Tissue distraction device

• US 6,997,929 B2
• Filed: 05/14/2004
• Issued: 02/14/2006
• Est. Priority Date: 05/16/2003
• Status: Active Grant

• Current Assignee: Spine Wave Incorporated
• Original Assignee: Spine Wave Incorporated
• Inventors: Logan, Joseph N., Wysocki, Steven J., Manzi, Richard J., Raymond, Spanky A., Bono, Frank S.
• Primary Examiner(s): Robert, Eduardo C.
• Assistant Examiner(s): COMSTOCK, DAVID C
• Application Number:
  US10/846,235
• Publication Number:
  US 20040230198A1
• Time in Patent Office: 641 Days
• Field of Search: 606/61, 606/90, 606/99, 606/198, 623/17.11, 623/17.16
• US Class Current: 606/90
• CPC Class Codes: A61B 17/025 Joint distractors
• CPC Class Codes: A61B 17/1285 for minimally invasive surgery
• CPC Class Codes: A61B 17/8852 capable of being assembled or enlarged, or changing shape, inside the bone or disc
• CPC Class Codes: A61B 2017/0256 for the spine
• CPC Class Codes: A61F 2/4455 for the fusion of spinal bodies, e.g. intervertebral fusion of adjacent spinal bodies, e.g. fusion cages intervertebral discs A61F2/442

Abstract

An apparatus and method for distracting, in a given direction, and supporting two tissue surfaces is provided. A plurality of wafers are consecutively inserted using a wafer insertion apparatus between the two tissue surfaces to create a column of wafers. A detachable wafer assembly is provided that includes a base wafer initially associated with a track assembly of a wafer insertion apparatus. The base wafer is dislodged from the track assembly so that the base wafer is left within the distraction site as the track assembly is removed. A top cap wafer is provided that is situated at the top of the wafer stack, in which the top cap wafer is larger than the remaining wafers to form a gap surrounding the stack to receive biologic material.

Claims

1. An apparatus for sequentially inserting wafers, stackable consecutively one upon another to form a stack extending in a given direction into a body tissue space to be distracted, the apparatus comprising:

a source of wafers;

a track assembly connected to said source of wafers and configured to sequentially advance wafers from the source of wafers into the space to be distracted, said track assembly having a distal end and defining a channel at said distal end;

a base wafer supported within said channel of said track assembly, said base wafer defining a support surface for supporting subsequent wafers advanced thereon by said track assembly; and

a connection mechanism between said channel and said base wafer configured to releasably connect said base wafer to said channel.

2. The apparatus of claim 1, wherein said connection mechanism includes:

at least one bore defined in said channel; and

a corresponding boss projecting from said base wafer and sized for engagement within said bore.

3. The apparatus of claim 2, further comprising a slide cutter slidably disposed within said channel, said slide cutter defining at least one opening therethrough corresponding to said at least one bore and configured to receive said corresponding boss therethrough when said boss is engaged within said bore, said at least one opening configured to sever said boss from said base wafer when said cutter is translated within said channel.

4. The apparatus of claim 3, wherein:

said channel defines a wafer channel sized for passage of said wafers therethrough;

said track assembly is configured to support said base wafer beneath said wafer channel; and

said channel further defines a cutter channel beneath said base wafer when said base wafer is supported on said channel for slidably receiving said slide cutter therein.

5. The apparatus of claim 1, wherein said connection mechanism includes:

at least one retention post projecting from said channel; and

a corresponding retention notch defined in said base wafer to engage said retention post when said base wafer is within said channel.

6. The apparatus of claim 5, further comprising a release plate slidably disposed within said channel, said release plate having a surface configured to contact said base wafer and dislodge said corresponding retention notch from said at least one retention post when said release plate is translated within said channel.

7. The apparatus of claim 1, wherein said connection mechanism includes:

a retention slot defined in said channel; and

a key projecting from said base wafer and configured to be received within said retention slot when said base wafer is disposed within said channel.

8. The apparatus of claim 7, further comprising:

a spilt line defined in said channel and intersecting said retention slot; and

a release plate slidably disposed within said channel and having an element extending through said spilt line and configured to separate said channel along said split line as said release plate is translated within said channel, whereby said retention slot expands as said channel is separated to release said key from said retention slot.

9. The apparatus of claim 1, wherein said base wafer and said wafers from said source of wafers are formed of the same material.

10. The apparatus of claim 9, wherein said material is a biologic material.

11. The apparatus of claim 10, wherein said material is PMMA.

12. The apparatus of claim 1, wherein:

said channel defines a wafer channel sized for passage of said wafers therethrough; and

said track assembly is configured to support said base wafer beneath said wafer channel.

13. The apparatus of claim 1, wherein said base wafer defines a stop at an end of said base wafer and arranged to stop advancement of said wafers across said support surface.

14. The apparatus of claim 1, wherein said channel has an open end at said distal end.

15. The apparatus of claim 14, wherein said base wafer defines a stop at an end of said base wafer, said base wafer supported on said channel with said stop at said open end.

16. The apparatus of claim 1, wherein said connection mechanism includes an element movably disposed within said track assembly and operable to separate said base wafer from said channel.

17. The apparatus of claim 16, wherein:

said connection mechanism includes at least one bore and a corresponding boss, configured to be received within said at least one bore, defined between said base wafer and said channel; and

said element is a plate disposed between said base wafer and said channel and defining at least one opening therethrough sized to receive said corresponding boss therethrough when said corresponding boss is engaged within said at least one bore, said plate movable within said channel to sever said boss.

18. The apparatus of claim 17, wherein said at least one bore is defined in said channel and said corresponding boss projects from said base wafer.

19. The apparatus of claim 17, wherein said at least one opening and said corresponding boss define a press-fit engagement.

20. An apparatus for sequentially inserting wafers, stackable consecutively one upon another to form a stack extending in a given direction into a body tissue space to be distracted, the apparatus comprising:

a base wafer defining a support surface for supporting subsequent sequentially inserted wafers thereon;

a track assembly configured to receive sequentially advanced wafers from a source of wafers into the space to be distracted, said track assembly having a distal end and defining a channel at said distal end, said channel having a portion supporting said base wafer within said channel and a wafer channel sized for passage of the sequentially inserted wafers to a position directly above said base wafer in the given and direction; and

a connection mechanism between said channel and said base wafer configured to releasably connect said base wafer to said channel during sequential insertion of the stackable wafers, said connection mechanism including;

a male-female connection defined between said base wafer and said channel; and

a release plate slidably disposed within said track assembly and configured to break said male-female connection.

21. The apparatus of claim 20, wherein:

said channel has an open end at said distal end; and

said base wafer includes a stop at an end thereof that is positioned at said open end when said base wafer is supported on said portion of said channel to prevent passage of sequentially inserted wafers beyond said distal end.

22. The apparatus of claim 20, wherein:

said male-female connection includes at least one boss and a corresponding bore for receiving said boss, defined between said base wafer and said channel; and

said release plate includes a slide cutter defining at least one opening to receive said at least one boss therethrough and configured to sever said boss when said slide cutter is retracted into said track assembly.

23. The apparatus of claim 20, wherein:

said male-female connection includes at least one retention post and a corresponding retention notch configured to receive said notch defined between said base wafer and said channel; and

said release plate is disposed between said base wafer and said channel and defines opposing surfaces configured to separate said base wafer from said channel to thereby dislodge said at least one retention post from said corresponding retention notch.

24. The apparatus of claim 20, wherein:

said male-female connection includes a retention slot and a key configured to project into said retention slot, defined between said base wafer and said channel; and

said release plate includes a distal end configured to separate said slot to permit removal of said key therefrom.

25. An apparatus for sequentially inserting wafers, stackable consecutively one upon another to form a stack extending in a given direction into a body tissue space to be distracted, the apparatus comprising:

a track assembly configured to sequentially advance wafers from a source of wafers into the space to be distracted, said track assembly having a distal end and defining a channel opening at said distal end;

a base wafer supported on said track assembly at said distal end, said base wafer defining a support surface for supporting subsequent wafers received from said channel; and

a connection mechanism releasably connecting said base wafer to said track assembly, said connection mechanism having a first configuration holding said base wafer as subsequent wafers are inserted thereon through said channel and movable to a different second configuration operable to separate said base wafer from said track assembly.

26. The apparatus of claim 25, wherein said connection mechanism includes:

at least one boss projecting from said base wafer; and

a plate movably disposed within said track assembly, said plate defining at least one opening corresponding to said at least one boss and configured to sever said boss when said plate is moved within said track assembly.

27. The apparatus of claim 26, wherein said connection further includes at least one bore defined in said track assembly configured and arranged to receive a corresponding one of said at least one boss therein.

28. The apparatus of claim 27, wherein said plate is disposed between said base wafer and said track assembly.

29. The apparatus of claim 25, wherein said connection mechanism includes:

at least one retention post and a corresponding retention notch, configured to engage said at least one retention post, defined between said base wafer and said track assembly; and

a release plate disposed between said base wafer and said track assembly and movable to disengage said corresponding retention notch from said at least one retention post.