Optical module

• US 7,010,855 B2
• Filed: 01/28/2003
• Issued: 03/14/2006
• Est. Priority Date: 02/20/2001
• Status: Expired due to Fees

• Current Assignee: RPX Corporation
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Case, Steven K., Skunes, Timothy A., Mowry, Gregory S.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US10/352,798
• Publication Number:
  US 20030219210A1
• Time in Patent Office: 1,141 Days
• Field of Search: 298/25, 298/32, 298/40, 295/93, 385/49
• US Class Current: 29/832
• CPC Class Codes: G02B 6/255 Splicing of light guides, e.g. by fusion or bonding
• CPC Class Codes: G02B 6/2553 Splicing machines, e.g. optical fibre fusion splicer
• CPC Class Codes: G02B 6/2555 Alignment or adjustment devices for aligning prior to splicing
• CPC Class Codes: G02B 6/32 having lens focusing means positioned between opposed fibre ends with lens being an integral part of the single fibre end G02B6/262
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/3873 Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
• CPC Class Codes: G02B 6/4207 with optical elements reducing the sensitivity to optical feedback anti-reflection devices specially adapted for lasers, see H01S3/0064
• CPC Class Codes: G02B 6/4221 involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4227 Active alignment methods, e.g. procedures and algorithms
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4236 Fixing or mounting methods of the aligned elements
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 : by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Claims

1. A method of making an optical module for use in an optical device, comprising:

obtaining an optical component;

obtaining a relative reference mount having a registration feature configured for subsequent coupling to a reference base;

aligning the optical component to a prealigned orientation relative to the registration feature; and

fixing the optical component relative to the registration feature of the relative reference mount at the prealigned orientation.

2. The method of claim 1 including obtaining an optical component mount configured to fixedly couple to the optical component.

3. The method of claim 1 wherein fixing uses solder.

4. The method of claim 1 wherein the fixing uses an electrically conductive bonding material.

5. The method of claim 2 wherein the optical component mount comprises first and second plates with the optical element secured therebetween.

6. The method of claim 1 wherein the optical element has an optical characteristic which varies relative to at least one dimension, and wherein the step of aligning includes aligning the optical characteristic with a reference defined relative to a registration feature of the relative reference mount.

7. The method of claim 1 including applying an adhesive to provide the fixing.

8. The method of claim 1 wherein fixing provides a fixed spacial orientation between the optical component and the relative reference mount.

9. The method of claim 8 wherein fixing includes applying a bonding material having a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

10. The method of claim 9 wherein the bonding material is operably coupled to only one of the optical component and the relative reference mount when in a first state.

11. The method of claim 10 wherein the bonding material is activated to fill a gap.

12. The method of claim 11 including applying or removing heat to cause a change in state of the bonding material.

13. The method of claim 11 including applying or removing radiation to cause a change in state of the bonding material.

14. The method of claim 1 wherein the relative reference mount is substantially planar.

15. The method of claim 1 wherein the reference base comprises a substantially planar substrate.

16. The method of claim 1 including forming a bonding material having a first state in which the optical component can move with up to 6 degrees of freedom relative to the relative reference mount prior to the fixing.

17. The method of claim 2 including forming a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.

18. The method of claim 2 wherein the optical component mount includes a registration feature configured to register the optical component.

19. The method of claim 1 including bonding the optical component to optical component mount.

20. The method of claim 1 wherein fixing includes activating a heater element.

21. The method of claim 20 wherein the heater element is carried on at least one of the relative reference mount and the optical component mount.

22. The method of claim 21 including applying electrical conductors on at least one of the relative reference mount and the optical component mount electrically coupled to the heater element.

23. The method of claim 22 including forming contact pads electrically coupled to the electrical conductors.

24. The method of claim 1 including forming a bonding pad on the relative reference mount.

25. The method of claim 1 wherein the relative reference mount comprises silicon.

26. The method of claim 2 wherein the optical component mount comprises silicon.

27. The method of claim 2 wherein the optical component mount includes an interface surface and the optical component is flush with the interface surface.

28. The method of claim 1 wherein the relative reference mount comprises a semiconductor.

29. The method of claim 1 wherein the relative reference mount comprises a ceramic.

30. The method of claim 1 wherein the registration feature is configured to provide substantially kinematic coupling to a fixed reference mount.

31. A method for making an optical module for use in an optical device, comprising:

obtaining an optical component;

obtaining a substantially planar component mount plate coupled to the optical element;

obtaining a substantially planar relative reference mount configured to couple to a substantially planar fixed reference; and

bonding the reference mount to the component mount plate.

32. The method of claim 31 wherein the bonding includes applying a bonding material.

33. The method of claim 31 wherein the optical component has an optical characteristic which varies relative to at least one dimension, and the method further includes aligning the optical characteristic with a reference defined relative to a registration feature of the relative reference mount.

34. The method of claim 32 wherein the bonding material comprises adhesive.

35. The method of claim 32 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.

36. The method of claim 32 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

37. The method of claim 32 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state and prior to the bonding.

38. The method of claim 37 including applying or removing heat to cause a change in state of the bonding material.

39. The method of claim 32 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.

40. The method of claim 32 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.

41. The method of claim 31 wherein the relative reference mount comprises silicon.

42. The method of claim 33 wherein the registration feature is configured to provide substantially kinematic coupling to a fixed reference mount.

43. A method of making an optical device, comprising:

obtaining an optical component;

obtaining an optical component mount configured to fixedly coupled to the optical component;

obtaining a relative reference mount configured to couple to a reference substrate; and

fixing the optical component at a prealigned spacial orientation relative to the relative reference mount.

44. The method of claim 43 including applying bonding material to fix the spacial location.

45. The method of claim 44 wherein the bonding material comprises solder.

46. The method of claim 45 wherein the optical element has an optical characteristic which varies relative to at least one dimension, and the method including aligning the optical characteristic with a reference defined relative to a registration feature of the relative reference mount prior to the step of fixing.

47. The method of claim 46 wherein the registration feature is configured to provide substantially kinematic coupling to a fixed reference mount.

48. The method of claim 45 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

49. The method of claim 44 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state prior to the fixing.

50. The method of claim 49 including activating the bonding material to fix the spacial orientation.

51. The method of claim 50 including applying or removing heat to cause a change in state of the bonding material.

52. The method of claim 43 wherein the relative reference mount is substantially planar.

53. The method of claim 43 including providing a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.

54. The method of claim 51 including providing a heating element carried on at least one of the relative reference mount and the optical component mount.

55. The method of claim 43 wherein the optical component mount comprises silicon.

56. A method of making an optical module for use in an optical device, comprising:

obtaining an optical component;

obtaining a relative reference mount having a registration feature configured to couple to a substrate; and

activating a bonding material to fixedly secure the optical component at an orientation and position relative to the registration feature of the relative reference mount.

57. The method of claim 56 wherein the bonding material comprises solder.

58. The method of claim 56 wherein the optical component has an optical characteristic which varies relative to at least one dimension, and the method including aligning the optical characteristic to a reference defined relative to a registration feature of the relative reference mount.

59. The method of claim 56 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.

60. The method of claim 59 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

61. The method of claim 60 wherein the bonding material is operably coupled to only one of the optical component mount and the relative reference mount when in a first state.

62. The optical module of claim 61 including applying or removing heat to cause a change in state off the bonding material.

63. The method of claim 56 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.

64. The method of claim 56 including obtaining an optical component mount configured to couple the optical component to the relative reference mount.