Method of cooling semiconductor die using microchannel thermosyphon

• US 7,002,801 B2
• Filed: 10/16/2003
• Issued: 02/21/2006
• Est. Priority Date: 02/12/2002
• Status: Expired due to Term

• Current Assignee: Valtrus Innovations Limited (f/k/a Dolya Holdco 9 Limited) (Key Patent Innovations Limited)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Zeighami, Roy, Belady, Christian L.
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US10/687,382
• Publication Number:
  US 20040080913A1
• Time in Patent Office: 859 Days
• Field of Search: 361689-704, 361/715, 361/722, 361717-720, 361749-751, 174/15.1, 174/15.2, 174/16.3, 174/252, 165/46, 165/80.3, 165/80.4, 165/104.19, 165/104.26, 165/104.33, 298/900.3, 257713-715, 257721-722, 622/592, 428/209, 428/901
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die'"'"'s micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.

Claims

1. A method of cooling a semiconductor die, comprising the steps of:

flowing fluid through micro-channels formed into the die;

communicating fluid from the die to a condenser arranged above the die;

cooling fluid at the condenser; and

communicating fluid from the condenser to the micro-channels.

2. A method of claim 1, the step of flowing comprising flowing fluid through the micro-channels bounded, at least in part, by a semiconductor element coupled with the die.

3. A method of claim 2, the semiconductor element comprising one of silicon and a glass plate.

4. A method of claim 1, further comprising the step of shaping the micro-channels for preferential fluid flow along the micro-channels.

5. A method of claim 1, the steps of communicating comprising utilizing headers coupled with the micro-channels.

6. A method of claim 1, the step of communicating fluid from the condenser to the micro-channels comprising utilizing gravity to force the fluid to the die.