Leadframe-based module DC bus design to reduce module inductance

• US 7,012,810 B2
• Filed: 03/27/2002
• Issued: 03/14/2006
• Est. Priority Date: 09/20/2000
• Status: Expired due to Fees

• Current Assignee: Siemens VDO Automotive Corporation (Siemens AG)
• Original Assignee: Ballard Power Systems Corporation (Superior Plus Corporation)
• Inventors: Ahmed, Sayeed, Parkhill, Scott, Flett, Fred
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US10/109,555
• Publication Number:
  US 20020167828A1
• Time in Patent Office: 1,448 Days
• Field of Search: 361/775, 361/784, 257691-692, 257700-704, 257723-724, 439/76.2
• US Class Current: 361/775
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09345 Power and ground in the same plane; Power planes for two voltages in one plane
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49009 Dynamoelectric machine
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Claims

1. A power module, comprising:

a positive conductor bus plate;

a negative conductor bus plate;

one or more materials interposed between the positive conductor bus plate and the negative conductor bus plate, said one or more materials providing at least one dielectric property;

a high side of a substrate operatively connected with the positive conductor bus plate; and

a low side of the substrate operatively connected with the negative conductor bus plate, wherein each of the positive and the negative conductor bus plates is physically positioned overlaying a space located between the high side of the substrate and the low side of the substrate,

wherein a DC device is operatively coupled to the positive conductor bus plate and the negative conductor bus plate, and wherein an AC device is operatively coupled to at least one set of phase terminals of the power module.

2. The power module of claim 1, wherein the substrate comprises:

at least one switch for controlling current flow.

3. The power module of claim 1, wherein the one or more materials providing at least one dielectric property has a dielectric strength of substantially 20 kV/mm or greater.

4. The power module of claim 1, wherein the one or more materials providing at least one dielectric property provides a dielectric isolation from substantially 2 kV to substantially 5 kV.

5. The power module of claim 1, wherein the one or more materials providing at least one dielectric property maintains the at least one dielectric property subsequent to injection molding.

6. The power module of claim 1, wherein the one or more materials providing at least one dielectric property have a thickness ranging from substantially 0.1 mm to substantially 1.0 mm.

7. The power module of claim 1, wherein the one or more materials interposed between a positive conductor bus plate and a negative conductor bus plate comprise:

a piece of a module frame.

8. The power module of claim 2, wherein the at least one switch for controlling current flow comprises:

at least one power transistor.

9. A power system, comprising:

a power module including

an elongated positive conductor bus plate;

an elongated negative conductor bus plate substantially parallel to the positive conductor bus plate;

one or more materials interposed between the positive conductor bus plate and the negative conductor bus plate, the one or more materials providing at least one dielectric property,

a high side of the power module operatively connected with the positive conductor bus plate, and

a low side of the power module operatively connected with the negative conductor bus plate wherein each of the positive and the negative conductor bus plates is physically positioned overlying a gap located between the high side of the substrate and the low side of the substrate;

a DC source operatively coupled to the positive conductor bus plate and the negative conductor bus plate; and

an AC load operatively coupled to at least one set of phase terminals of the power module.

10. The power system of claim 9, wherein the power module comprises:

at least one switch for controlling current flow.

11. The power system of claim 9, wherein the one or more materials providing at least one dielectric property has a dielectric strength of substantially 20 kV/mm or greater.

12. The power system of claim 9, wherein the one or more materials providing at least one dielectric property provides a dielectric isolation from substantially 2 kV to substantially 5 kV.

13. The power system of claim 9, wherein the one or more materials providing at least one dielectric property maintains the at least one dielectric property subsequent to injection molding.

14. The power system of claim 9, wherein the one or more materials substantially maintaining the at least one dielectric property maintains the at least one dielectric property subsequent to being exposed to a temperature of at least approximately 330 degrees centigrade.

15. The power system of claim 9, wherein the one or more materials substantially maintaining the at least one dielectric property maintains the at least one dielectric property subsequent to being exposed to a pressure of at least approximately 50 mega-Pascals.

16. The power system of claim 9, wherein the one or more materials providing at least one dielectric property has a thickness ranging from substantially 0.1 mm to substantially 1.0 mm.

17. The power system of claim 9, wherein the one or more materials providing at least one dielectric property has a thickness of substantially 0.3 mm.

18. The power system of claim 9, wherein the one or more materials providing at least one dielectric property comprise:

at least a plastic material.

19. The power system of claim 9, wherein the one or more materials providing at least one dielectric property comprise:

at least a glass material.

20. The power system of claim 9, wherein the DC source operatively coupled to the positive conductor bus plate and the negative conductor bus plate comprises:

a DC power supply.

21. The power system of claim 9, wherein the AC load operatively coupled to at least one set of phase terminals of the power module comprises:

a motor operatively coupled to the at least one set of phase terminals of the power module.

22. The power system of claim 10, wherein the at least one switch for controlling current flow comprises:

at least one power transistor.

23. The power system of claim 10, wherein the at least one switch is electrically coupled and operated as a power inverter.

24. The power system of claim 21, wherein the motor operatively coupled to the at least one set of phase terminals of the power module comprises:

a 3-phase motor operatively coupled with three sets of phase terminals of the power module.

25. The power system of claim 21, wherein the power system comprises:

the power system operably coupled with a vehicle.