Semiconductor dynamic quantity sensor
First Claim
1. An acceleration sensor comprising:
- a mass mounted on a semiconductor substrate through beams for being displaced in accordance with application of a dynamic quantity, wherein the dynamic quantity is detected on the basis of variation of an electrical characteristic between each of movable electrodes formed integrally with the mass and each of fixed electrodes which is supported at one end thereof by the semiconductor substrate,wherein the mass comprises a plurality of divided masses arranged in series, wherein the plurality of divided masses are connected together through connecting beams, which move independently, for permitting the plurality of divided masses to be displaced so as to approach one another and move away from one another,wherein the displacement of the mass can be detected in two axial directions orthogonal to each other.
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Accused Products
Abstract
In a semiconductor dynamic quantity sensor, a mass serving as a weight portion for detecting application of a dynamic quantity is divided into three masses (301, 302, 303) in series. The masses (301, 302, 303) thus divided are connected to one another by connecting beams (CB1, CB2, CB3, CB4). The masses (301, 302, 303) located at both the end portions are supported through beams (B1, B2, B3, B4) by a semiconductor substrate (1) so as to be allowed to be displaced in the direction orthogonal to the connection direction of the masses. The center mass (302) connected to the masses (301, 302, 303) through the connecting beams (CB1, CB2, CB3, CB4) is allowed to be displaced only in the connecting direction of the masses by the connecting beams (CB1, CB2, CB3, CB4).
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Citations
11 Claims
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1. An acceleration sensor comprising:
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a mass mounted on a semiconductor substrate through beams for being displaced in accordance with application of a dynamic quantity, wherein the dynamic quantity is detected on the basis of variation of an electrical characteristic between each of movable electrodes formed integrally with the mass and each of fixed electrodes which is supported at one end thereof by the semiconductor substrate, wherein the mass comprises a plurality of divided masses arranged in series, wherein the plurality of divided masses are connected together through connecting beams, which move independently, for permitting the plurality of divided masses to be displaced so as to approach one another and move away from one another, wherein the displacement of the mass can be detected in two axial directions orthogonal to each other. - View Dependent Claims (2)
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3. An acceleration sensor comprising:
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a mass mounted on a semiconductor substrate through beams for being displaced in accordance with application of a dynamic quantity, wherein the dynamic quantity is detected on the basis of variation of an electrical characteristic between each of movable electrodes formed integrally with the mass and each of fixed electrodes which is supported at one end thereof by the semiconductor substrate, wherein the mass is comprised of a plurality of divided masses arranged in series, wherein the plurality of divided masses are connected together through connecting beams for permitting the plurality of divided masses to be displaced so as approach to one another and move away from one another, wherein the semiconductor substrate comprises an insulating film and a silicon film formed on the semiconductor substrate, and each of the plurality of divided masses and the movable electrode and the fixed electrode formed integrally with the mass are formed from the silicon film. - View Dependent Claims (4, 5, 6, 7, 8)
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9. An acceleration sensor comprising:
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a mass mounted on a semiconductor substrate through beams for being displaced in accordance with application of a dynamic quantity, wherein the dynamic quantity is detected on the basis of variation of an electrical characteristic between each of movable electrodes formed integrally with the mass and each of fixed electrodes which is supported at one end thereof by the semiconductor substrate, wherein the mass comprises a plurality of divided masses arranged in series, wherein the plurality of divided masses are connected together through connecting beams for permitting the plurality of divided masses to be displaced so as to approach one another and move away from one another; and a cap for covering the plurality of divided masses and the movable and fixed electrodes on the semiconductor substrate is equipped to a formation portion where the plurality of divided masses and the movable and fixed electrodes are formed. - View Dependent Claims (10, 11)
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Specification