Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same

• US 7,001,825 B2
• Filed: 12/16/2004
• Issued: 02/21/2006
• Est. Priority Date: 02/22/2001
• Status: Expired due to Term

• Current Assignee: Invensas Corporation
• Original Assignee: Tru-Si Technologies, Inc.
• Inventors: Siniaguine, Oleg, Halahan, Patrick B.
• Primary Examiner(s): Wilczewski, Mary
• Assistant Examiner(s): Thomas, Toniae M.
• Application Number:
  US11/014,464
• Publication Number:
  US 20050106845A1
• Time in Patent Office: 432 Days
• Field of Search: 438/456, 438/459, 438/735, 438/737, 438/738, 438/977
• US Class Current: 438/456
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/04941 TiN
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and a plurality of conductive layers in the opening. In some embodiments, one conductive layer provides an electromagnetic shield that shields the substrate from AC signals carried by a contact pad made from another conductive layer on a backside of the substrate. The conductive layers can also be used to form capacitor/rectifier networks. Manufacturing methods also provided.

Claims

1. A circuit manufacturing method comprising:

providing a structure in which an opening extends into a first side of a semiconductor substrate having a second side opposite the first side such that the opening penetrates partway through the substrate, a plurality of conductive layers overlay one another in the opening, and the conductive layers include a first conductive layer and a second conductive layer overlaying the first conductive layer such that the first and second conductive layers (i) are separated by insulating material in the opening, or (ii) form a P-N junction in the opening, or (iii) form a Schottky junction in the opening;

removing material along the second side of the substrate to reach the opening and expose the second conductive layer from the second side of the substrate;

wherein removing material along the second side of the substrate is performed such that the second conductive layer is largely flush with the second side of the substrate;

wherein;

the removal of the material is followed by etching the substrate along its second side; and

the second conductive layer protrudes from the opening along the second side of the substrate after the etch.

2. The method of claim 1 wherein removing material along the second side of the substrate is performed such that the first conductive layer is also largely flush with the second side of the substrate.

3. The method of claim 1 wherein the first and second conductive layers are separated by insulating material in the opening.

4. The method of claim 3 wherein removing material along the second side of the substrate is performed such that second conductive layer, the insulating material, and the first conductive layer are all largely flush with the second side of the substrate.

5. A circuit manufacturing method comprising:

providing a structure in which an opening extends into a first side of a semiconductor substrate having a second side opposite the first side such that the opening penetrates partway through the substrate, a plurality of conductive layers overlay one another in the opening, and the conductive layers include a first conductive layer and a second conductive layer overlaying the first conductive layer such that the first and second conductive layers (i) form a P-N junction in the opening, or (ii) form a Schottky junction in the opening;

removing material along the second side of the substrate to reach the opening and expose the second conductive layer from the second side of the substrate;

wherein removing material along the second side of the substrate is performed such that the second conductive layer is largely flush with the second side of the substrate.

6. The method of claim 5 wherein removing material along the second side of the substrate is performed such that the first conductive layer is also largely flush with the second side of the substrate.

7. The method of claim 5 wherein the first and second conductive layers form a P-N junction in the opening.

8. The method of claim 5 wherein the first and second conductive layers form a Schottky junction in the opening.