Polishing pad, polishing apparatus having the same, and bonding apparatus

• US 6,997,793 B1
• Filed: 11/22/2004
• Issued: 02/14/2006
• Est. Priority Date: 07/20/2004
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Ito, Toshiyuki
• Primary Examiner(s): NGUYEN, DUNG V
• Application Number:
  US10/992,745
• Publication Number:
  US 20060019588A1
• Time in Patent Office: 449 Days
• Field of Search: 451526-539, 438/692, 438/693
• US Class Current: 451/527
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved

Abstract

A plurality of projections and grooves are formed on a polishing member. The grooves are formed in grid pattern. A portion on which the grooves and the projections are formed (polishing portion) has a substantially circular shape in a plane view. Around the polishing portion, an outer peripheral portion having a fixed height is provided. The height of the outer peripheral portion is equal to the height of bottom portions of the grooves. Ends of each of the grooves extend to the outer peripheral portion, which allows slurry and the like entering the grooves to flow outside via the outer peripheral portion. When a polishing pad thus structured is to be bonded to a surface plate, adhesive is applied or a double-stick tape is affixed to a rear surface of a base member, and thereafter, the polishing pad is put in place on the surface plate. Next, the polishing portion is pressed to the surface plate from an upper side, and subsequently the outer peripheral portion is pressed to the surface plate from the upper side.

Claims

1. A polishing pad comprising:

a polishing portion having a plurality of projections that are brought into contact with an object to be polished and grooves formed between said plurality of projections; and

an outer peripheral portion provided around said polishing portion and having a front surface lower in height than top portions of said projections.

2. The polishing pad, according to claim 1, wherein the height of the front surface of said outer peripheral portion is equal to or lower than a height of bottom portions of said grooves.

3. The polishing pad according to claim 1, wherein

the height of the front surface of said outer peripheral portion is higher than a height of bottom portions of said grooves, and

auxiliary grooves connecting with said grooves are formed in said outer peripheral portion.

4. The polishing pad according to claim 1, wherein the front surface and a rear surface of said outer peripheral portion are parallel with each other.

5. The polishing pad according to claim 1, being to be attached to a chemical mechanical polishing apparatus.

6. The polishing pad according to claim 1, containing foamed urethane as a material.

7. The polishing pad according to claim 1, wherein the front surface of said outer peripheral portion has an inclined surface whose height closer to an outer side is lower.

8. The polishing pad according to claim 1, wherein said plurality of projections have a substantially equal height.

9. The polishing pad according to claim 1, wherein said grooves have a substantially equal depth.

10. The polishing pad according to claim 1, wherein said grooves are formed in grid pattern in said polishing portion.

11. A polishing apparatus comprising the polishing pad according to claim 1.