Trench MIS device with thick oxide layer in bottom of gate contact trench
First Claim
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1. A trench MIS device formed in a semiconductor substrate and comprising and active region and an inactive region, said active region comprising:
- a first trench containing a first conductive gate material;
a source region in said substrate; and
a body region adjacent a side wall of said trench, said trench being lined with a thin insulating layer adjacent said body region;
said inactive region comprising;
a second trench containing a second conductive material, said second conductive material being in electrical contact with said first conductive material;
a relatively thin insulating layer on a side wall of said second trench;
a relatively thick insulating layer on a bottom of said second trench; and
a gate bus in contact with said second conductive material.
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Abstract
A trench MIS device includes a thick dielectric layer at the bottom of the trench. The thick dielectric layer can be formed by the deposition or thermal growth of a dielectric material, such as silicon dioxide, on the bottom portion of the trench. The thick dielectric layer, which reduces the capacitance between the drain and gate of the device, can be formed in both the active areas of the device, where the switching function is performed, and in the inactive areas where, among other things, contacts are made to the gate electrode.
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Citations
3 Claims
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1. A trench MIS device formed in a semiconductor substrate and comprising and active region and an inactive region, said active region comprising:
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a first trench containing a first conductive gate material; a source region in said substrate; and a body region adjacent a side wall of said trench, said trench being lined with a thin insulating layer adjacent said body region; said inactive region comprising; a second trench containing a second conductive material, said second conductive material being in electrical contact with said first conductive material; a relatively thin insulating layer on a side wall of said second trench; a relatively thick insulating layer on a bottom of said second trench; and a gate bus in contact with said second conductive material. - View Dependent Claims (2, 3)
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Specification