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Process control apparatus, systems, and methods

  • US 6,999,848 B2
  • Filed: 12/19/2003
  • Issued: 02/14/2006
  • Est. Priority Date: 12/19/2003
  • Status: Expired due to Fees
First Claim
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1. A method, comprising:

  • receiving a critical dimension associated with each wafer included in a lot of wafers at a station controller coupled to a metrology tool;

    calculating a modified recipe time associated with each wafer in the lot of wafers based on a delta-to-target dimension and a base time; and

    sending the modified recipe time in a message to a station controller coupled to an etch tool to process a selected wafer included in the lot of wafers.

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