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Method and system for monitoring and profiling an integrated circuit die temperature

  • US 6,996,491 B2
  • Filed: 02/19/2002
  • Issued: 02/07/2006
  • Est. Priority Date: 02/19/2002
  • Status: Active Grant
First Claim
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1. A system to monitor a temperature of an integrated circuit, comprising:

  • an active thermal sensor located on a die of said integrated circuit to measure said temperature of said integrated circuit and assert a value representative of one of an over-temperature condition, an under-temperature condition, and a temperature condition between said over-temperature condition and said under-temperature condition; and

    a controller located on the die of said integrated circuit and coupled to said active thermal sensor to interpret said value asserted by said active thermal sensor to monitor said temperature of said integrated circuit, the controller having an interface to a microprocessor for communication with said microprocessor to control the temperature of said integrated circuit.

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