×

Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof

  • US 7,002,237 B2
  • Filed: 05/21/2003
  • Issued: 02/21/2006
  • Est. Priority Date: 02/18/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A spherical shaped semiconductor device provided on a flat circuit substrate, comprising:

  • a protective insulating film formed on an outer surface of the spherical shaped semiconductor device; and

    a plurality of input/output connection openings which are disposed along a intersected portion of the protective insulating film where a plane face orthogonal to an axis running through a center of the spherical shaped semiconductor device intersects the protective insulating film, wherein the spherical shaped semiconductor device is electrically connected to the flat circuit substrate through a flexible printed wiring substrate wound around the spherical shaped semiconductor device.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×