High frequency emmitter and detector packaging scheme for 10GB/S transceiver

• US 7,008,120 B2
• Filed: 08/08/2003
• Issued: 03/07/2006
• Est. Priority Date: 03/29/2001
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Crafts, Douglas, Fleischer, Siegfried, Zaborsky, Brett, Alduino, Andrew, Peddada, Rao
• Primary Examiner(s): Song, Sarah
• Application Number:
  US10/638,005
• Publication Number:
  US 20040033031A1
• Time in Patent Office: 942 Days
• Field of Search: 385 88- 94
• US Class Current: 385/89
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4279 Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations

Abstract

An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive.

Claims

1. An apparatus comprising:

a substrate on which a light emitter and a light detector are mounted;

a first optical module adapted to optically couple light received from a first optical cable to the light detector, said first optical module including a first lens to collimate light received from the first optical cable and a second lens optically coupled to the first lens to focus received collimated light onto the light detector, said first optical module including a head portion;

a second optical module adapted to optically couple light produced by the light emitter to a second optical cable, said second optical module including a first lens to collimate light received from the light emitter and a second lens optically coupled to the first lens to direct light into the second optical cable, said second optical module including a head portion;

wherein each of the first and second optical modules comprise a single piece polymer structure;

a standoff fixedly mounted to the substrate, said standoff including two recesses defined therein, each said recess to engage the head portion of a respective optical module wherein at least one gap is formed between the head portion of each optical module and the respective recess, said gap to allow active alignment of an optical module wherein the optical module is positioned within the respective recess such that a maximum amount of light is optically coupled; and

epoxy disposed in said gap for fixedly securing the head portion of an optical module to a respective recess upon completion of said active alignment.

2. The apparatus of claim 1, wherein the recesses are adapted to slidedly engage a head portion of a respective optical module during an assembly operation, each of said head portions being fixedly secured within a respective recess upon completion of the assembly operation.

3. The apparatus of claim 2, wherein each of the first and second optical modules includes a boss extending outward from the head portion of that optical module and wherein a respective hole is defined in a base portion of each of the recesses that is adapted to substantially mate with a respective boss during the assembly operation.

4. The apparatus of claim 3, wherein the boss comprises a frustro-conical shape defining a cone angle, and each hole includes a countersink having an angle substantially matching the cone angle.

5. The apparatus of claim 1, wherein each of the first and second optical modules include a bore adapted to couple to an end portion of the first and second optical cables, respectively.

6. The apparatus of claim 1, wherein the first and second lenses of each of the first and second optical modules are disposed approximately 90 degrees from one another, and each optical module further includes a recess filled with a material having a coefficient of refraction different than a coefficient of refraction of a material from which the optical modules are made and defining a reflection surface such that light received by one of the first and second lenses is redirected toward the other lens.

7. The apparatus of claim 6, wherein each of the first and second optical modules further includes a respective cap that covers the recess to prevent impurities from entering the recess.

8. The apparatus of claim 1, wherein the light emitter comprises a vertical cavity surface emitting laser (VCSEL).

9. The apparatus of claim 1, wherein the first optical module is positioned relative to the light detector such that a maximum amount of light received from the first optical cable is directed toward the light detector.

10. The apparatus of claim 9, wherein the first optical module is positioned relative to the light detector using an active alignment process wherein an alignment between the first optical module and the light detector is adjusted until a maximum signal is detected at the light detector, whereupon the alignment is fixedly secured.

11. The apparatus of claim 1, wherein the second optical module is positioned relative to the light emitter such that a maximum amount of light produced by the light emitter is received by the second optical cable.

12. The apparatus of claim 11, wherein the second optical module is positioned relative to the light emitter using an active alignment process wherein an alignment between the second optical module and the light emitter is adjusted until a maximum signal is detected at the second optical cable, whereupon the alignment is fixedly secured.

13. The apparatus of claim 1, wherein the substrate further includes a plurality of solder bumps to connect to an external component, a portion of which are electrically coupled to the light emitter and light detector.

14. The apparatus of claim 1, wherein the standoff further includes shielding disposed along sidewalls of its two recesses to prevent cross-talk between light signals passing through the head portions of the first and second optical modules.

15. The apparatus of claim 1, further including an amplifier mounted to the substrate that receives a light detection signal output by the light detector, and a power monitor mounted to the substrate that actively controls a power level supplied to the light emitter.

16. The apparatus of claim 1, wherein said epoxy is an ultra-violet (“

UV”

) sensitive adhesive, wherein said UV-sensitive adhesive cures when exposed to ultra-violet light.

17. An apparatus comprising:

a first light coupling means for optically coupling light received from a first optical cable to a light detector having an optical axis oriented approximately 90 degrees relative to an optical axis of the first optical cable, said first light coupling means including a head portion;

a second light coupling means for optically coupling light produced by a light emitter to a second optical cable having an optical axis that is approximately 90 degrees relative to an optical axis of the light emitter, said second light coupling means including a head portion;

wherein each of the first and second light coupling means comprice a single piece polymer structure;

a substrate on which the light emitter and the light detector are mounted;

means for fixedly coupling the first and second light coupling means to the substrate, wherein said means for fixedly coupling the first and second light coupling means includes a pair of recesses to engage the head portions of each respective light coupling means, wherein at least one gap is formed between the head portion of each light coupling means and the respective recess, said gap to allow active alignment of a light coupling means wherein the light coupling means is positioned within the respective recess such that a maximum amount of light is coupled; and

epoxy disposed in said gap for fixedly securing the head portion of a light coupling means to a respective recess upon completion of said active alignment.

18. The apparatus of claim 17, wherein the means for fixedly coupling the first and second light coupling means includes means to substantially align optical features in the first light coupling means to the light detector and substantially align optical features in the second light coupling means to the light emitter.

19. The apparatus of claim 17, wherein the recesses are adapted to slidedly engage the head portions of respective light coupling means.

20. The apparatus of claim 17, wherein each of the first and second light coupling means includes means for coupling to a fiber optic cable.

21. The apparatus of claim 17, wherein the second optical coupling means is positioned relative to the light emitter such that a maximum amount of light produced by the light emitter is received by the second optical cable.

22. The apparatus of claim 17, wherein the second optical coupling means is positioned relative to the light emitter such that a maximum amount of light produced by the light emitter is received by the second optical cable.

23. The apparatus of claim 17, wherein said epoxy is an ultra-violet (“

UV”

) sensitive adhesive, wherein said UV-sensitive adhesive cures when exposed to ultra-violet light.