Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof
First Claim
Patent Images
1. A light emitting diode comprising:
- a substrate;
a first reaction layer formed over the substrate;
an adhesive layer formed over said first reaction layer;
a second reaction layer formed over said adhesive layer;
a reflective layer formed over said second reaction layer; and
an LED stack formed over said reflective layer,wherein each of the first and second reaction layers comprises at least a material selected from the group consisting of SiNx, Ti, and Cr, and is formed to enhance an adhesion provided by the adhesive layer; and
wherein said adhesive layer comprises a material selected from the group consisting of polyimide (P1), benzocyclobutene (BCB), and perfluorocyclobutane (PFCB).
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Abstract
A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
16 Citations
6 Claims
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1. A light emitting diode comprising:
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a substrate; a first reaction layer formed over the substrate; an adhesive layer formed over said first reaction layer; a second reaction layer formed over said adhesive layer; a reflective layer formed over said second reaction layer; and an LED stack formed over said reflective layer, wherein each of the first and second reaction layers comprises at least a material selected from the group consisting of SiNx, Ti, and Cr, and is formed to enhance an adhesion provided by the adhesive layer; and wherein said adhesive layer comprises a material selected from the group consisting of polyimide (P1), benzocyclobutene (BCB), and perfluorocyclobutane (PFCB). - View Dependent Claims (2, 3, 4, 5, 6)
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Specification