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Method of protecting microfabricated devices with protective caps

  • US 7,001,793 B2
  • Filed: 03/04/2004
  • Issued: 02/21/2006
  • Est. Priority Date: 01/10/2001
  • Status: Expired due to Term
First Claim
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1. A method including:

  • a) providing a wafer having a plurality of microfabricated devices and a plurality of bond pads formed thereon;

    b) applying a plurality of substantially hollow caps to a first side of the wafer, the caps positioned such that, in plan view, each cap overlays part or all of at least one microfabricated device and such that said bond pads are exposed;

    c) applying a plurality of hollow caps to a second side of the wafer, the caps positioned such that, in plan view, the caps provide a mask to said bond pads; and

    d) applying one or more etches to the wafer from the second side toward the first side to etch away at least some of the material between the peripheries of said caps to separate the wafer into separate units.

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  • 4 Assignments
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