Circuit board embedded inductor
First Claim
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1. A method for manufacturing a circuit board having an embedded inductor comprising:
- providing a core structure comprising a dielectric core layer and a first metal layer on a top surface of the dielectric core layer;
etching the first metal layer to form first inductor windings;
depositing a material including a magnetic filler material over the first inductor windings;
placing a first prepreg layer over the material including the magnetic filler material deposited over the first inductor windings; and
attaching the first prepreg layer to the material including the magnetic filler material deposited over the first inductor windings.
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Abstract
A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.
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Citations
18 Claims
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1. A method for manufacturing a circuit board having an embedded inductor comprising:
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providing a core structure comprising a dielectric core layer and a first metal layer on a top surface of the dielectric core layer; etching the first metal layer to form first inductor windings; depositing a material including a magnetic filler material over the first inductor windings; placing a first prepreg layer over the material including the magnetic filler material deposited over the first inductor windings; and attaching the first prepreg layer to the material including the magnetic filler material deposited over the first inductor windings. - View Dependent Claims (2, 3, 4, 5, 6, 7, 14, 15, 16, 17, 18)
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8. The method 3 further comprising:
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providing a third metal layer on a top surface of the first prepreg layer; etching the third metal layer to form third inductor windings; depositing the material including the magnetic filler material over the third inductor windings; placing a third prepreg layer over the material including the magnetic filler material deposited over the third inductor windings; and attaching the third prepreg layer to the material including the magnetic filler material deposited over the third inductor windings. - View Dependent Claims (9)
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10. The method 8 further comprising:
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providing a fourth metal layer on a bottom surface of the second prepreg layer; etching the fourth metal layer to form fourth inductor windings; depositing the material including the magnetic filler material over the fourth inductor windings; placing a fourth prepreg layer over the material including the magnetic filler material deposited over the fourth inductor windings; and attaching the fourth prepreg layer to the material including the magnetic filler material deposited over the fourth inductor windings. - View Dependent Claims (11, 12, 13)
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Specification