Adhesive microstructure and method of forming same

• US 7,011,723 B2
• Filed: 01/06/2003
• Issued: 03/14/2006
• Est. Priority Date: 12/20/1999
• Status: Expired due to Fees

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford University), Regents of the University of California (University of California)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford University), Regents of the University of California (University of California)
• Inventors: Autumn, Kellar, Kenny, Thomas W., Full, Robert J., Fearing, Ronald S.
• Primary Examiner(s): Aftergut, Jeff H.
• Application Number:
  US10/338,104
• Publication Number:
  US 20040005454A1
• Time in Patent Office: 1,163 Days
• Field of Search: 156/60, 156/57, 156/160
• US Class Current: 156/60
• CPC Class Codes: C09J 2301/31 the adhesive effect being based on a Gecko structure
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• CPC Class Codes: C09J 7/00 Adhesives in the form of films or foils
• CPC Class Codes: G01N 19/04 Measuring adhesive force between materials, e.g. of sealing tape, of coating
• CPC Class Codes: G01N 2203/0025 Shearing
• CPC Class Codes: G01N 2203/0286 Miniature specimen; Testing on microregions of a specimen
• CPC Class Codes: G01N 2203/0623 using piezoelectric gauges
• CPC Class Codes: G01N 3/24 by applying steady shearing forces G01N3/26, G01N3/28 take precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2973 Particular cross section
• CPC Class Codes: Y10T 428/2976 Longitudinally varying
• CPC Class Codes: Y10T 428/2978 Surface characteristic
• CPC Class Codes: Y10T 428/298 Physical dimension

Abstract

A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Claims

1. A method of establishing an adhesive microstructure, said method comprising the steps of

applying a fabricated artificial seta to a surface with a force perpendicular to said surface;

pulling said seta with a force parallel to said surface so as to preload an adhesive force of said seta.

2. The method of claim 1 wherein said adhesive force is greater than the cumulative force of said applying and pulling steps.

3. The method of claim 1 further comprising the step of eliminating said adhesive force by creating a force to produce a detachment angle between said seta and said surface.

4. The method of claim 3 wherein said eliminating step includes the step of creating a force to produce a detachment angle of between 25°

and 35°

between said seta and said surface.

5. The method of claim 3 wherein said eliminating step includes the step of creating a force to produce a detachment angle of approximately 30°

between said seta and said surface.