RFIC die-package configuration
First Claim
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1. A radio frequency integrated circuit (RFIC) comprises:
- a die containing a radio frequency (RF) input/output (I/O) section; and
a package having pluralities of connections, wherein each connection of the RF I/O section is connected to a corresponding one of the pluralities of connections to connect the RF I/O section to an off-die antenna, wherein the die is positioned off centered within the package to minimize coupling distance between the RF I/O section and the off die antenna.
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Abstract
A RFIC includes a die and a package. The die contains a radio frequency (RF) input/output (I/O) section, an RF-to-baseband conversion section, and a baseband processing section. The package includes a plurality of connections for connecting to the die. The die is positioned within the package to minimize adverse affects of parasitics components of coupling the RFIO section to an antenna. The positioning of the die within the package may be offset from the center of the package and/or positioned at the edge of the package.
54 Citations
5 Claims
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1. A radio frequency integrated circuit (RFIC) comprises:
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a die containing a radio frequency (RF) input/output (I/O) section; and a package having pluralities of connections, wherein each connection of the RF I/O section is connected to a corresponding one of the pluralities of connections to connect the RF I/O section to an off-die antenna, wherein the die is positioned off centered within the package to minimize coupling distance between the RF I/O section and the off die antenna. - View Dependent Claims (2, 3, 4, 5)
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Specification