Wafer test apparatus including optical elements and method of using the test apparatus

• US 7,012,440 B2
• Filed: 03/02/2004
• Issued: 03/14/2006
• Est. Priority Date: 08/14/2001
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Feng, Kai Di
• Primary Examiner(s): KARLSEN, ERNEST F
• Application Number:
  US10/791,067
• Publication Number:
  US 20040169519A1
• Time in Patent Office: 742 Days
• Field of Search: 324/763, 324/501, 324/752, 324/765, 324/767, 714/733, 714/734
• US Class Current: 324/762.05
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence
• CPC Class Codes: H04B 10/07 Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
• CPC Class Codes: H04B 10/505 using external modulation

Abstract

Wafer-level testing is performed on an electronic device to be used in an optical communications system. An optical test signal is generated and is provided to a first photo detector. An electrical output of the first photo detector is supplied to the electronic device on the wafer. An electrical output from the electronic device on the wafer is used to drive a light source. An optical output of the light source is supplied to a second photo detector and an electrical signal output from the second photo detector is examined.

Claims

1. A method of testing an electronic device on a wafer comprising:

prior to packaging a first light source with the electronic device, driving a second light source external to the electronic device with an electrical output from the electronic device on the wafer;

supplying an optical output of the second light source to a photo detector; and

examining an electrical signal output from the photo detector.

2. The method of claim 1, wherein the optical output of the second light source is supplied to the photo detector via a variable optical attenuator.

3. A method of testing an electronic device on a wafer, comprising:

generating an optical test signal;

providing the optical test signal to a first photo detector;

supplying an electrical output of the first photo detector to the electronic device on the wafer;

driving a light source with an electrical output from the electronic device on the wafer;

supplying an optical output of the light source to a second photo detector; and

examining an electrical signal output from the second photo detector.

4. The method of claim 3, wherein the optical test signal is provided to the first photo detector via a first variable optical attenuator.

5. The method of claim 4, wherein the optical output of the light source is supplied to the second photo detector via a second variable optical attenuator.

6. The method of claim 3, wherein the optical test signal is generated in accordance with a signal generated by a test controller.

7. The method of claim 6, wherein the generating step includes outputting a constant amplitude optical signal from a laser and modulating the constant amplitude optical signal in accordance with the signal generated by the test controller.