Paste, display member, and process for production of display member

• US 7,004,812 B2
• Filed: 05/22/2001
• Issued: 02/28/2006
• Est. Priority Date: 05/23/2000
• Status: Active Grant

• Current Assignee: Toray Industries Incorporated
• Original Assignee: Toray Industries Incorporated
• Inventors: Masaki, Takaki, Tabata, Norikazu, Takahashi, Hiromitsu, Tanaka, Akihiko, Hashimoto, Mitsuyo, Uegaki, Hiroko
• Primary Examiner(s): Ha, Nguyen T.
• Application Number:
  US09/861,680
• Publication Number:
  US 20020008470A1
• Time in Patent Office: 1,743 Days
• Field of Search: 445/54, 445/24, 445/23, 445/25, 445/46, 313/582, 313/586
• US Class Current: 445/51
• CPC Class Codes: C09D 175/04 Polyurethanes
• CPC Class Codes: G03F 7/0007 Filters, e.g. additive colour filters; Components for display devices
• CPC Class Codes: G03F 7/0047 characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/035 the binders being polyurethanes

Abstract

A display member, particularly a plasma display member, can be produced by applying a past which includes a urethane compound and inorganic fine particles onto a substrate and then firing the paste. The display member has a post-firing pattern without any defect.

Claims

1. A paste comprising a urethane compound and inorganic fine particles, wherein the urethane compound is represented by formula (1):

R^1—

(R^4—

R³)_n—

R⁴—

R² 

 

(1)

wherein R¹ and R² are independently selected from the group consisting of a substituent having an ethylenic unsaturated group, a hydrogen atom, a C₁-C₂₀ alkyl group, a C₁-C₂₀ aryl group, a C₁-C₂₀ alkyl group and a C₁-C₂₀ hydroxyaralkyl group;

R³ is an alkylene oxide group or an alkylene oxide oligomer;

R⁴ is an organic group having a urethane bond; and

n is an integer of from 1 to 10.

2. A paste according to claim 1, wherein R³ is an oligomer containing an ethylene oxide unit and a propylene oxide unit and the content of the ethylene oxide unit in the oligomer is in the range of from 8 to 70 wt %.

3. A paste comprising a urethane compound and inorganic fine particles, wherein the paste further comprises an amine compound having an ethylenic unsaturated group.

4. A paste comprising a urethane compound and inorganic fine particles, wherein the inorganic fine particles contain 60 to 97 wt % of low melting glass powder and 3 to 40 wt % of a filler having a mean particle size of from 1 to 4 μ

m.

5. A paste according to claim 4, wherein the inorganic fine particles further contain not more than 30 wt % of oxide fine particles having a mean particle size of from 0.003 to 0.02 μ

m.

6. A paste comprising a urethane compound and inorganic fine particles, wherein, when the paste is heated to 500°

C. and 1,000°

C., the weights of the paste at these temperatures satisfy the following equation;

(weight at 500°

C.)/(weight at 1,000°

C.)≦

1.05.

7. A paste comprising a urethane compound and inorganic fine particles, wherein, when the paste is applied onto a silicon wafer into a thin film and then heated to 500°

C., the maximum value of the average film stress calculated based on the quantity of warping of the silicon wafer caused by shrinkage of the thin film is in the range of from 0.1 to 20 MPa.

8. A paste comprising a urethane compound and inorganic fine particles, wherein the paste is photosensitive.

9. A paste according to claim 8, wherein the concentration of the ethylenic unsaturated bond in the paste is in the range of from 0.2 to 1.0 mol per kg of the paste which is not been irradiated with an active light.

10. A paste comprising a urethane compound and inorganic fine particles, wherein the paste is for use in production of a display.

11. A paste according to claim 10, wherein the display is a plasma display.

12. A paste comprising inorganic fine particles and an organic component, when the paste is heated to 500°

C. and 1,000°

C., the weights of the paste at these temperatures satisfy the following equation;

(weight at 500°

C.)/(weight at 1,000°

C.)≦

1.05.

14. A process for producing a display member, comprising applying the paste according to claim 12 or 13 onto a substrate and then firing the paste.

15. A process for producing a display member according to claim 14, wherein the display is a plasma display.

16. A display member produced by the process according to claim 14.

17. A display using the display member according to claim 16.

18. A display according to claim 17, wherein the display is a plasma display.

13. A paste comprising inorganic fine particles and an organic component, when the paste is applied onto a silicon wafer to form a thin film and then heated to 500°

C., the maximum value of the average film stress calculated based on the quantity of warping of the silicon wafer caused by shrinkage of the thin film being in the range of from 0.1 to 20 MPa.

19. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste.

20. A process for producing a display member according to claim 19, wherein the content of the inorganic fine particles in the paste is in the range of from 40 to 80 wt %.

21. A process for producing a display member according to claim 19, wherein the urethane compound has an ethylenic unsaturated group.

22. A process for producing a display member according to claim 19, wherein the urethane compound has a molecular weight ranging from 15,000 to 50,000.

23. A process for producing a display member according to claim 19, wherein the content of the urethane compound in the paste is in the range of from 0.1 to 20 wt %.

24. A process for producing a display member according to claim 19, wherein the urethane compound contains an ethylene oxide unit.

25. A process for producing a display member according to claim 19, wherein the paste further comprises a polymer having a carboxyl group.

26. A process for producing a display member according to claim 25, wherein the polymer having a carboxyl group has an ethylenic unsaturated group.

27. A process for producing a display member according to claim 19, wherein the inorganic fine particles comprise low melting glass powder having a softening point under load of from 450 to 600°

C.

28. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein the urethane compound is represented by formula (1):

R¹—

(R⁴—

R³)_n—

R⁴—

R² 

 

(1)

wherein R¹ and R² are independently selected from the group consisting of a substituent having an ethylenic unsaturated group, a hydrogen atom, a C₁-C₂₀ alkyl group, a C₁-C₂₀ aryl group, a C₁-C₂₀ aralkyl group and a C₁-C₂₀ hydroxyalkyl group;

R³ is an alkylene oxide group or an alkylene oxide oligomer;

R⁴ is an organic group having a urethane bond; and

n is an integer of from 1 to 10.

29. A process for producing a display member according to claim 28, wherein R³ is an oligomer containing an ethylene oxide unit and a propylene oxide unit and the content of the ethylene oxide unit in the oligomer is in the range of from 8 to 70 wt %.

30. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein the paste further comprises an amine compound having an ethylenic unsaturated group.

31. A process for producing a display member according to claim 30, wherein the amine compound is represented by formula (3) or (4):

R⁵R⁶R⁷N 

 

(3)

R⁵R⁶N-M-NR⁷R⁸ 

 

(4)

wherein R⁵ is a substituent having an ethylenic unsaturated group;

R⁶, R⁷ R⁸ are independently selected from the group consisting of a substituent having an ethylenic unsaturated group, a hydrogen atom, a C₁-C₂₀ alkyl group, a C₁-C₂₀ aryl group, a C₁-C₂₀ aralkyl group and a C₁-C₂₀ hydroxyalkyl group; and

M is a bivalent linkage group.

32. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein the inorganic fine particles contain 60 to 97 wt % of low melting glass powder and 3 to 40 wt % of a filler having a mean particle size of from 1 to 4 μ

m.

33. A process for producing a display member according to claim 32, wherein the inorganic fine particles contain not more than 30 wt % of oxide fine particles having a mean particle size of from 0.003 to 0.02 μ

m.

34. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein, when the paste is heated to 500°

C. and 1,000°

C., the weights of the paste at these temperatures satisfy the following equation;

(weight at 500°

C.)/(weight at 1,000°

C.)≦

1.05.

35. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, when the paste is applied on a silicon wafer to form a thin film and then heated to 500°

C., the maximum value of the average film stress calculated based on the quantity of warping of the silicon wafer caused by shrinkage of the thin film is from 0.1 to 20 MPa.

36. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein the paste is photosensitive.

37. A process for producing a display member according to claim 36, wherein the process comprises applying the paste, patterning the paste by photolithography method and then firing the patterned paste.

38. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein the concentration of the ethylenic unsaturated bond in the paste is in the range of from 0.2 to 1.0 mol per kg of the paste which is not irradiated with an active light.

39. A process for producing a display member, comprising applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste, wherein the display is a plasma display.

40. A display member produced by applying a paste comprising a urethane compound and inorganic fine particles onto a substrate and then firing the applied paste.

41. A display using the display member according to claim 40.

42. A display according to claim 41, wherein the display is a plasma display.