External liquid loop heat exchanger for an electronic system

• US 7,002,799 B2
• Filed: 04/19/2004
• Issued: 02/21/2006
• Est. Priority Date: 04/19/2004
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Simon, Glenn C., Malone, Christopher G.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/828,448
• Publication Number:
  US 20050231913A1
• Time in Patent Office: 673 Days
• Field of Search: 361/677, 361/678, 361687-690, 361694-704, 174/15.1, 174/15.2, 165/80.4, 165/104.33, 622/592
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source

Abstract

A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.

Claims

1. A cooling apparatus comprising:

a tube extending in a loop interior to an electronic system chassis, through a chassis wall, and exterior to the chassis; and

a liquid loop heat exchanger body comprising a parallel stack of closely-spaced plate fins enclosing and coupled to a portion of the loop external to the chassis and configured for attachment to an exterior surface of the chassis, wherein the tube exterior to the electronic system chassis further comprises;

an inlet tube and an outlet tube coupled to the heat exchanger body; and

at least one hinge coupled to at least one of the inlet tube and outlet tube enabling the heat exchanger body to be rotated away from the electronic system chassis for user and/or service access.

2. The apparatus according to claim 1 further comprising:

the parallel stack of closely-spaced plate fins arranged in a plurality of mutually parallel planes attached to the tube segment and arranged perpendicular to the chassis exterior surface.

3. The apparatus according to claim 1 wherein:

the heat exchanger body is adapted for mounting on an exterior surface of a compact computer server chassis and has physical dimensions that are larger than can be contained within the chassis.

4. The apparatus according to claim 1 wherein:

edges of the parallel stack of closely-spaced plate fins of the heat exchanger body are adapted for mounting on a frontal exterior surface of the chassis.

5. The apparatus according to claim 1 further comprising:

a tube enclosing a cooling fluid and extending in a loop that passes interiorly though the heat exchanger body external to the electronic system chassis, passes through the electronic system chassis to cooling plates coupled to electronic components interior to the electronic system chassis.

6. The apparatus according to claim 1 further comprising:

a tube segment configured to enclose a cooling fluid and positioned interior to the heat exchanger body; and

a plurality of fins configured in an ornamental arrangement attached to the tube segment at a frontal surface of the electronic system chassis.

7. The apparatus according to claim 1 further comprising:

ones of the parallel stack of closely-spaced plate fins of the heat exchanger body varying in width and height along a surface of the electronic system chassis in an arrangement that enables access to indicator lights, removable input/output devices, and/or labeling.

8. The apparatus according to claim 1 further comprising:

a pump coupled to the tube and adapted to generate a pressure head suitable to drive a cooling fluid interior to the tube through the loop interior and exterior to the chassis.

9. A liquid loop cooling system comprising:

a tubing forming a loop that extends through an electronic system chassis interior to selectively apply cooling to interior system components and further exits the chassis to an exterior tubing segment exterior to the chassis; and

a liquid loop heat exchanger comprising a parallel stack of plate fins exterior to the chassis and coupled to the exterior tubing segment, wherein the exterior tubing segment further comprises;

an inlet tube and an outlet tube coupled to the heat exchanger; and

at least one hinge coupled to the inlet tube and outlet tube enabling the heat exchanger to be rotated away from the electronic system chassis for user and/or service access.

10. The cooling system according to claim 9 further comprising:

a pump coupled into the tubing and adapted to generate a pressure head suitable to drive a cooling fluid interior to the tubing through the loop interior and exterior to the chassis.

11. The cooling system according to claim 9 further comprising:

at least one cold plate coupled to the tubing positioned to locally cool a heat source.

12. An electronic system comprising:

a chassis including airflow inlet and outlet vents, and fans capable of circulating air from the inlet vents to the outlet vents;

a plurality of components mounted within the chassis and forming local heat sources;

a tubing forming a loop that extends through the chassis interior to selectively apply cooling to the components and further exits the chassis to an exterior tubing segment exterior to the chassis; and

a liquid loop heat exchanger comprising a parallel stack of planar plate fins exterior to the chassis, coupled to the exterior tubing segment, and arranged perpendicular to a planar surface of the chassis, at least one fan selectively positioned to drive air in an airflow pathway passing between the parallel planar plate fins in the heat exchanger; and

at least one fan selectively positioned within the chassis, separated from the heat exchanger.

13. The system according to claim 12 further comprising:

a pump coupled to the tubing and adapted to pump a cooling fluid through the tubing.

14. The system according to claim 12 further comprising:

at least one cold plate coupled to the tubing and selectively positioned to cool the local heat sources.

15. The system according to claim 12 further comprising:

at least one fan coupled to the heat exchanger external to the chassis.

16. The system according to claim 12 wherein:

the heat exchanger is adapted for mounting on an exterior surface of a compact form factor computer server chassis and has physical dimensions that are larger than can be contained within the chassis.

17. A method of configuring a liquid loop cooling system in an electronic system comprising:

arranging a tubing in a loop extending through an electronic system chassis interior;

passing the tubing from the chassis interior through a chassis wall to the chassis exterior;

extending the tubing loop outside the electronic system chassis;

mounting a liquid loop heat exchanger including a plurality of mutually parallel planar plate fins on the exterior of the chassis, the mutually planar parallel plate fins being coupled to the chassis exterior perpendicular to a chassis surface; and

connecting the tubing loop outside the chassis to the liquid loop heat exchanger at a hinged connection, the tubing loop passing through and perpendicular to the mutually parallel planar plate fins; and

configuring the hinged connection whereby the liquid loop heat exchanger is enabled to be rotated away from the electronic system chassis for user and/or service access.

18. The method according to claim 17 further comprising:

determining heat distribution within the electronic system chassis containing a plurality of components; and

arranging the tubing in the loop extending through an electronic system chassis interior to selectively apply cooling to heat-generating components.

19. The method according to claim 17 further comprising:

coupling the tubing interior to the chassis to at least one cold plate selectively positioned to cool the heat-generating components.

20. The method according to claim 19 further comprising:

positioning at least one fan to drive air through the liquid loop heat exchanger, the at least one fan positioned interior to the chassis, exterior to the chassis, or a combination of interior and exterior to the chassis.

21. The method according to claim 19 further comprising:

inserting a pump in the tubing loop to enable pumping of a cooling fluid through the tubing and the heat exchanger.