Heated pressure transducer
First Claim
1. A pressure transducer assembly comprising:
- a sensor enclosure;
a pressure sensor received in the sensor enclosure;
a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid;
an electronics circuit board electrically connected to the pressure sensor; and
an electronics enclosure containing the electronics board and secured to the sensor enclosure, wherein the electronics enclosure includes,an external housing constructed of thermally conductive material, anda heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing.
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Accused Products
Abstract
A pressure transducer assembly including a sensor enclosure, a pressure sensor received in the sensor enclosure, a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid, an electronics circuit board electrically connected to the pressure sensor, and an electronics enclosure containing the electronics board and secured to the sensor enclosure. The electronics enclosure includes an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material. The heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing. This arrangement allows the circuit board to remain cool even as the sensor is heated.
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Citations
20 Claims
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1. A pressure transducer assembly comprising:
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a sensor enclosure; a pressure sensor received in the sensor enclosure; a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid; an electronics circuit board electrically connected to the pressure sensor; and an electronics enclosure containing the electronics board and secured to the sensor enclosure, wherein the electronics enclosure includes, an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A pressure transducer assembly comprising:
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a sensor enclosure; a heated pressure sensor received in the sensor enclosure; an electronics circuit board electrically connected to the pressure sensor; and an electronics enclosure containing the electronics board and secured to the sensor enclosure, wherein the electronics enclosure includes, an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board, wherein one of the heat transfer plate and the external housing includes fingers received in pockets located on the other of the heat transfer plate and the external housing so that the heat transfer plate is in contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A pressure transducer assembly comprising:
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a sensor enclosure; a pressure sensor received in the sensor enclosure;
an electronics circuit board electrically connected to the pressure sensor; andan electronics enclosure containing the electronics board, wherein the electronics enclosure includes, an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate includes pads sized and adapted to contact heat-generating elements of the electronics circuit board. - View Dependent Claims (19, 20)
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Specification