Process control apparatus, systems, and methods
First Claim
Patent Images
1. A method, comprising:
- receiving a critical dimension associated with each wafer included in a lot of wafers at a station controller coupled to a metrology tool;
calculating a modified recipe time associated with each wafer in the lot of wafers based on a delta-to-target dimension and a base time; and
sending the modified recipe time in a message to a station controller coupled to an etch tool to process a selected wafer included in the lot of wafers.
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus and a system, as well as a method and article, may operate to receive a critical dimension associated with each wafer included in a lot of wafers at a station controller coupled to a metrology tool, calculate a modified recipe time associated with each wafer in the lot based on the critical dimension and a base time, and send the modified recipe time in a message to a station controller coupled to an etch tool to process each of the wafers included in the lot.
-
Citations
22 Claims
-
1. A method, comprising:
-
receiving a critical dimension associated with each wafer included in a lot of wafers at a station controller coupled to a metrology tool; calculating a modified recipe time associated with each wafer in the lot of wafers based on a delta-to-target dimension and a base time; and sending the modified recipe time in a message to a station controller coupled to an etch tool to process a selected wafer included in the lot of wafers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. An article comprising a machine-accessible medium having associated data, wherein the data, when accessed, results in a machine performing:
-
receiving a critical dimension associated with each wafer included in a lot of wafers at a station controller coupled to a metrology tool; calculating a modified recipe time associated with each wafer in the lot of wafers based on a delta-to-target dimension and a base time; and sending the modified recipe time in a message to a station controller coupled to an etch tool to process a selected wafer included in the lot of wafers. - View Dependent Claims (10, 11, 12, 13, 14)
-
-
15. An apparatus, comprising:
-
a station controller to receive a critical dimension of each wafer included in a lot of wafers; and a module to calculate a modified recipe time approximately equal to a sum of a base time, an offset time, and a quotient of a delta-to-target dimension divided by a slope relationship, wherein the delta-to-target dimension is determined by the critical dimension and a selected target value, and wherein the module is to transmit the modified recipe time to an etch tool for processing a selected wafer included in the lot of wafers according to the modified recipe time. - View Dependent Claims (16, 17)
-
-
18. A system, comprising:
-
a first station controller to receive a critical dimension of each wafer included in a lot of wafers; a module to calculate a modified recipe time approximately equal to a sum of a base time, an offset time, and a quotient of a delta-to-target dimension divided by a slope relationship, wherein the delta-to-target dimension is determined by the critical dimension and a selected target value; and an etch tool to receive the modified recipe time from the module and to process a selected wafer included in the lot of wafers according to the modified recipe time. - View Dependent Claims (19, 20, 21, 22)
-
Specification