Multiple-pass heat exchanger with gaps between fins of adjacent tube segments

• US 6,997,247 B2
• Filed: 04/29/2004
• Issued: 02/14/2006
• Est. Priority Date: 04/29/2004
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Simon, Glenn C., Malone, Christopher G.
• Primary Examiner(s): Walberg, Teresa J.
• Application Number:
  US10/835,955
• Publication Number:
  US 20050241812A1
• Time in Patent Office: 656 Days
• Field of Search: 165/80.4, 165/80.5, 165150-153, 165/178
• US Class Current: 165/150
• CPC Class Codes: F28D 1/0477 the conduits being bent in a serpentine or zig-zag
• CPC Class Codes: F28D 1/0478 the conduits having a non-circular cross-section
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 1/126 consisting of zig-zag shaped fins F28F1/105 takes precedence
• CPC Class Codes: F28F 1/24 and extending transversely F28F1/38 takes precedence
• CPC Class Codes: F28F 2215/04 Assemblies of fins having different features, e.g. with different fin densities
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a liquid loop cooling device, a heat exchanger includes a tube arranged in a multiple-pass configuration including a plurality of substantially parallel tube segments. The heat exchanger further includes a plurality of fins coupled to the tube segments. The fins for adjacent tube segments are separated by a gap.

Claims

1. An apparatus comprising:

a heat exchanger comprising;

a cylindrical tube arranged in a multiple-pass configuration including a plurality of substantially parallel tube segments, the cylindrical tube extending and coupled to a cooling plate adapted for cooling an electronic component; and

a plurality of closely-spaced planar plate fins arranged in mutually parallel planes and coupled to the tube segments, the fins for adjacent tube segments being separated by a gap.

2. The apparatus according to claim 1 further comprising:

a tube having a longitudinal axis and a circular cross-section forming the plurality of substantially parallel tube segments; and

a stack of closely-spaced plates medially intersected by a circular aperture fined to receive the tube and arranged substantially perpendicular to the longitudinal axis forming the fins coupled to the tube segments.

3. The apparatus according to claim 1 further comprising:

ethylene glycol-based fluid contained within the tube.

4. The apparatus according to claim 1 further comprising:

at least one fan arranged to generate an airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged sequentially along the airflow pathway.

5. The apparatus according to claim 1 further comprising:

at least one fan arranged to generate an airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged at an angle perpendicular to the airflow pathway.

6. The apparatus according to claim 1 further comprising:

at least one fan arranged to generate an airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged sequentially along the airflow pathway and at least two of the adjacent gap-separated tube segments arranged at an angle perpendicular to the airflow pathway.

7. An electronic system comprising:

a chassis including airflow inlet mid outlet vents, and fans adapted to circulate air from the inlet vents to the outlet vents along an airflow pathway;

a plurality of components mounted within the chassis; and

a liquid to air heat exchanger comprising;

a cylindrical tube arranged in a multiple-pass configuration including a plurality of substantially parallel tube segments, the cylindrical tube extending and coupled to a cooling plate adapted for cooling an electronic component; and

a plurality of closely-spaced planar plate fins arranged in mutually parallel planes and coupled to the tube segments, the fins for adjacent tube segments being separated by a gap.

8. The electronic system according to claim 7 wherein the heat exchanger further comprises:

a tube having a longitudinal axis and a circular cross-section forming a plurality of compactly spaced and substantially parallel tube segments; and

a stack of closely-spaced plates medially intersected by a circular aperture fitted to receive the tube and arranged substantially perpendicular to the longitudinal axis forming the fins coupled to the tube segments, the plates extending toward the adjacent tube segment a distance that leaves a gap between adjacent segment plates sufficient to substantially eliminate heat transfer between the adjacent tube segments.

9. The electronic system according to claim 7 wherein the heat exchanger further comprises:

ethylene glycol-based fluid contained within the tube.

10. The electronic system according to claim 8 wherein the heat exchanger further comprises:

at least one fan arranged to generate the airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged sequentially along the airflow pathway.

11. The electronic system according to claim 7 wherein the heat exchanger further comprises:

at least one fan arranged to generate the airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged at an angle perpendicular to the airflow pathway.

12. The electronic system according to claim 7 wherein the heat exchanger further comprises:

at least one fan arranged to generate the airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged sequentially along the airflow pathway and at least two of the adjacent gap-separated tube segments arranged at an angle perpendicular to the airflow pathway.

13. A liquid loop cooling system comprising:

a tubing including an interior lumen within which a cooling fluid can circulate;

a pump coupled to the tubing and capable of pumping the cooling fluid through the tubing; and

a heat exchanger coupled to the tubing, the heat exchanger comprising;

a cylindrical tube arranged in a multiple-pass configuration including a plurality of substantially parallel tube segments, the cylindrical tube extending and coupled to a cooling plate adapted for cooling an electronic component; and

a plurality of closely-spaced planar plate fins arranged in mutually parallel planes and coupled to the tube segments, the fins for adjacent tube segments being separated by a gap.

14. The cooling system according to claim 13 further comprising:

an ethylene glycol-based cooling fluid contained within the tubing and tube.

15. The cooling system according to claim 13 further comprising:

a fan configured to drive air through the heat exchanger.

16. The cooling system according to claim 13 further comprising:

a cold plate coupled to the heat exchanger.

17. The cooling system according to claim 13 wherein the heat exchanger further comprises:

a tube having a longitudinal axis and a circular cross-section forming a plurality of compactly spaced and substantially parallel tube segments; and

a stack of closely-spaced plates arranged substantially perpendicular to the longitudinal axis forming the fins coupled to the tube segments, the plates extending toward the adjacent tube segment a distance tat leaves a gap between adjacent segment plates sufficient to substantially eliminate heat transfer between the adjacent tube segments.

18. The cooling system according to claim 13 wherein the heat exchanger further comprises:

at least one fan arranged to generate an airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged sequentially along the airflow pathway.

19. The cooling system according to claim 13 wherein the heat exchanger further comprises:

at least one fan arranged to generate an airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged at an angle perpendicular to the airflow pathway.

20. The cooling system according to claim 13 wherein the heat exchanger further comprises:

at least one fan arranged to generate an airflow pathway in an airflow direction parallel to the mutually parallel planes of the planar plate fin plurality, at least two of the adjacent gap-separated tube segments arranged sequentially along the air flaw pathway and at least two of the adjacent gap-separated tube segments arranged at an angle perpendicular to the airflow pathway.

21. A heat exchanger comprising:

a flattened tube extending along a longitudinal axis and folded approximately 180°

to couple adjacent flattened cross-sectional tube segments; and

a plurality of folded fins coupled exclusively interior to adjacent flattened cross-section tube segments, the folded fins of adjacent flattened cross-section tube segments being separated by the gap.

22. The heat exchanger according to claim 21 further comprising:

the plurality of folded tins having a pitch varying with longitudinal axis along the interior of the adjacent flattened cross-section tube segments.

23. The heat exchanger according to claim 21 further comprising:

the plurality of folded fins arranged in mutually parallel surfaces extending generally perpendicular to the longitudinal axis; and

at least one fan arranged to generate the airflow pathway in an airflow direction approximately parallel to the mutually parallel surfaces of the folded fin plurality.

24. The beat exchanger according to claim 21 further comprising:

an integrated circuit;

a cold plate arranged to cool the integrated circuit;

a tubing coupled to the cold plate;

the flattened tube extending to first and second ends; and

first and second transition caps configured to respectively couple the flattened tube first and second ends to the tubing.

25. The heat exchanger according to claim 21 further comprising:

the flattened tube having a single lumen extending essentially the flattened tube width whereby pressure drop of a liquid passing through the flattened tube is reduced.