Heated pressure transducer

• US 7,000,479 B1
• Filed: 05/02/2005
• Issued: 02/21/2006
• Est. Priority Date: 05/02/2005
• Status: Active Grant

• Current Assignee: MKS Instruments Incorporated
• Original Assignee: MKS Instruments Incorporated
• Inventors: Poulin, James M., Mello, Keith F.
• Primary Examiner(s): OEN, WILLIAM L
• Application Number:
  US11/119,604
• Time in Patent Office: 295 Days
• Field of Search: 737/08, 737/06, 737/14, 73754-756
• US Class Current: 73/708
• CPC Class Codes: G01L 19/04 Means for compensating for effects of changes of temperature , i.e. other than electric compensation
• CPC Class Codes: G01L 19/142 Multiple part housings

Abstract

A pressure transducer assembly including a sensor enclosure, a pressure sensor received in the sensor enclosure, a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid, an electronics circuit board electrically connected to the pressure sensor, and an electronics enclosure containing the electronics board and secured to the sensor enclosure. The electronics enclosure includes an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material. The heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing. This arrangement allows the circuit board to remain cool even as the sensor is heated.

Claims

1. A pressure transducer assembly comprising:

a sensor enclosure;

a pressure sensor received in the sensor enclosure;

a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid;

an electronics circuit board electrically connected to the pressure sensor; and

an electronics enclosure containing the electronics board and secured to the sensor enclosure, wherein the electronics enclosure includes,

an external housing constructed of thermally conductive material, and

a heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing.

2. A pressure transducer assembly according to claim 1, wherein:

the external housing of the electronics enclosure comprises a cap having an end wall and a side wall extending from the end wall to an open end of the cap, and wherein the side wall defines pockets; and

the heat transfer plate of the electronics enclosure is sized and shaped to close the open end of the cap such that the electronics board is contained within the cap and the heat transfer plate, and wherein the heat transfer plate has fingers received in the pockets of the external housing.

3. A pressure transducer assembly according to claim 2, wherein the heat-generating elements of the electronics circuit board are located on a surface of the circuit board facing the heat transfer plate, and the heat transfer plate includes pads in physical contact with the heat-generating elements.

4. A pressure transducer assembly according to claim 3, wherein the electronics circuit board comprises a control board in contact with the heat transfer plate and an input/output board positioned between the control board and the external housing of the electronics enclosure.

5. A pressure transducer assembly according to claim 4, wherein the sensor enclosure is made from thermally non-conductive material and includes an end wall, and the electronics enclosure is positioned adjacent the end wall of the sensor enclosure.

6. A pressure transducer assembly according to claim 1, further comprising:

a heater shell positioned within the sensor enclosure and containing the sensor; and

a heater connected to the heater shell and electrically connected to the electronics circuit board.

7. A pressure transducer assembly according to claim 6, further comprising a thermal insulating blanket surrounding the heater and the heater shell and a reflective coating on inner surfaces of the sensor enclosure.

8. A pressure transducer assembly according to claim 1, wherein:

the external housing of the electronics enclosure comprises a cap having an end wall and a side wall extending from the end wall to an open end of the cap, and wherein the side wall defines pockets; and

the heat transfer plate of the electronics enclosure is sized and shaped to close the open end of the cap such that the electronics board is contained within the cap and the heat transfer plate, and wherein the heat transfer plate has fingers received in the pockets the external housing.

9. A pressure transducer assembly according to claim 1, wherein the heat-generating elements of the electronics circuit board are located on a surface of the circuit board facing the heat transfer plate, and the heat transfer plate includes pads in physical contact with the heat-generating elements.

10. A pressure transducer assembly according to claim 1, wherein the sensor enclosure is made from thermally non-conductive material and includes an end wall, and the electronics enclosure is positioned adjacent the end wall of the sensor enclosure.

11. A pressure transducer assembly comprising:

a sensor enclosure;

a heated pressure sensor received in the sensor enclosure;

an electronics circuit board electrically connected to the pressure sensor; and

an electronics enclosure containing the electronics board and secured to the sensor enclosure, wherein the electronics enclosure includes,

an external housing constructed of thermally conductive material, and

a heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board,

wherein one of the heat transfer plate and the external housing includes fingers received in pockets located on the other of the heat transfer plate and the external housing so that the heat transfer plate is in contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing.

12. A pressure transducer assembly according to claim 11, wherein the external housing of the electronics enclosure defines the pockets, and the fingers are unitarily formed with the heat transfer plate and are received in the pockets of the external housing.

13. A pressure transducer assembly according to claim 11, wherein the heat-generating elements of the electronics circuit board are located on a surface of the circuit board facing the heat transfer plate, and the heat transfer plate includes pads in physical contact with the heat-generating elements.

14. A pressure transducer assembly according to claim 11, wherein the electronics circuit board comprises a control board in contact with the heat transfer plate and an input/output board positioned between the control board and the external housing of the electronics enclosure.

15. A pressure transducer assembly according to claim 11, wherein the sensor enclosure is made from thermally non-conductive material and includes an end wall, and the electronics enclosure is positioned adjacent the end wall of the sensor enclosure.

16. A pressure transducer assembly according to claim 11, further comprising:

a heater shell positioned within the sensor enclosure and containing the sensor; and

a heater connected to the heater shell and electrically connected to the electronics circuit board.

17. A pressure transducer assembly according to claim 16, further comprising a thermal insulating blanket surrounding the heater and the heater shell.

18. A pressure transducer assembly comprising:

a sensor enclosure;

a pressure sensor received in the sensor enclosure;

an electronics circuit board electrically connected to the pressure sensor; and

an electronics enclosure containing the electronics board, wherein the electronics enclosure includes,

an external housing constructed of thermally conductive material, and

a heat transfer plate constructed of thermally conductive material, wherein the heat transfer plate includes pads sized and adapted to contact heat-generating elements of the electronics circuit board.

19. A pressure transducer assembly according to claim 18, wherein the heat-generating elements of the electronics circuit board are located on a surface of the circuit board facing the heat transfer plate, and the pads of the heat transfer plate are located on a surface of the heat transfer plate facing the heat-generating elements.

20. A pressure transducer assembly according to claim 18, wherein the heat transfer plate has fingers received in pockets of the external housing of the electronics enclosure.