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Inductive device including bond wires

  • US 6,998,952 B2
  • Filed: 12/05/2003
  • Issued: 02/14/2006
  • Est. Priority Date: 12/05/2003
  • Status: Expired due to Term
First Claim
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1. An inductive device, comprising:

  • a core coupled to a substrate; and

    a conductive coil surrounding the core, the coil comprising segments formed from a first plurality of bond wires and a second plurality of bond wires, the first plurality of bond wires extending between the core and the substrate, each of the first plurality of bond wires coupled to two of a plurality of wire bond pads, and the second plurality of bond wires extending over due core and coupled between two of the plurality of wire bond pads, wherein the core is coupled to the substrate using epoxy, the first plurality of bond wires extending through the epoxy.

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