead; and

said reflecting section of said first lead comprising a first surface on which said light-emitting device is bonded and a second surface that is opposed to the first wherein said second surface is exposed without being covered with said insulator.

2. A light-emitting unit as claimed in claim 1, wherein:

said first lead has a bottom in said reflecting section, which is thinner than a thickness of said connecting terminal section.

3. A light-emitting unit as claimed in claim 2, wherein:

said first lead and said second lead involve protrusions folded in directions towards the inside of said insulator at positions where said first lead and said second lead have been covered with said insulator, respectively.

4. A light-emitting unit as claimed in claim 3, wherein:

said insulator comprises a first insulator (401), said first insulator including a wavelength converting material, said first insulator disposed so as to cover said light-emitting device inside said reflecting section, and

a second insulator (402) for sealing the light-emitting device, the connecting section of the first electrode of said light-emitting device and the first lead, and the connecting section of the second electrode of said light-emitting device and the second lead, which have been covered with said first insulator.

5. A light-emitting unit as claimed in claim 4, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

6. A light-emitting unit as claimed in claim 3, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

7. A light-emitting unit as claimed in claim 2, wherein:

said insulator comprises a first insulator (401), said first insulator including a wavelength converting material, said first insulator disposed so as to cover said light-emitting device inside said reflecting section, and

a second insulator (402) for sealing the light-emitting device, the connecting section of the first electrode of said light-emitting device and the first lead, and the connecting section of the second electrode of said light-emitting device and the second lead, which have been covered with said first insulator.

8. A light-emitting unit as claimed in claim 7, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

9. A light-emitting unit as claimed in claim 2, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

10. A light-emitting unit as claimed in claim 1, wherein:

said first lead and said second lead involve protrusions folded in directions towards the inside of said insulator at positions where said first lead and said second lead have been covered with said insulator, respectively.

11. A light-emitting unit as claimed in claim 10, wherein:

said insulator comprises a first insulator (401), said first insulator including a wavelength converting material, said first insulator disposed so as to cover said light-emitting device inside said reflecting section, and

a second insulator (402) for sealing the light-emitting device, the connecting section of the first electrode of said light-emitting device and the first lead, and the connecting section of the second electrode of said light-emitting device and the second lead, which have been covered with said first insulator.

12. A light-emitting unit as claimed in claim 11, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

13. A light-emitting unit as claimed in claim 10, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

14. A light-emitting unit as claimed in claim 1, wherein:

said insulator comprises a first insulator (401), said first insulator including a wavelength converting material, said first insulator disposed so as to cover said light-emitting device inside said reflecting section, and

a second insulator (402) for sealing the light-emitting device, the connecting section of the first electrode of said light-emitting device and the first lead, and the connecting section of the second electrode of said light-emitting device and the second lead, which have been covered with said first insulator.

15. A light-emitting unit as claimed in claim 14, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

16. A light-emitting unit as claimed in claim 1, wherein:

the connecting terminal sections of said first lead are disposed on a first surface of said insulator and a second surface contiguous to said first surface, and

the connecting terminal sections of said second lead are disposed on said first surface of said insulator and a third surface contiguous to said first surface, but different from said second surface.

17. A lead frame for forming a light-emitting unit, wherein a tape-like conductive plate is opened in a predetermined profile to define a first lead and a second lead, and a cup-shaped reflecting section is formed in an end of said first lead, comprising:

the extreme end of said first lead being molded into a cup-shaped portion having a flat bottom;

wherein said reflecting section is formed on the same plane as that of said first lead and second lead.

18. A lead frame as claimed in claim 17, wherein:

said first lead and said second lead involve protrusions at positions covered with an insulator, respectively; and

said protrusions have been folded in the same directions as that of inclinations of sides in said reflecting section which has been molded into said cup-shaped portion.

19. A lead frame as claimed in claim 18, wherein:

said first lead has a bottom in said reflecting section, which is thinner than a thickness of a connecting terminal section with an external device of said first lead.

20. A lead frame as claimed in claim 17, wherein:

said first lead has a bottom in said reflecting section, which is thinner than a thickness of a connecting terminal section with an external device of said first lead.