Cooling device, electronic equipment device, and method of manufacturing cooling device

• US 6,999,314 B2
• Filed: 12/03/2002
• Issued: 02/14/2006
• Est. Priority Date: 12/13/2001
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Tonosaki, Minehiro, Makino, Takuya, Sano, Naoki
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/250,528
• Publication Number:
  US 20040052056A1
• Time in Patent Office: 1,169 Days
• Field of Search: 361/699, 361/700, 257/714, 257/715, 174/15.1, 174/15.2, 165/80.4, 165/104.26, 165/185, 298/900.32
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49353 Heat pipe device making
• CPC Class Codes: Y10T 29/49359 Cooling apparatus making, e.g., air conditioner, refrigerator

Abstract

This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick. The upper board member (30) includes an opening (32) or (34) for allowing the board member (20) or (40) for the condenser part or the wick part to be incorporated, and a hollow (31) for heat insulation.

Claims

1. A cooler comprising:

first board member having a cavity portion formed on a surface thereof, said cavity corresponding to a part of a heat pipe excluding at least a wick part therefrom;

second board member having at least a groove for the wick part formed on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has, the surface of said second board member being adhered to the first board member; and

third board member incorporating said second board member through a surface thereof, the surface of said third board member being adhered to the first board member.

2. The cooler according to claim 1, further comprising fourth board member having at least a groove for a condenser part formed on a surface thereof, said forth board member being made from material having higher thermal conductivity than said first board member has, the surface of the forth board member being adhered to the first board member, and said forth board member being incorporated into the surface of said third board member.

3. The cooler according to claim 1, wherein said second board member is made from metallic material including any of copper and nickel.

4. The cooler according to claim 1, further comprising a thin film layer made from any of silicon and copper, said thin film layer being provided between the surfaces of said first and third board members,

wherein said first and third board members are made from any of plastic material and glass material.

5. The cooler according to claim 1, further comprising a flexible board member including a passage for interconnecting the wick part and the condenser part,

wherein said first and third board members thus adhered are physically divided into an area including said second board member and an area including a condenser part of the heat pipe;

and

wherein the flexible board member intervenes between the divided areas.

6. An electronic apparatus comprising a cooler including:

first board member having a cavity portion formed on a surface thereof, said cavity portion corresponding to a part of a heat pipe excluding at least a wick part therefrom;

second board member having at least a groove for the wick part formed on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has, the surface of said second board member being adhered to the first board member; and

third board member incorporating said second board member through a surface thereof, the surface of said third board member being adhered to the first board member.

7. An electronic apparatus comprising a detachable/attachable portion for detaching and attaching a card-typed storage medium having a driver therefrom and thereto, and a cooler for transferring heat generated from the driver, said cooler including:

first board member having a cavity portion formed on a surface thereof, said cavity portion corresponding to a part of a heat pipe excluding at least a wick part therefrom;

second board member having at least a groove for the wick part formed on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has, the surface of said second board member being adhered to the first board member; and

third board member incorporating said second board member through a surface thereof, the surface of said third board member being adhered to the first board member.

8. A method for fabricating a cooler comprising the steps of:

forming first board member having a cavity portion on a surface thereof, said cavity corresponding to a part of a heat pipe excluding at least a wick part therefrom;

forming second board member having at least a groove for the wick part on a surface thereof, said second board member being made from material having higher thermal conductivity than said first board member has;

incorporating said second board member to third board member through a surface thereof and adhering a surface of the third board member to a surface of the first board member.

9. The method according to claim 9 further comprising the steps of:

forming fourth board member having at least a groove for a condenser part on a surface thereof, said forth board member being made form material having higher thermal conductivity than said first board member has; and

incorporating said forth board member to said third board member through a surface thereof.

10. The method according to claim 9, wherein said second board member is formed under a process of UV-LIGA.

11. The method according to claim 9, further comprising a step of forming adhesive members on any of the surfaces of said first and third board members to adhere said first and third board members.