Micro-fluidic interconnect
First Claim
Patent Images
1. A microfluidic interconnect comprising:
- a first substrate comprising;
a first upper surface and an opposed first lower surface;
a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface;
a first fluidic pathway disposed within the first substrate, fluidicaily connected to the first fluidic opening;
a second substrate comprising;
a second upper surface and an opposed second lower surface;
an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface;
a second fluidic pathway disposed within the second substrate, fluidically connected to the second fluidic opening;
means for bonding the first lower surface of the first substrate to the second upper surface of the second substrate, the bonding means having a through hole, substantially aligned with the extension on the second upper surface of the second substrate;
the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate.
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Abstract
An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm×6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.
46 Citations
76 Claims
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1. A microfluidic interconnect comprising:
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a first substrate comprising; a first upper surface and an opposed first lower surface; a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface; a first fluidic pathway disposed within the first substrate, fluidicaily connected to the first fluidic opening; a second substrate comprising; a second upper surface and an opposed second lower surface; an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface; a second fluidic pathway disposed within the second substrate, fluidically connected to the second fluidic opening; means for bonding the first lower surface of the first substrate to the second upper surface of the second substrate, the bonding means having a through hole, substantially aligned with the extension on the second upper surface of the second substrate; the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A microfluidic interconnect comprising:
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a first substrate comprising; a first upper surface and an opposed first lower surface; a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface; a first fluidic pathway disposed within the first substrate, fluidically connected to the first fluidic opening; a second substrate comprising; a second upper surface and an opposed second lower surface; an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface; a second fluidic pathway disposed within the second substrate, fluidically connected to the second fluidic opening; an adhesive layer in contact with the first lower surface of the first substrate and the second upper surface of the second substrate, the adhesive layer having a through hole, substantially aligned with the extension on the second upper surface of the second substrate; the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A microfluidic interconnect comprising:
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a first substrate comprising; a first upper surface and an opposed first lower surface, a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface; a first fluidic pathway disposed within the first substrate, fluidically connected to the first fluidic opening; a second substrate comprising; a second upper surface and an opposed second lower surface; an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface; a third fluidic opening disposed on the second lower surface; a second fluidic pathway disposed within the second substrate, fluidically connecting the second fluidic opening to the third fluidic opening; means for bonding the first lower surface of the first substrate to the second upper surface of the second substrate, the bonding means having a through hole, substantially aligned with the extension on the second upper surface of the second substrate; the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate; a third substrate comprising; a third upper surface and an opposed third lower surface; a fourth fluidic opening disposed on the third upper surface; a third fluidic channel within the third substrate, fluidically connected to the fourth fluidic opening; means for sealing the second lower surface of the second substrate, to the third upper surface of the third substrate, the sealing means having a through hole fluidically connecting the third fluidic opening to the fourth fluidic opening; means for clamping the sealing means between the second lower surface of the second substrate and the third upper surface of the third substrate; whereby the first fluidic pathway in the first substrate is fluidically connected to the second fluidic pathway in the second substrate and, the second fluidic pathway in the second substrate is fluidically connected to the third fluidic pathway in the third substrate. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A microfluidic interconnect comprising:
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a first substrate comprising; a first upper surface and an opposed first lower surface; a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface; a first fluidic pathway disposed within the first substrate, fluidically connected to the first fluidic opening; a second substrate comprising; a second upper surface and an opposed second lower surface; an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface; a third fluidic opening disposed on the second lower surface; a second fluidic pathway disposed within the second substrate, fluidically connecting the second fluidic opening to the third fluidic opening; means for bonding the first lower surface of the first substrate to the second upper surface of the second substrate, the bonding means having a through hole, substantially aligned with the extension on the second upper surface of the second substrate; the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate; a third substrate comprising; a third upper surface and an opposed third lower surface; a fourth fluidic opening disposed on the third upper surface; a third fluidic channel within the third substrate, fluidically connected to the fourth fluidic opening; an adhesive layer in contact with the second lower surface of the second substrate and the third upper surface of the third substrate, the adhesive layer having a through hole, fluidically connecting the third fluidic opening to the fourth fluidic opening; whereby the first fluidic pathway in the first substrate is fluidically connected to the second fluidic pathway in the second substrate and, the second fluidic pathway in the second substrate is fluidically connected to the third fluidic pathway in the third substrate. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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48. A microfluidic interconnect comprising:
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a first substrate comprising; a first upper surface and an opposed first lower surface; a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface; a first fluidic pathway disposed within the first substrate, fluidically connected to the first fluidic opening; a second substrate comprising; a second upper surface and an opposed second lower surface; an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface; a third fluidic opening disposed on the second lower surface; a second fluidic pathway disposed within the second substrate, fluidically connecting the second fluidic opening to the third fluidic opening; an adhesive layer in contact with the first lower surface of the first substrate and the second upper surface of the second substrate, the adhesive layer having a through hole, substantially aligned with the extension on the second upper surface of the second substrate; the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate; a third substrate comprising; a third upper surface and an opposed third lower surface; a fourth fluidic opening disposed on the third upper surface; a third fluidic channel within the third substrate, fluidically connected to the fourth fluidic opening; means for sealing the second lower surface of the second substrate, to the third upper surface of the third substrate, the sealing means having a through hole fluidically connecting the third fluidic opening to the fourth fluidic opening; means for damping the sealing means between the second lower surface of the second substrate and the third upper surface of the third substrate whereby the first fluidic pathway in the first substrate is fluidically connected to the second fluidic pathway in the second substrate and, the second fluidic pathway in the second substrate is fluidically connected to the third fluidic pathway in the third substrate. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. A microfluidic interconnect comprising:
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a first substrate comprising; a first upper surface and an opposed first lower surface; a cavity disposed in the first lower surface, the cavity having a first bounding surface, and a first fluidic opening disposed on the first bounding surface; a first fluidic pathway disposed within the first substrate, fluidically connected to the first fluidic opening; a second substrate comprising; a second upper surface and an opposed second lower surface; an extension disposed on the second upper surface, the extension having a second bounding surface and a second fluidic opening disposed on the second bounding surface; a third fluidic opening disposed on the second lower surface; a second fluidic pathway disposed within the second substrate, fluidically connecting the second fluidic opening to the third fluidic opening; a first adhesive layer in contact with the first lower surface of the first substrate and the second upper surface of the second substrate, the first adhesive layer having a through hole, substantially aligned with the extension on the second upper surface of the second substrate; the extension and the cavity being dimensioned and spaced to interfit, fluidically connecting the first fluidic opening to the second fluidic opening, thereby fluidically connecting the first fluidic pathway in the first substrate with the second fluidic pathway in the second substrate; a third substrate comprising; a third upper surface and an opposed third lower surface; a fourth fluidic opening disposed on the third upper surface; a third fluidic channel within the third substrate, fluidically connected to the fourth fluidic opening; a second adhesive layer in contact with the second lower surface of the second substrate and the third upper surface of the third substrate, the second adhesive layer having a through hole, fluidically connecting the third fluidic opening to the fourth fluidic opening; whereby the first fluidic pathway in the first substrate is fluidically connected to the second fluidic pathway in the second substrate and, the second fluidic pathway in the second substrate is fluidically connected to the third fluidic pathway in the third substrate. - View Dependent Claims (63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76)
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Specification