Please download the dossier by clicking on the dossier button x
×

Bumped integrated circuits for optical applications

  • US 7,012,282 B1
  • Filed: 11/14/2003
  • Issued: 03/14/2006
  • Est. Priority Date: 05/21/2002
  • Status: Active Grant
First Claim
Patent Images

1. An optical integrated circuit package, comprising:

  • an integrated circuit having a first surface and a second surface, the first surface having a first set of light emitting or sensing devices and a plurality of bond pads;

    a conductive bump formed on each of the respective bond pads; and

    a clear molding material that encapsulates the integrated circuit and a portion of each conductive bump such that each conductive bump is partially exposed through the clear molding material, whereby light can pass through the clear molding material and reach the first set of light emitting or sensing devices.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×