Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

• US 7,000,684 B2
• Filed: 10/06/2003
• Issued: 02/21/2006
• Est. Priority Date: 11/01/2002
• Status: Expired due to Term

• Current Assignee: Vertiv Corporation (Vertiv Holdings Co.)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Munch, Mark, Zhou, Peng, Upadhya, Girish, Goodson, Kenneth, Kenny, Thomas W., Lovette, James, Shook, James Gill, Corbin, Dave, McMaster, Mark
• Primary Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US10/680,584
• Publication Number:
  US 20040206477A1
• Time in Patent Office: 869 Days
• Field of Search: 165/80.4, 165/185, 165/104.21, 165/104.33, 361/699, 361/700, 257/714, 257/716, 174/15.1
• US Class Current: 165/80.4
• CPC Class Codes: F04B 17/00 Pumps characterised by combination with, or adaptation to, specific driving engines or motors
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 21/0015 Heat and mass exchangers, e.g. with permeable walls
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 13/185 Heat-exchange surfaces provided with microstructures or with porous coatings
• CPC Class Codes: F28F 2210/10 Particular layout, e.g. for uniform temperature distribution
• CPC Class Codes: F28F 2245/04 hydrophobic
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/086 having one or more openings therein forming tubular heat-exchange passages
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G06Q 20/20 Point-of-sale [POS] network systems
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Claims

1. A heat exchanger comprising:

a. an interface layer in contact with the heat source and configured to pass fluid therethrough, to cool the heat source, wherein the interface layer includes a porous microstructure disposed thereon; and

b. a manifold layer coupled to the interface layer, the manifold layer further comprising a first set of individualized fluid paths for channeling fluid to the interface layer, the individual fluid paths in the first set positioned to minimize pressure drop within the heat exchanger.

2. The heat exchanger according to claim 1 wherein the manifold layer further comprises a second set of individualized fluid paths for channeling fluid from the interface layer.

3. The heat exchanger according to claim 2 wherein the manifold layer further comprises a first port for providing fluid to the first set of individualized fluid paths and a second port for removing fluid channeled from the second set of individualized fluid paths.

4. The heat exchanger according to claim 1 wherein the first set of fluid paths are arranged to provide a minimized fluid path distance along the interface layer to cool a predetermined region of the heat source to a desired temperature.

5. The heat exchanger according to claim 3 wherein the first set and second set of fluid paths are arranged to provide a minimized fluid path distance between the first and second ports to cool a predetermined region of the heat source to a desired temperature.

6. The heat exchanger according to claim 1 wherein the fluid is in single phase flow conditions.

7. The heat exchanger according to claim 1 wherein at least a portion of the fluid is in two phase flow conditions.

8. The heat exchanger according to claim 1 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the heat exchanger.

9. The heat exchanger according to claim 2 wherein the manifold layer further comprises a circulation level having the first and second fluid paths extending therethrough, the circulation level coupled to the interface layer and configured to separably channel fluid to and from the interface layer via the first and second set of fluid paths.

10. The heat exchanger according to claim 9 wherein each of the fluid paths in the first set include a cylindrical protrusion in communication therewith, each cylindrical protrusion extending from the circulation level at a predetermined height.

11. The heat exchanger according to claim 3 wherein the manifold layer further comprises

a. a first level configured to channel fluid between the first port and the first set of fluid paths;

and

b. a second level coupled to the first level and configured to channel fluid between the second port and the second set of fluid paths wherein fluid channeled via the first level is kept separate from the fluid channeled via the second level in the manifold layer.

12. The heat exchanger according to claim 11 wherein the first level further comprises a first corridor in communication with the first port and the first set of fluid paths, wherein fluid in the first corridor flows directly to the first set of fluid paths.

13. The heat exchanger according to claim 11 wherein the second level further comprises a second corridor in communication with the second port and the second set of fluid paths wherein fluid in the second set flows directly to the second corridor.

14. The heat exchanger according to claim 2 wherein the first set of fluid paths are thermally insulated from the second set of fluid paths to prevent heat transfer therebetween.

15. The heat exchanger according to claim 2 wherein the first set and the second set of fluid paths are arranged in a uniform manner along at least one dimension.

16. The heat exchanger according to claim 2 wherein the first set and second set of fluid paths are arranged in a non-uniform manner along at least one dimension.

17. The heat exchanger according to claim 1 wherein each fluid paths in the first set is positioned a closest optimal distance to one another.

18. The heat exchanger according to claim 2 wherein the first set and second set of fluid paths are positioned to cool at least one interface hot spot region in the heat source.

19. The heat exchanger according to claim 2 wherein at least one of the first fluid paths flows via a plurality of first holes, wherein at least one first hole in the plurality has a first dimension substantially equivalent to a second dimension of at least one hole in the second set of fluid paths.

20. The heat exchanger according to claim 2 wherein at least one of the first fluid paths flows via a plurality of first holes, wherein at least one first hole in the plurality has a first dimension different than a second dimension of at least one second hole in the second set of fluid paths.

21. The heat exchanger according to claim 1 wherein the interface layer is made of a material having a thermal conductivity of at least 100 W/mk.

22. The heat exchanger according to claim 1 wherein the interface layer further comprises a plurality of pillars configured in a predetermined pattern along the interface layer.

23. The heat exchanger according to claim 22 wherein at least one of the plurality of pillars includes at least varying dimension along a predetermined direction.

24. The heat exchanger according to claim 22 wherein an appropriate number of pillars are disposed in a predetermined area along the interface layer.

25. The heat exchanger according to claim 1 wherein at least a portion of the interface layer has a roughened surface.

26. The heat exchanger according to claim 22 wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.

27. The heat exchanger according to claim 1 wherein the porous microstructure includes at least one pore having a varying dimension along a predetermined direction.

28. The heat exchanger according to claim 1 further comprising a plurality of microchannels disposed in a predetermined configuration along the interface layer.

29. The heat exchanger according to claim 1 wherein the interface layer is coupled to the heat source.

30. The heat exchanger according to claim 1 wherein the interface layer is integrally formed to the heat source.

31. The heat exchanger according to claim 1 wherein the heat source is an integrated circuit.

32. A heat exchanger configured to cool a heat source comprising:

a. an interface layer in contact with the heat source and configured to pass fluid therethrough, wherein the interface layer includes a porous microstructure disposed thereon; and

b. a manifold layer coupled to the interface layer, the manifold layer further comprising;

i. a first level having a plurality of substantially vertical inlet paths for delivering fluid to the interface layer, wherein the inlet paths are arranged an optimal fluid travel distance from one another other; and

ii. a second level having at least one outlet path for removing fluid from the interface layer.

33. The heat exchanger according to claim 32 wherein the first level further comprises at least one first port configured to channel fluid to the inlet paths.

34. The heat exchanger according to claim 33 wherein the second level further comprises at least one second port configured to channel fluid from the at least one outlet path, wherein fluid in the second level flows separately from the fluid in the first level.

35. The heat exchanger according to claim 34 wherein the second level further comprises a plurality of substantially vertical outlet paths for removing fluid from the interface layer, the plurality of inlet and outlet paths arranged an optimal fluid travel distance apart from each other.

36. The heat exchanger according to claim 35 wherein the manifold layer further comprises a circulation level coupled to the interface layer and having a plurality of first apertures extending vertically therethrough for channeling fluid along the inlet paths to the interface layer and a plurality of second apertures extending vertically therethrough for channeling fluid along the at least outlet path from the interface layer.

37. The heat exchanger according to claim 36 wherein the first level further comprises an inlet fluid corridor within for horizontally channeling fluid from the first port to the first apertures.

38. The heat exchanger according to claim 37 wherein the second level further comprises an outlet fluid corridor for horizontally channeling fluid from the second apertures to the second port.

39. The heat exchanger according to claim 36 wherein the first and second apertures are individually arranged in a uniform manner along at least one dimension.

40. The heat exchanger according to claim 36 wherein the first and second fluid apertures are individually arranged in a non-uniform manner along at least one dimension.

41. The heat exchanger according to claim 32 wherein the inlet paths and the at least one outlet paths are separately sealed from one another in the manifold layer.

42. The heat exchanger according to claim 32 wherein the interface layer is coupled to the heat source.

43. The heat exchanger according to claim 32 wherein the interface layer is integrally formed to the heat source.

44. The heat exchanger according to claim 32 wherein the heat source is an integrated circuit.

45. The heat exchanger according to claim 36 wherein the first and second apertures are arranged to cool at least one interface hot spot cooling region in the heat source.

46. The heat exchanger according to claim 36 wherein at least one of the first apertures has an inlet dimension substantially equivalent to an outlet dimension of at least one second apertures in the plurality.

47. The heat exchanger according to claim 36 wherein at least one of the first apertures has an inlet dimension different than an outlet dimension of at least one of the second apertures in the plurality.

48. The heat exchanger according to claim 32 wherein the interface layer is made of a material having a thermal conductivity of at least 100 W/mk.

49. The heat exchanger according to claim 32 wherein the interface layer further comprises a plurality of pillars disposed thereon in an appropriate pattern.

50. The heat exchanger according to claim 49 wherein at least one of the plurality of pillars includes at least varying dimension along a predetermined direction.

51. The heat exchanger according to claim 49 wherein an appropriate number of pillars are disposed in a predetermined area along the interface layer.

52. The heat exchanger according to claim 32 wherein at least a portion of the interface layer has a roughened surface.

53. The heat exchanger according to claim 49 wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.

54. The heat exchanger according to claim 32 wherein the porous microstructure includes at least one pore having a varying dimension along a predetermined direction.

55. The heat exchanger according to claim 32 wherein an average pore size in the porous microstructure is within the range and including 30 microns and 300 microns.

56. The heat exchanger according to claim 32 wherein at least one region of the porous microstructure has a porosity in the range and including 0.3 and 0.8.

57. The heat exchanger according to claim 32 wherein the interface layer further comprises a plurality of microchannels disposed thereon in an appropriate pattern.

58. The heat exchanger according to claim 36 further comprising a plurality of cylindrical protrusions extending an appropriate height from the circulation level, each protrusion in communication with the first apertures.

59. A manifold layer adapted to be coupleable to an interface layer to form a microchannel heat exchanger comprising:

a. an inlet port for providing a first temperature fluid;

b. an inlet fluid path in communication with the inlet port, the inlet fluid path adapted for channeling first temperature fluid to the interface layer, wherein the interface layer includes a porous microstructure disposed thereon;

c. an outlet fluid path adapted for removing a second temperature fluid from the interface layer, wherein the first temperature fluid and the second temperature fluid are kept separate in the manifold layer;

d. an outlet port in communication with the outlet fluid path, wherein the second temperature fluid exits the manifold layer via the outlet port; and

e. a third layer having a series of substantially vertical inlet passages for channeling the first temperature fluid and a series of substantially vertical outlet passages for channeling the second temperature fluid, each inlet passage in communication with the inlet flow path and each outlet passage in communication with the outlet flow path, wherein each inlet and outlet passage is arranged to minimize pressure drop therebetween and wherein the inlet and outlet passages are arranged in a non-uniform manner along at least one dimension of the third layer.

60. The manifold layer according to claim 59 further comprising

a. a first layer having a fluid exit corridor in communication with the outlet corridor and the outlet fluid path;

and

b. a second layer coupled to the first layer and having a fluid entry corridor in communication with the inlet port and the inlet fluid path.

61. The manifold layer according to claim 59 wherein the inlet and outlet passages are arranged in a uniform manner along at least one dimension.

62. The manifold layer according to claim 61 wherein the inlet and outlet passages are arranged in a non-uniform manner along at least one dimension of the third layer.

63. The manifold layer according to claim 59 wherein the inlet and outlet apertures are separately sealed from one another.

64. The manifold layer according to claim 59 wherein at least one of the inlet passages has an inlet dimension substantially equivalent to an outlet dimension of at least one outlet passage.

65. The manifold layer according to claim 59 wherein at least one of the inlet passages has an inlet dimension than an outlet dimension of at least one outlet passage.

66. A method of manufacturing a heat exchanger configured to cool a heat source, the method comprising the steps of:

a. forming an interface layer configurable to be in contact with the heat source to pass fluid therethrough, wherein the interface layer includes a micro-porous microstructure disposed thereon;

b. forming a manifold layer to include at least one inlet fluid path and at least one outlet fluid path, the at least one inlet fluid path and the at least one outlet fluid path arranged to channel fluid flow an optimal minimum distance therebetween along the interface layer; and

c. coupling the manifold layer to the interface layer.

67. The method of manufacturing according to claim 66 further comprising the steps of:

a. configuring at least one inlet fluid port to the at least one inlet fluid path wherein fluid enters the heat exchanger via the inlet fluid port; and

b. configuring at least one fluid port to the at least one outlet fluid path, wherein fluid exits the heat exchanger via the outlet port.

68. The method of manufacturing according to claim 66 wherein the step of forming the manifold layer further comprises forming a circulation level having a plurality of inlet apertures extending vertically therethrough to the interface layer and configureable to channel inlet fluid through the at least one inlet fluid paths and a plurality of outlet apertures extending vertically therethrough to the interface layer and configureable to channel outlet fluid through the at least one outlet fluid paths.

69. The method of manufacturing according to claim 68 wherein the step of forming the manifold layer further comprises:

a. forming an inlet level configureable to channel fluid from the inlet port to the inlet apertures via the inlet corridor; and

b. coupling the inlet level to the circulation level, wherein the inlet apertures are sealably coupled with the inlet corridor.

70. The method of manufacturing according to claim 69 wherein the step of forming the manifold layer further comprises:

a. forming an outlet level configureable to channel fluid from the outlet port to the outlet apertures via the outlet corridor; and

b. coupling the outlet level to the circulation level, wherein the outlet apertures are sealably coupled with the outlet corridor.

71. The method of manufacturing according to claim 66 wherein the at least one inlet fluid path and the at least one outlet fluid path are positioned to cool at least one interface hot spot region in the heat source.

72. The method of manufacturing according to claim 66 further comprising the step of insulating the at least one fluid inlet paths and the at least one fluid outlet paths in the manifold layer to minimize heat transfer therebetween.

73. The method of manufacturing according to claim 66 wherein the interface layer is made of a material having a thermal conductivity of at least 100 W/m-K.

74. The method of manufacturing according to claim 66 further comprising the step of applying a thermally conductive coating to the interface layer.

75. The method of manufacturing according to claim 74 wherein the thermal conductive coating is applied to the interface layer by an electroplating process.

76. The method of manufacturing according to claim 66 further comprising forming a plurality of pillars in a predetermined pattern along the interface layer.

77. The method of manufacturing according to claim 76 wherein at least one of the plurality of pillars includes at least varying dimension along a predetermined direction.

78. The method of manufacturing according to claim 66 further comprising configuring at least a portion of the interface layer to have a roughened surface.

79. The method of manufacturing according to claim 66 further comprising forming a plurality of microchannels onto the interface layer.

80. The method of manufacturing according to claim 76 further comprising the step of applying a thermally conductive coating to the plurality of pillars.

81. The method of manufacturing according to claim 76 wherein the plurality of pillars are formed by an electroforming process.

82. The method of manufacturing according to claim 76 wherein the plurality of pillars are formed by an etching process.

83. The method of manufacturing according to claim 82 wherein the etching process includes a wet etching process.

84. The method of manufacturing according to claim 83 wherein the etching process includes a plasma etching process.

85. The method of manufacturing according to claim 83 wherein the etching process includes a photochemical etching process.

86. The method of manufacturing according to claim 83 wherein the etching process includes a chemical etching process.

87. The method of manufacturing according to claim 83 wherein the etching process includes a laser assisted chemical etching process.

88. The method of manufacturing according to claim 66 wherein the interface layer is formed by a laser assisted chemical etching process.

89. The method of manufacturing according to claim 76 wherein the electroforming process is performed in combination with a hot embossing technique.

90. The method of manufacturing according to claim 76 wherein the electroforming process further comprises utilizing a soft lithography technique.

91. The method of manufacturing according to claim 66 wherein the manifold layer is formed by a laser drilling process.

92. The method of manufacturing according to claim 66 wherein the manifold layer is formed by a soft lithography process.

93. The method of manufacturing according to claim 66 wherein the manifold layer is formed by an injection molding process.

94. The method of manufacturing according to claim 66 wherein the manifold layer is formed by an machining process.

95. The method of manufacturing according to claim 66 wherein the manifold layer is formed by an EDM process.

96. The method of manufacturing according to claim 66 wherein the manifold layer is formed by a stamping process.

97. The method of manufacturing according to claim 66 wherein the manifold layer is formed by a MIM process.

98. The method of manufacturing according to claim 66 wherein the manifold layer is formed by cross cutting process.

99. The method of manufacturing according to claim 66 wherein the manifold layer is formed by a sawing process.

100. An electronic device which produces heat comprising:

a. an integrated circuit;

b. an interface layer for cooling heat produced by the electronic device, the interface layer integrally formed with the integrated circuit and configured to pass fluid therethrough, wherein the interface layer includes a porous microstructure disposed thereon; and

c. a manifold layer for circulating fluid with the interface layer, the manifold layer having at least one inlet fluid path for delivering fluid to the interface layer and at least one outlet fluid path for removing fluid from the interface layer, the at least one inlet fluid path and the at least one outlet fluid path arranged to provide an optimal minimum fluid travel distance apart from each other.