Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof

• US 7,002,237 B2
• Filed: 05/21/2003
• Issued: 02/21/2006
• Est. Priority Date: 02/18/2000
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Takaishi, Masakatsu
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US10/442,127
• Publication Number:
  US 20030209792A1
• Time in Patent Office: 1,007 Days
• Field of Search: 257/627, 257/618, 257/690, 257/701, 257/688, 257/750, 257/737, 257/738
• US Class Current: 257/627
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/1017 being a sphere
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence

Abstract

A spherical shaped semiconductor device has a protective insulating film thereon and input/output connection openings that are located along a intersected portion on the protective insulating film where a plane face running through a center of the spherical shaped semiconductor device intersects the protective insulating film. More input/output connection openings are provided on the spherical shaped semiconductor device compared with a conventional square semiconductor device. The spherical shaped semiconductor device is connected to a flat circuit substrate through a flexible printed wiring substrate. A lower portion of the flexible printed wiring substrate is cut into divided sections for connecting input/output terminals of the flat circuit substrate. Connection between the spherical shaped semiconductor device and the flat circuit substrate does not cause any cracks or disconnection due to flexibility of the flexible printed wiring substrate.

Claims

1. A spherical shaped semiconductor device provided on a flat circuit substrate, comprising:

a protective insulating film formed on an outer surface of the spherical shaped semiconductor device; and

a plurality of input/output connection openings which are disposed along a intersected portion of the protective insulating film where a plane face orthogonal to an axis running through a center of the spherical shaped semiconductor device intersects the protective insulating film,

wherein the spherical shaped semiconductor device is electrically connected to the flat circuit substrate through a flexible printed wiring substrate wound around the spherical shaped semiconductor device.

2. The spherical shaped semiconductor device according to claim 1, wherein

the axis running through the center of the spherical shaped semiconductor device is orthogonal to the flat circuit substrate.

3. The spherical shaped semiconductor device according to claim 2, wherein

the input/output connection openings are disposed along a intersected portion of the protective insulating film where a plane face running through the center of the spherical shaped semiconductor device intersects the protective insulating film.

4. The spherical shaped semiconductor device according to claim 1 wherein the flexible printed wiring substrate comprises:

a flexible resin layer; and

a flexible metallic foil layer stacked on the resin layer,

wherein the metallic foil layer forms circuit patterns to electrically connect the spherical shaped semiconductor device to the flat circuit substrate.

5. The spherical shaped semiconductor device according to claim 4, wherein the resin layer is made of polyimide.

6. The spherical shaped semiconductor device according to claim 4, wherein the metallic foil layer is made of aluminum.

7. The spherical shaped semiconductor device according to claim 4, wherein a lower portion of the flexible printed wiring substrate located on a side of the flat circuit substrate is cut into a plurality of divided sections to be connected to input/output terminals of the flat circuit substrate.

8. The spherical shaped semiconductor device according to claim 7, wherein the flexible printed wiring substrate has a divided section longer than other divided sections.

9. The spherical shaped semiconductor device according to claim 4, wherein an upper portion of the flexible printed wiring substrate located on a side of the spherical shaped semiconductor device is cut into a plurality of divided sections to be connected to input/output terminals of the spherical shaped semiconductor device.

10. The spherical shaped semiconductor device according to claim 9, wherein the flexible printed wiring substrate has a divided section longer than other divided sections.

11. A flexible printed wiring substrate, comprising of:

a flexible resin layer; and

a flexible metallic foil layer stacked on the resin layer, wherein

the metallic foil layer forms circuit patterns to electrically connect a spherical shaped semiconductor device to a flat circuit substrate on which the spherical shaped semiconductor device is mounted.

12. The flexible printed wiring substrate according to claim 11, wherein the resin layer is made of polyimide.

13. The flexible printed wiring substrate according to claim 11, wherein the metallic foil layer is made of aluminum.

14. The flexible printed wiring substrate according to claim 11, wherein

a lower portion of the flexible printed wiring substrate located on a side of the flat circuit substrate is cut into a plurality of divided sections to be connected to input/output terminals of the flat circuit substrate.

15. The flexible printed wiring substrate according to claim 14, wherein

the flexible printed wiring substrate has a divided section longer than other divided sections.

16. The flexible printed wiring substrate according to claim 11, wherein

an upper portion of the flexible printed wiring substrate located on a side of the spherical shaped semiconductor device is cut into a plurality of divided sections to be connected to input/output terminals of the spherical shaped semiconductor device.

17. The flexible printed wiring substrate according to claim 16, wherein the flexible printed wiring substrate has a divided section longer than other divided sections.

18. A spherical shaped semiconductor device provided on a flat circuit substrate, comprising:

a protective insulating film formed on an outer surface of the spherical shaped semiconductor device; and

a plurality of input/output connection openings which are disposed along an intersected portion of the protective insulating film where a plane face parallel to the flat circuit substrate and running through a center of the spherical shaped semiconductor device intersects the protective insulating film,

wherein the spherical shaped semiconductor device is electrically connected to the flat circuit substrate through the flexible printed wiring substrate of claim 14 wound around the spherical shaped semiconductor device.

19. An integrated circuit structure comprising:

a spherical shaped semiconductor device, and

a flat circuit substrate,

wherein the spherical shaped semiconductor device is electrically connected to the flat circuit substrate through a flexible printed wiring substrate.