MEMS devices with unreleased thin film components
First Claim
Patent Images
1. A method, comprising:
- fabricating a microelectromechanical systems device comprising a movable component;
inhibiting at least some movement of the movable component with a sacrificial material, so that the microelectromechanical systems device can be transported with at least a reduced risk of damage to the movable component;
transporting said device;
removing the sacrificial material after the miroelectromechanical systems device has been transported; and
packaging the microelectronical systems device.
5 Assignments
0 Petitions
Accused Products
Abstract
In one embodiment, the invention provides a MEMS device. The MEMS device comprises a plurality of functional components including at least one moveable component; and a sacrificial component to at least reduce movement of the moveable component during shipping of the microelectromechanical systems device, wherein the sacrificial component can be removed after shipping.
-
Citations
14 Claims
-
1. A method, comprising:
-
fabricating a microelectromechanical systems device comprising a movable component;
inhibiting at least some movement of the movable component with a sacrificial material, so that the microelectromechanical systems device can be transported with at least a reduced risk of damage to the movable component;
transporting said device;
removing the sacrificial material after the miroelectromechanical systems device has been transported; and
packaging the microelectronical systems device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of packaging an electronic device comprising an interferometric modulator, comprising:
fabricating an interferometric modulator comprising a movable component;
inhibiting movement of the movable component with a sacrificial material;
transporting the interferometric modulator;
removing the sacrificial material after the interferometric modulator has been transported; and
packaging the interferometric modulator into an electronic device.- View Dependent Claims (9, 10, 11, 12, 13, 14)
Specification